RT4G150-CQG352R
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar |
|---|---|
| Quantity | 199 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 352-QFP (48x48) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 352-BFCQFP Exposed Pad and Tie Bar | Number of I/O | 166 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150-CQG352R – RTG4 Field Programmable Gate Array, 151,824 Logic Elements, 352-BFCQFP
The RT4G150-CQG352R is a Microchip RTG4™ flash-based Field Programmable Gate Array (FPGA) supplied in a 352-BFCQFP exposed-pad package with tie bar. It integrates a hardened FPGA fabric with dense logic resources and embedded memory, plus high-performance interfaces suitable for systems that require resistance to radiation-induced configuration upsets.
Targeted for high-reliability and mission-critical applications, this device combines a 151,824‑element logic fabric with DSP blocks and high-speed SerDes/memory interfaces to address demanding use cases in space flight, high-altitude aviation, medical electronics and nuclear power plant control.
Key Features
- Logic Fabric — 151,824 logic elements (registers) implemented with 4‑input LUTs and fast carry chains; architecture supports fabric operation up to 300 MHz as specified for RTG4 devices.
- Embedded Memory and DSP — Approximately 5,325 bits of on-chip RAM and embedded multiply‑accumulate blocks for DSP workloads; DSP blocks support operation up to 300 MHz per the RTG4 family specifications.
- High‑Speed Serial and Memory Interfaces — Integrated SerDes capable of 3.125 Gbps native serial communication and support for DDR2/DDR3/LPDDR memory controllers as described for the RTG4 family.
- Radiation‑Resistant Architecture — Fabric and registers hardened by design to maintain resistance to radiation‑induced configuration upsets and single‑event upsets (SEUs), suitable for space and other harsh radiation environments.
- I/O and Connectivity — 166 user I/O pins available for system interface and peripheral connectivity.
- Power and Thermal — Core supply operating range from 1.14 V to 1.26 V; military grade device with operating temperature range of −55 °C to 125 °C.
- Package and Mounting — 352‑BFCQFP exposed pad with tie bar; supplier device package listed as 352‑QFP (48×48); surface mount mounting type.
- Compliance — RoHS compliant.
Typical Applications
- Space Systems — Radiation‑resistant FPGA fabric and SEU‑hardened registers for satellites and deep‑space instruments across LEO, MEO, GEO and HEO missions.
- High‑Altitude Aviation — High‑reliability logic and I/O for avionics and flight instrumentation operating in elevated radiation environments.
- Medical Electronics — Deterministic DSP and interface capability for imaging, monitoring and control systems requiring robust operation.
- Nuclear Power Control — Hardened configuration and extended temperature range for control and monitoring systems in nuclear plant environments.
Unique Advantages
- Radiation‑Resistant Design: Hardened registers and architecture reduce susceptibility to configuration upsets and SEUs in radiation‑prone environments.
- High Logic Density: 151,824 logic elements provide substantial on‑chip logic capacity for complex control, processing and interface tasks.
- Integrated High‑Speed Interfaces: Native 3.125 Gbps SerDes and DDR2/DDR3/LPDDR controller support streamline high‑bandwidth serial and memory connections.
- DSP Capability: Embedded multiply‑accumulate blocks and fabric timing up to 300 MHz enable real‑time signal processing and compute tasks.
- Military Grade and Wide Temperature Range: −55 °C to 125 °C operating range and military grade classification for harsh‑environment deployments.
- Compact, Surface‑Mount Package: 352‑BFCQFP exposed pad package with tie bar and a 48×48 supplier QFP footprint for board‑level integration.
Why Choose RT4G150-CQG352R?
The RT4G150-CQG352R positions itself as a purpose-built FPGA for mission‑critical systems that require both high logic capacity and resistance to radiation effects. Combining a dense, 151,824‑element fabric with DSP blocks, high‑speed serial links, and memory controller support makes it suitable for demanding signal processing and communications roles in harsh environments.
With military grade classification, a wide −55 °C to 125 °C operating range, and a low core voltage window (1.14–1.26 V), this RTG4 device provides a balance of reliability, performance and integration for programs where long‑term robustness and predictable behavior are essential.
Request a quote or submit an inquiry to receive pricing, availability and technical support information for RT4G150-CQG352R. Our team can provide additional implementation details, packaging options and procurement guidance to support your design needs.

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