RT4G150-CGG1657E

RT4G150-CGG1657E
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA

Quantity 1,528 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time44 Weeks
Datasheet

Specifications & Environmental

Device Package1657-CCGA (42.5x42.5)GradeExtendedOperating Temperature-55°C – 125°C
Package / Case1657-BFCCGANumber of I/O720Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-CGG1657E – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA

The RT4G150-CGG1657E is a flash-based RTG4 FPGA device that integrates fourth-generation FPGA fabric with high-performance serial and memory interfaces. It is engineered for applications that require radiation-resistant configuration and robust on-chip logic and I/O resources.

Built around a fabric of 151,824 logic elements and hardened registers, the device is suitable for demanding environments such as space flight, high-altitude aviation, medical electronics, and nuclear power control where resistance to radiation-induced configuration upsets is required.

Key Features

  • Core Fabric — 151,824 logic elements with LUT4-based logic and fast carry chains; registers hardened by design against radiation-induced single-event upsets (SEUs).
  • Embedded Memory and DSP — 5,325 total RAM bits of embedded memory and dedicated multiply-accumulate blocks for DSP operations; fabric and DSP elements support operation up to 300 MHz as specified for timing-sensitive designs.
  • High-speed Serial and Memory Interfaces — Integrated high-speed serial interfaces (native SerDes at 3.125 Gbps) and support for DDR2/DDR3/LPDDR memory controllers for external memory interfacing.
  • I/O Capacity — 720 user I/O pins to support dense system interfaces and board-level connectivity.
  • Power and Operating Range — Recommended supply voltage range of 1.14 V to 1.26 V; extended operating temperature range from −55 °C to 125 °C for deployment in harsh environments.
  • Package and Mounting — Available in a 1657-BFCCGA package (supplier device package 1657-CCGA, 42.5 × 42.5 mm) optimized for surface-mount assembly.
  • Compliance — RoHS-compliant construction.

Typical Applications

  • Satellite and Space Systems — Radiation-resistant configuration and hardened registers make the device applicable for low-Earth to deep space missions where configuration integrity is critical.
  • Avionics and High-Altitude Platforms — Extended temperature range and SEU-hardening support high-altitude and airborne electronic control and data processing functions.
  • Medical and Nuclear Control Electronics — Designed for environments with elevated radiation concerns, suitable for medical imaging control and nuclear plant instrumentation where reliability under radiation is required.
  • High-speed Data Interfaces — Native 3.125 Gbps SerDes and large I/O count make the device suitable for serial link aggregation, protocol bridging, and high-throughput sensor interfaces.

Unique Advantages

  • Radiation-Resilient Architecture: Registers and configuration are hardened against SEUs to maintain configuration integrity in radiation-prone environments.
  • Large On-chip Logic Capacity: 151,824 logic elements provide substantial programmable resources for complex control, processing, and interfacing tasks.
  • High I/O Density: 720 user I/O pins allow flexible, high-density board-level connectivity for system integration.
  • Integrated High-speed Interfaces: Native SerDes at 3.125 Gbps and DDR2/DDR3/LPDDR memory controller support reduce external interface complexity.
  • Extended Environmental Range: Operating temperature from −55 °C to 125 °C and surface-mount 1657-CCGA packaging support deployment in harsh and mission-critical systems.
  • Compact Supply Requirement: Operates from a nominal supply window of 1.14 V to 1.26 V for consistent power design and regulation.

Why Choose RT4G150-CGG1657E?

The RT4G150-CGG1657E positions itself as a high-capacity, radiation-resistant FPGA option where configuration integrity, large programmable logic, and robust I/O are required. Its combination of hardened logic elements, integrated high-speed SerDes, and memory controller support make it a practical choice for aerospace, avionics, medical, and nuclear applications that demand sustained operation in challenging environments.

Engineers and system designers benefit from a device that couples substantial on-chip logic with dedicated DSP and serial interfaces, packaged for surface-mount assembly and specified across an extended temperature range to address long-term mission and industrial deployment needs.

Request a quote or submit a procurement inquiry to receive pricing, availability, and support information for the RT4G150-CGG1657E FPGA.

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