RT4G150-CGG1657E
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA |
|---|---|
| Quantity | 1,528 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 44 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1657-CCGA (42.5x42.5) | Grade | Extended | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1657-BFCCGA | Number of I/O | 720 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150-CGG1657E – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA
The RT4G150-CGG1657E is a flash-based RTG4 FPGA device that integrates fourth-generation FPGA fabric with high-performance serial and memory interfaces. It is engineered for applications that require radiation-resistant configuration and robust on-chip logic and I/O resources.
Built around a fabric of 151,824 logic elements and hardened registers, the device is suitable for demanding environments such as space flight, high-altitude aviation, medical electronics, and nuclear power control where resistance to radiation-induced configuration upsets is required.
Key Features
- Core Fabric — 151,824 logic elements with LUT4-based logic and fast carry chains; registers hardened by design against radiation-induced single-event upsets (SEUs).
- Embedded Memory and DSP — 5,325 total RAM bits of embedded memory and dedicated multiply-accumulate blocks for DSP operations; fabric and DSP elements support operation up to 300 MHz as specified for timing-sensitive designs.
- High-speed Serial and Memory Interfaces — Integrated high-speed serial interfaces (native SerDes at 3.125 Gbps) and support for DDR2/DDR3/LPDDR memory controllers for external memory interfacing.
- I/O Capacity — 720 user I/O pins to support dense system interfaces and board-level connectivity.
- Power and Operating Range — Recommended supply voltage range of 1.14 V to 1.26 V; extended operating temperature range from −55 °C to 125 °C for deployment in harsh environments.
- Package and Mounting — Available in a 1657-BFCCGA package (supplier device package 1657-CCGA, 42.5 × 42.5 mm) optimized for surface-mount assembly.
- Compliance — RoHS-compliant construction.
Typical Applications
- Satellite and Space Systems — Radiation-resistant configuration and hardened registers make the device applicable for low-Earth to deep space missions where configuration integrity is critical.
- Avionics and High-Altitude Platforms — Extended temperature range and SEU-hardening support high-altitude and airborne electronic control and data processing functions.
- Medical and Nuclear Control Electronics — Designed for environments with elevated radiation concerns, suitable for medical imaging control and nuclear plant instrumentation where reliability under radiation is required.
- High-speed Data Interfaces — Native 3.125 Gbps SerDes and large I/O count make the device suitable for serial link aggregation, protocol bridging, and high-throughput sensor interfaces.
Unique Advantages
- Radiation-Resilient Architecture: Registers and configuration are hardened against SEUs to maintain configuration integrity in radiation-prone environments.
- Large On-chip Logic Capacity: 151,824 logic elements provide substantial programmable resources for complex control, processing, and interfacing tasks.
- High I/O Density: 720 user I/O pins allow flexible, high-density board-level connectivity for system integration.
- Integrated High-speed Interfaces: Native SerDes at 3.125 Gbps and DDR2/DDR3/LPDDR memory controller support reduce external interface complexity.
- Extended Environmental Range: Operating temperature from −55 °C to 125 °C and surface-mount 1657-CCGA packaging support deployment in harsh and mission-critical systems.
- Compact Supply Requirement: Operates from a nominal supply window of 1.14 V to 1.26 V for consistent power design and regulation.
Why Choose RT4G150-CGG1657E?
The RT4G150-CGG1657E positions itself as a high-capacity, radiation-resistant FPGA option where configuration integrity, large programmable logic, and robust I/O are required. Its combination of hardened logic elements, integrated high-speed SerDes, and memory controller support make it a practical choice for aerospace, avionics, medical, and nuclear applications that demand sustained operation in challenging environments.
Engineers and system designers benefit from a device that couples substantial on-chip logic with dedicated DSP and serial interfaces, packaged for surface-mount assembly and specified across an extended temperature range to address long-term mission and industrial deployment needs.
Request a quote or submit a procurement inquiry to receive pricing, availability, and support information for the RT4G150-CGG1657E FPGA.

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