RT4G150-CGG1657M
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA |
|---|---|
| Quantity | 1,105 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1657-CCGA (42.5x42.5) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1657-BFCCGA | Number of I/O | 720 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150-CGG1657M – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA
The RT4G150-CGG1657M is a flash-based RTG4 FPGA from Microchip designed for high-reliability, radiation-tolerant systems. It combines a hardened fourth-generation FPGA fabric with high-performance SerDes, DSP resources and embedded memory suitable for demanding aerospace, avionics and critical industrial applications.
With 151,824 logic elements, 720 user I/Os, and an operating range from -55 °C to 125 °C, this military-grade device targets designs that require robust operation across extreme environments while offering integration of serial and memory interfaces on a single package.
Key Features
- FPGA Fabric — 151,824 logic elements providing a dense, flash-based logic fabric; each logic element includes a 4-input LUT and fast carry chains.
- On-chip Memory — Total RAM bits: 5325, plus multiple embedded memory options referenced in the RTG4 family documentation.
- DSP and Performance — Embedded multiply-accumulate blocks and DSP resources capable of operation up to 300 MHz as described in the datasheet.
- High-speed SerDes — Native SerDes capability at 3.125 Gbps for high-speed serial interfaces.
- Memory Interfaces — Supported DDR2/DDR3/LPDDR memory controllers for high-bandwidth external memory connectivity (as described for the RTG4 family).
- Package and I/O — 1657-CCGA package (42.5 × 42.5 mm) with 720 I/Os for extensive board-level connectivity.
- Power and Temperature — Core supply range 1.14 V to 1.26 V and qualified for operation from -55 °C to 125 °C.
- Radiation Tolerance and Reliability — Fabric hardened by design against radiation-induced single-event upsets (SEUs), suitable for space flight and other radiation-prone environments as described in the RTG4 datasheet.
- RoHS Compliant — Device is RoHS compliant.
Typical Applications
- Space Systems — Flight electronics for LEO, MEO, GEO, HEO and deep-space missions where radiation tolerance and reliable configuration are required.
- High-Altitude Avionics — Avionics subsystems that need hardened logic, deterministic DSP and high-speed serial links for telemetry and data handling.
- Medical Electronics — Critical medical instrumentation requiring robust operation and long-term reliability in demanding environments.
- Nuclear and Power Plant Controls — Control and monitoring systems that demand components designed for radiation resilience and wide temperature operation.
Unique Advantages
- Radiation-hardened architecture: Hardened registers and fabric design reduce configuration upsets in radiation environments, minimizing on-orbit or field intervention.
- High logical density: 151,824 logic elements enable complex system integration on a single device, reducing board-level BOM and interconnect complexity.
- Integrated high-speed I/O: 720 user I/Os and native 3.125 Gbps SerDes support extensive peripheral and high-bandwidth data links without additional serializers.
- Wide temperature and military grade: Qualified for -55 °C to 125 °C operation and specified as Military grade for demanding environmental tolerances.
- Flexible memory and DSP resources: On-chip RAM (5325 bits) combined with embedded multiply-accumulate blocks enables on-device signal processing up to 300 MHz.
- Clear power envelope: Core supply specified between 1.14 V and 1.26 V for predictable power design and supply planning.
Why Choose RT4G150-CGG1657M?
The RT4G150-CGG1657M positions itself as a robust, high-density FPGA option for mission-critical and radiation-prone applications where reliability and integration matter. Its large logic capacity, extensive I/O, hardened architecture and support for high-speed serial and memory interfaces make it suitable for complex signal processing, control and data-handling subsystems.
Engineers designing for aerospace, avionics, medical or nuclear environments will find a documented device family with detailed datasheet coverage and specifications to support system-level validation and long-term deployment.
Request a quote or submit a purchase inquiry today to evaluate the RT4G150-CGG1657M for your next high-reliability FPGA design.

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