RT4G150-CGG1657R

RT4G150-CGG1657R
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA

Quantity 1,086 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Device Package1657-CCGA (42.5x42.5)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case1657-BFCCGANumber of I/O720Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-CGG1657R – Field Programmable Gate Array (FPGA)

The RT4G150-CGG1657R is a flash-based RTG4™ FPGA optimized for high-reliability, high-performance embedded designs. Its architecture combines a large logic fabric with hardened elements and high-speed interfaces suitable for demanding applications where resistance to radiation-induced configuration upsets and wide temperature operation are required. Typical use cases include spaceflight, high-altitude avionics, medical electronics, and nuclear control systems that require robust, deterministic programmable logic with high I/O density and DSP capability.

Key Features

  • High logic density — 151,824 logic elements (cells) providing substantial programmable fabric for complex logic, control and processing functions.
  • Embedded memory — Total RAM of 5,325 bits across multiple on-chip memory resources to support register/file and small buffer requirements.
  • DSP and math resources — Embedded multiply-accumulate blocks and architecture supporting DSP up to 300 MHz for signal processing tasks.
  • Hardened for radiation environments — Fabric and registers are hardened by design against single-event upsets (SEUs) to improve reliability in radiation-prone environments.
  • High-speed serial and memory interfaces — Native SerDes support at 3.125 Gbps and DDR2/DDR3/LPDDR memory controller capability for high-throughput links and external memory.
  • I/O and packaging — 720 user I/Os in a surface-mount 1657-BFCCGA package (supplier package: 1657-CCGA, 42.5 × 42.5 mm) for dense board-level integration.
  • Power and thermal — Core supply range of 1.14 V to 1.26 V with an operating temperature range of −55 °C to 125 °C suitable for military-grade deployments.

Typical Applications

  • Space and satellite systems — Radiation-hardened design and SEU-resistant fabric make the device suitable for on-board processing and payload control in space environments.
  • High-altitude and aerospace avionics — Wide operating temperature range and high logic/I/O density support flight control, telemetry, and communication interfaces.
  • Medical electronics — Hardened registers and deterministic DSP capability enable robust signal processing and control in medical instrumentation.
  • Nuclear and industrial control — SEU resistance and military-grade temperature range provide reliability for safety-critical monitoring and control systems.

Unique Advantages

  • Substantial programmable capacity: 151,824 logic elements enable complex state machines, control logic and substantive algorithm implementation on a single device.
  • Radiation-tolerant architecture: Hardened registers and design measures reduce sensitivity to single-event upsets, helping maintain configuration integrity in harsh environments.
  • Integrated high-speed I/O: 720 user I/Os and native 3.125 Gbps SerDes simplify board-level connectivity for high-throughput serial links and external memory interfaces.
  • DSP-ready fabric: On-chip multiply-accumulate resources and fabric performance to 300 MHz provide deterministic processing for real-time signal tasks.
  • Military-grade environmental range: −55 °C to 125 °C operating temperature and surface-mount 1657-BFCCGA packaging support demanding deployment profiles.
  • Compact board footprint: Supplier package 1657-CCGA measures 42.5 × 42.5 mm, enabling dense system integration while preserving large I/O count.

Why Choose RT4G150-CGG1657R?

The RT4G150-CGG1657R combines a high-count logic fabric with radiation-hardened design, dedicated DSP resources, and high-speed serial/memory interfaces to address applications that require robust, reliable programmable logic under extreme conditions. Its military-grade temperature range, large I/O complement and compact CCGA packaging make it well suited for aerospace, high-altitude avionics, medical and nuclear control systems where long-term reliability and deterministic performance matter.

For engineering teams building systems that must tolerate radiation effects while retaining programmable flexibility and high throughput, the RT4G150-CGG1657R offers a focused solution that balances density, interface capability and environmental resilience.

Request a quote or submit a pricing and availability inquiry to evaluate the RT4G150-CGG1657R for your next high-reliability design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up