RT4G150-1LGG1657R
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA |
|---|---|
| Quantity | 183 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1657-CLGA (42.5x42.5) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1657-BCLGA | Number of I/O | 720 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150-1LGG1657R – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA
The RT4G150-1LGG1657R is a flash-based RTG4™ FPGA from Microchip Technology designed for high-reliability and radiation-challenged applications. It integrates a hardened FPGA fabric with high-performance interfaces and on-chip DSP resources to address demanding embedded designs in space, aviation, medical, and nuclear environments.
Built for robust operation, the device combines a large logic capacity with hardened registers and deterministic fabric timing to support complex signal processing, protocol handling and control functions where reliability and stability are required across extreme temperatures and voltage ranges.
Key Features
- Core Logic — Approximately 151,824 logic elements (registers) with 4‑input LUTs and fast carry chains; fabric operation documented up to 300 MHz.
- Embedded Memory & DSP — Approximately 5,325 bits of on-chip RAM and embedded multiply-accumulate blocks for DSP workloads up to 300 MHz.
- High-speed Serial and Memory Interfaces — Native SerDes capability at 3.125 Gbps and integrated DDR2/DDR3/LPDDR memory controller support for high-bandwidth system interfaces.
- Radiation‑hardened Architecture — Flash-based configuration and registers hardened against single-event upsets (SEUs); suitable for harsh radiation environments including spaceflight and high-altitude aviation.
- I/O and Packaging — Up to 720 user I/O in a 1657‑BCLGA package; surface-mount mounting in a 1657‑CLGA footprint (42.5 × 42.5 mm).
- Power and Temperature — Operating supply range 1.14 V to 1.26 V and military-grade operating temperature from −55 °C to 125 °C.
- Regulatory — RoHS compliant.
Typical Applications
- Space Systems — On-board processing, payload interfaces and protocol handling where radiation resistance and deterministic logic are required for LEO, MEO, GEO and deep-space missions.
- High‑Altitude Aviation — Avionics signal processing and communications subsystems that demand reliable operation in high‑altitude environments.
- Medical Electronics — Critical medical instrumentation and imaging control functions that require stable, hardened logic and precise DSP resources.
- Nuclear and Power Plant Control — Control and monitoring subsystems for nuclear facilities where radiation tolerance and extended temperature performance are essential.
Unique Advantages
- Highly integrated solution: Combines a large logic fabric, SerDes, DDR memory controllers and DSP blocks to reduce external component count and simplify system architecture.
- Radiation‑tolerant configuration: Flash-based fabric with registers hardened against SEUs minimizes configuration upset risk in radiation-prone deployments.
- Designed for high reliability: Military-grade temperature range (−55 °C to 125 °C) and RoHS compliance support long-term deployment in demanding environments.
- Deterministic processing performance: Fabric and DSP blocks documented for operation up to 300 MHz, enabling predictable timing for real-time signal processing and control.
- Broad I/O capability: Up to 720 user I/O pins in a compact 1657-BCLGA package facilitate dense system interconnects and flexible board-level design.
Why Choose RT4G150-1LGG1657R?
The RT4G150-1LGG1657R delivers a combination of high logic capacity, embedded DSP resources and hardened configuration that targets engineers building systems for space, aviation, medical and nuclear applications. Its flash-based RTG4 architecture and documented radiation tolerance make it appropriate for designs where configuration integrity and reliable operation across extreme conditions are critical.
As a member of Microchip’s RTG4 family, this device provides a production-grade option with extensive on-chip interfaces and a robust thermal and voltage operating window—offering designers a scalable, resilient FPGA solution for long-term, high-reliability programs.
Request a quote or submit a procurement inquiry to obtain pricing, availability and additional technical support for the RT4G150-1LGG1657R.

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