RT4G150-CQG352B

RT4G150-CQG352B
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar

Quantity 593 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time38 Weeks
Datasheet

Specifications & Environmental

Device Package352-QFP (48x48)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case352-BFCQFP Exposed Pad and Tie BarNumber of I/O166Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-CQG352B – RTG4™ Field Programmable Gate Array, 151,824 logic elements, 352‑BFCQFP

The RT4G150-CQG352B is a flash-based RTG4™ FPGA from Microchip Technology, integrating hardened FPGA fabric and high-performance interfaces for demanding environments. The device combines 151,824 logic elements with embedded DSP and memory resources and supports high-speed serial and memory interfaces for advanced signal processing and system control.

Designed for applications that require radiation tolerance and wide operating range, this military‑grade, surface‑mount FPGA is offered in a 352‑BFCQFP package (352‑QFP, 48×48) with an exposed pad and tie bar, and is RoHS compliant.

Key Features

  • Logic Capacity — 151,824 logic elements (registers) available for complex digital designs and large‑scale integration.
  • On‑chip Memory & DSP — Approximately 5,325 bits of embedded RAM plus embedded multiply‑accumulate blocks for DSP workloads and signal processing up to 300 MHz.
  • High‑performance Fabric — Each logic element includes a 4‑input LUT (LUT4) with fast carry chains; fabric operates at design frequencies up to 300 MHz as documented.
  • SerDes and Memory Interfaces — Integrated high‑speed serial interfaces (3.125 Gbps native SerDes) and support for DDR2/DDR3/LPDDR memory controllers for high‑throughput IO and external memory access.
  • I/O and Packaging — 166 user I/O pins in a 352‑BFCQFP exposed‑pad package (supplier package: 352‑QFP, 48×48), optimized for surface‑mount assembly.
  • Power & Operating Range — Nominal core supply range 1.14 V to 1.26 V; rated for operating temperatures from −55 °C to +125 °C.
  • System Reliability — Flash‑based configuration with design‑level hardening against radiation‑induced single‑event upsets (SEUs), suitable for radiation‑aware systems.
  • Compliance — RoHS compliant.

Typical Applications

  • Space and Satellite Systems — Radiation‑hardened architecture and SEU‑resistant configuration make this FPGA suited for LEO/MEO/GEO/HEO and deep‑space electronics.
  • High‑Altitude Aviation — Wide temperature range and hardened configuration support avionics and high‑altitude sensor/communication subsystems.
  • Medical Electronics — High logic density and DSP capabilities enable real‑time signal processing for imaging and monitoring equipment in controlled environments.
  • Nuclear and Industrial Control — Military‑grade qualification and robust operating range meet requirements for control logic and safety monitoring in demanding installations.

Unique Advantages

  • Radiation‑aware FPGA Fabric: Fabric hardened by design against SEUs, reducing the need for external mitigation in radiation‑exposed deployments.
  • High Logic Density: 151,824 logic elements provide the capacity to consolidate multiple functions into a single device, simplifying system architecture.
  • Integrated High‑Speed Interfaces: Native 3.125 Gbps SerDes and DDR memory controller support enable high bandwidth connectivity without extensive external logic.
  • DSP‑Ready Resources: Embedded multiply‑accumulate blocks and on‑chip memory enable efficient implementation of signal processing algorithms up to 300 MHz.
  • Wide Temperature and Military Grade: Rated −55 °C to +125 °C and designated as Military grade, supporting operation in extreme environments.
  • Package and Assembly: 352‑BFCQFP exposed pad with tie bar and surface‑mount form factor facilitates thermal management and PCB integration.

Why Choose RT4G150-CQG352B?

The RT4G150-CQG352B positions itself as a high‑capacity, radiation‑aware FPGA for systems that require robust operation across extreme temperature ranges and in radiation‑exposed environments. Its combination of large logic resources, embedded DSP elements, high‑speed SerDes, and memory controller support enables consolidation of complex processing, interface, and control functions into a single device.

This device is well suited for engineering teams building satellite payloads, high‑altitude avionics, medical instrumentation, and industrial control systems that value long‑term robustness, integrated high‑speed I/O, and a compact surface‑mount package backed by Microchip’s RTG4 platform documentation.

Request a quote or submit an inquiry to receive pricing and availability for the RT4G150-CQG352B and to discuss how it can fit into your next design.

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