RT4G150-CQG352R

RT4G150-CQG352R
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar

Quantity 199 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Device Package352-QFP (48x48)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case352-BFCQFP Exposed Pad and Tie BarNumber of I/O166Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-CQG352R – RTG4 Field Programmable Gate Array, 151,824 Logic Elements, 352-BFCQFP

The RT4G150-CQG352R is a Microchip RTG4™ flash-based Field Programmable Gate Array (FPGA) supplied in a 352-BFCQFP exposed-pad package with tie bar. It integrates a hardened FPGA fabric with dense logic resources and embedded memory, plus high-performance interfaces suitable for systems that require resistance to radiation-induced configuration upsets.

Targeted for high-reliability and mission-critical applications, this device combines a 151,824‑element logic fabric with DSP blocks and high-speed SerDes/memory interfaces to address demanding use cases in space flight, high-altitude aviation, medical electronics and nuclear power plant control.

Key Features

  • Logic Fabric — 151,824 logic elements (registers) implemented with 4‑input LUTs and fast carry chains; architecture supports fabric operation up to 300 MHz as specified for RTG4 devices.
  • Embedded Memory and DSP — Approximately 5,325 bits of on-chip RAM and embedded multiply‑accumulate blocks for DSP workloads; DSP blocks support operation up to 300 MHz per the RTG4 family specifications.
  • High‑Speed Serial and Memory Interfaces — Integrated SerDes capable of 3.125 Gbps native serial communication and support for DDR2/DDR3/LPDDR memory controllers as described for the RTG4 family.
  • Radiation‑Resistant Architecture — Fabric and registers hardened by design to maintain resistance to radiation‑induced configuration upsets and single‑event upsets (SEUs), suitable for space and other harsh radiation environments.
  • I/O and Connectivity — 166 user I/O pins available for system interface and peripheral connectivity.
  • Power and Thermal — Core supply operating range from 1.14 V to 1.26 V; military grade device with operating temperature range of −55 °C to 125 °C.
  • Package and Mounting — 352‑BFCQFP exposed pad with tie bar; supplier device package listed as 352‑QFP (48×48); surface mount mounting type.
  • Compliance — RoHS compliant.

Typical Applications

  • Space Systems — Radiation‑resistant FPGA fabric and SEU‑hardened registers for satellites and deep‑space instruments across LEO, MEO, GEO and HEO missions.
  • High‑Altitude Aviation — High‑reliability logic and I/O for avionics and flight instrumentation operating in elevated radiation environments.
  • Medical Electronics — Deterministic DSP and interface capability for imaging, monitoring and control systems requiring robust operation.
  • Nuclear Power Control — Hardened configuration and extended temperature range for control and monitoring systems in nuclear plant environments.

Unique Advantages

  • Radiation‑Resistant Design: Hardened registers and architecture reduce susceptibility to configuration upsets and SEUs in radiation‑prone environments.
  • High Logic Density: 151,824 logic elements provide substantial on‑chip logic capacity for complex control, processing and interface tasks.
  • Integrated High‑Speed Interfaces: Native 3.125 Gbps SerDes and DDR2/DDR3/LPDDR controller support streamline high‑bandwidth serial and memory connections.
  • DSP Capability: Embedded multiply‑accumulate blocks and fabric timing up to 300 MHz enable real‑time signal processing and compute tasks.
  • Military Grade and Wide Temperature Range: −55 °C to 125 °C operating range and military grade classification for harsh‑environment deployments.
  • Compact, Surface‑Mount Package: 352‑BFCQFP exposed pad package with tie bar and a 48×48 supplier QFP footprint for board‑level integration.

Why Choose RT4G150-CQG352R?

The RT4G150-CQG352R positions itself as a purpose-built FPGA for mission‑critical systems that require both high logic capacity and resistance to radiation effects. Combining a dense, 151,824‑element fabric with DSP blocks, high‑speed serial links, and memory controller support makes it suitable for demanding signal processing and communications roles in harsh environments.

With military grade classification, a wide −55 °C to 125 °C operating range, and a low core voltage window (1.14–1.26 V), this RTG4 device provides a balance of reliability, performance and integration for programs where long‑term robustness and predictable behavior are essential.

Request a quote or submit an inquiry to receive pricing, availability and technical support information for RT4G150-CQG352R. Our team can provide additional implementation details, packaging options and procurement guidance to support your design needs.

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