RT4G150-1LGG1657PROTO

RT4G150-1LGG1657PROTO
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA

Quantity 512 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Device Package1657-CLGA (42.5x42.5)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case1657-BCLGANumber of I/O720Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-1LGG1657PROTO – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA

The RT4G150-1LGG1657PROTO is a flash-based RTG4™ FPGA integrating fourth-generation FPGA fabric with high-performance interfaces and hardened design elements for radiation-prone environments. This device combines a large logic resource count with embedded memory, DSP blocks, and high-speed serial capabilities to address demanding embedded and mission-critical systems.

Targets include spaceflight, high-altitude aviation, medical electronics and nuclear control environments where resistance to radiation-induced configuration upsets and single-event upsets (SEUs) is required. The device provides a balance of performance and system-level integration for designs requiring robust logic, DSP and high-speed I/O.

Key Features

  • FPGA Fabric and Logic — 151,824 logic elements (registers/LEs) with each logic element including a 4-input LUT and fast carry chains for synchronized logic up to 300 MHz.
  • Embedded Memory — Total on-chip RAM: 5,325 bits, plus multiple embedded memory options described in the RTG4 family datasheet.
  • DSP Resources — Embedded multiply-accumulate blocks for digital signal processing with timing references up to 300 MHz.
  • High-Speed SerDes — Native SerDes support at 3.125 Gbps for high-speed serial interfaces.
  • Memory Controller Support — System-capable DDR2/DDR3/LPDDR memory controllers for external memory interfacing (as supported by the RTG4 family).
  • I/O Density — Up to 720 user I/O pins to support dense system-level connectivity.
  • Package & Mounting — 1657-BCLGA package; supplier device package 1657-CLGA (42.5 × 42.5 mm); surface-mount mounting type.
  • Power and Operating Range — Core supply voltage range of 1.14 V to 1.26 V with qualified operating temperature range of −55 °C to 125 °C.
  • Radiation Hardening & Reliability — Fabric and registers hardened by design against radiation-induced single-event upsets (SEUs) and configured for resistance to radiation-induced configuration upsets in harsh environments.
  • Grade & Compliance — Military-grade device with RoHS compliance.

Typical Applications

  • Spaceflight Systems — On-board processing and high-speed interface bridging in LEO/MEO/GEO/HEO and deep-space missions where radiation resistance is required.
  • High-Altitude Aviation — Avionics and sensor processing functions that benefit from hardened configuration and deterministic logic timing.
  • Medical Electronics — Signal processing and control subsystems that require reliable operation and DSP acceleration in safety-focused equipment.
  • Nuclear Power Control — Control logic and monitoring functions where design resilience to radiation events and long-term reliability are priorities.

Unique Advantages

  • Radiation-Resistant FPGA Fabric: Hardened registers and design reduce susceptibility to configuration upsets and SEUs, supporting operation in radiation-prone environments.
  • High Logic Capacity: 151,824 logic elements provide extensive logic resources to implement complex control, signal processing and protocol conversion tasks.
  • Integrated High-Speed Interfaces: 3.125 Gbps native SerDes and DDR2/DDR3/LPDDR controller support simplify system-level connectivity for high-bandwidth designs.
  • Wide Temperature and Military Grade: −55 °C to 125 °C operating range and military grading enable deployment in harsh and mission-critical systems.
  • High I/O Count: 720 I/O pins accommodate dense peripheral and interface integration without extensive external glue logic.
  • Surface-Mount BCLGA Package: 1657-BCLGA (42.5 × 42.5 mm) provides a compact, board-level footprint for high-density system designs.

Why Choose RT4G150-1LGG1657PROTO?

The RT4G150-1LGG1657PROTO positions itself as a high-capacity, radiation-hardened FPGA option within the RTG4 family, combining substantial logic resources, DSP capability and high-speed serial interfaces in a military-grade package. It is suited to engineers designing systems that demand robust operation under radiation exposure, wide temperature extremes and high I/O density.

For teams needing scalable FPGA fabric with embedded DSP and memory controller options—backed by a datasheet-level technical foundation—this device delivers a clear specification set for building reliable, mission-focused systems.

If you would like pricing, lead-time information or to request a formal quote for the RT4G150-1LGG1657PROTO, please submit a request to sales or request a quote through your usual procurement channel.

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