RT4G150-CGG1657R
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA |
|---|---|
| Quantity | 1,086 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1657-CCGA (42.5x42.5) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1657-BFCCGA | Number of I/O | 720 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150-CGG1657R – Field Programmable Gate Array (FPGA)
The RT4G150-CGG1657R is a flash-based RTG4™ FPGA optimized for high-reliability, high-performance embedded designs. Its architecture combines a large logic fabric with hardened elements and high-speed interfaces suitable for demanding applications where resistance to radiation-induced configuration upsets and wide temperature operation are required. Typical use cases include spaceflight, high-altitude avionics, medical electronics, and nuclear control systems that require robust, deterministic programmable logic with high I/O density and DSP capability.
Key Features
- High logic density — 151,824 logic elements (cells) providing substantial programmable fabric for complex logic, control and processing functions.
- Embedded memory — Total RAM of 5,325 bits across multiple on-chip memory resources to support register/file and small buffer requirements.
- DSP and math resources — Embedded multiply-accumulate blocks and architecture supporting DSP up to 300 MHz for signal processing tasks.
- Hardened for radiation environments — Fabric and registers are hardened by design against single-event upsets (SEUs) to improve reliability in radiation-prone environments.
- High-speed serial and memory interfaces — Native SerDes support at 3.125 Gbps and DDR2/DDR3/LPDDR memory controller capability for high-throughput links and external memory.
- I/O and packaging — 720 user I/Os in a surface-mount 1657-BFCCGA package (supplier package: 1657-CCGA, 42.5 × 42.5 mm) for dense board-level integration.
- Power and thermal — Core supply range of 1.14 V to 1.26 V with an operating temperature range of −55 °C to 125 °C suitable for military-grade deployments.
Typical Applications
- Space and satellite systems — Radiation-hardened design and SEU-resistant fabric make the device suitable for on-board processing and payload control in space environments.
- High-altitude and aerospace avionics — Wide operating temperature range and high logic/I/O density support flight control, telemetry, and communication interfaces.
- Medical electronics — Hardened registers and deterministic DSP capability enable robust signal processing and control in medical instrumentation.
- Nuclear and industrial control — SEU resistance and military-grade temperature range provide reliability for safety-critical monitoring and control systems.
Unique Advantages
- Substantial programmable capacity: 151,824 logic elements enable complex state machines, control logic and substantive algorithm implementation on a single device.
- Radiation-tolerant architecture: Hardened registers and design measures reduce sensitivity to single-event upsets, helping maintain configuration integrity in harsh environments.
- Integrated high-speed I/O: 720 user I/Os and native 3.125 Gbps SerDes simplify board-level connectivity for high-throughput serial links and external memory interfaces.
- DSP-ready fabric: On-chip multiply-accumulate resources and fabric performance to 300 MHz provide deterministic processing for real-time signal tasks.
- Military-grade environmental range: −55 °C to 125 °C operating temperature and surface-mount 1657-BFCCGA packaging support demanding deployment profiles.
- Compact board footprint: Supplier package 1657-CCGA measures 42.5 × 42.5 mm, enabling dense system integration while preserving large I/O count.
Why Choose RT4G150-CGG1657R?
The RT4G150-CGG1657R combines a high-count logic fabric with radiation-hardened design, dedicated DSP resources, and high-speed serial/memory interfaces to address applications that require robust, reliable programmable logic under extreme conditions. Its military-grade temperature range, large I/O complement and compact CCGA packaging make it well suited for aerospace, high-altitude avionics, medical and nuclear control systems where long-term reliability and deterministic performance matter.
For engineering teams building systems that must tolerate radiation effects while retaining programmable flexibility and high throughput, the RT4G150-CGG1657R offers a focused solution that balances density, interface capability and environmental resilience.
Request a quote or submit a pricing and availability inquiry to evaluate the RT4G150-CGG1657R for your next high-reliability design.

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