RT4G150-CGG1657M

RT4G150-CGG1657M
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA

Quantity 1,105 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Device Package1657-CCGA (42.5x42.5)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case1657-BFCCGANumber of I/O720Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-CGG1657M – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA

The RT4G150-CGG1657M is a flash-based RTG4 FPGA from Microchip designed for high-reliability, radiation-tolerant systems. It combines a hardened fourth-generation FPGA fabric with high-performance SerDes, DSP resources and embedded memory suitable for demanding aerospace, avionics and critical industrial applications.

With 151,824 logic elements, 720 user I/Os, and an operating range from -55 °C to 125 °C, this military-grade device targets designs that require robust operation across extreme environments while offering integration of serial and memory interfaces on a single package.

Key Features

  • FPGA Fabric — 151,824 logic elements providing a dense, flash-based logic fabric; each logic element includes a 4-input LUT and fast carry chains.
  • On-chip Memory — Total RAM bits: 5325, plus multiple embedded memory options referenced in the RTG4 family documentation.
  • DSP and Performance — Embedded multiply-accumulate blocks and DSP resources capable of operation up to 300 MHz as described in the datasheet.
  • High-speed SerDes — Native SerDes capability at 3.125 Gbps for high-speed serial interfaces.
  • Memory Interfaces — Supported DDR2/DDR3/LPDDR memory controllers for high-bandwidth external memory connectivity (as described for the RTG4 family).
  • Package and I/O — 1657-CCGA package (42.5 × 42.5 mm) with 720 I/Os for extensive board-level connectivity.
  • Power and Temperature — Core supply range 1.14 V to 1.26 V and qualified for operation from -55 °C to 125 °C.
  • Radiation Tolerance and Reliability — Fabric hardened by design against radiation-induced single-event upsets (SEUs), suitable for space flight and other radiation-prone environments as described in the RTG4 datasheet.
  • RoHS Compliant — Device is RoHS compliant.

Typical Applications

  • Space Systems — Flight electronics for LEO, MEO, GEO, HEO and deep-space missions where radiation tolerance and reliable configuration are required.
  • High-Altitude Avionics — Avionics subsystems that need hardened logic, deterministic DSP and high-speed serial links for telemetry and data handling.
  • Medical Electronics — Critical medical instrumentation requiring robust operation and long-term reliability in demanding environments.
  • Nuclear and Power Plant Controls — Control and monitoring systems that demand components designed for radiation resilience and wide temperature operation.

Unique Advantages

  • Radiation-hardened architecture: Hardened registers and fabric design reduce configuration upsets in radiation environments, minimizing on-orbit or field intervention.
  • High logical density: 151,824 logic elements enable complex system integration on a single device, reducing board-level BOM and interconnect complexity.
  • Integrated high-speed I/O: 720 user I/Os and native 3.125 Gbps SerDes support extensive peripheral and high-bandwidth data links without additional serializers.
  • Wide temperature and military grade: Qualified for -55 °C to 125 °C operation and specified as Military grade for demanding environmental tolerances.
  • Flexible memory and DSP resources: On-chip RAM (5325 bits) combined with embedded multiply-accumulate blocks enables on-device signal processing up to 300 MHz.
  • Clear power envelope: Core supply specified between 1.14 V and 1.26 V for predictable power design and supply planning.

Why Choose RT4G150-CGG1657M?

The RT4G150-CGG1657M positions itself as a robust, high-density FPGA option for mission-critical and radiation-prone applications where reliability and integration matter. Its large logic capacity, extensive I/O, hardened architecture and support for high-speed serial and memory interfaces make it suitable for complex signal processing, control and data-handling subsystems.

Engineers designing for aerospace, avionics, medical or nuclear environments will find a documented device family with detailed datasheet coverage and specifications to support system-level validation and long-term deployment.

Request a quote or submit a purchase inquiry today to evaluate the RT4G150-CGG1657M for your next high-reliability FPGA design.

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