RT4G150-CBG1657PROTO
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 720 5325 151824 1657-BCBGA |
|---|---|
| Quantity | 429 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 36 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1657-CBGA (42.5x42.5) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1657-BCBGA | Number of I/O | 720 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150-CBG1657PROTO – RTG4™ FPGA IC, 720 I/O, 151,824 Logic Elements, 1657-BCBGA
The RT4G150-CBG1657PROTO is a flash-based RTG4™ Field Programmable Gate Array designed for applications that demand radiation-tolerant programmable logic and high-performance serial interfaces. It integrates hardened FPGA fabric with embedded DSP resources and memory controllers to support compute- and I/O‑intensive designs in harsh environments.
Targeted market segments include space flight, high-altitude aviation, medical electronics and nuclear control systems — environments where resistance to radiation-induced configuration upsets and robust operation across a wide temperature range are required.
Key Features
- Logic Fabric — 151,824 logic elements with 4-input LUT architecture and fast carry chains, enabling complex logic implementations.
- Embedded Memory — Total on-chip RAM: 5,325 bits, providing fabric-local storage for control and buffering functions.
- DSP and Processing — Embedded multiply‑accumulate resources and DSP capabilities documented to support operation up to 300 MHz for signal-processing tasks.
- High-Speed Serial Interfaces — Native SerDes capability at 3.125 Gbps for high-throughput serial links and board-level connectivity.
- I/O and Package — 720 user I/O pins in a 1657-BCBGA package; supplier device package: 1657-CBGA (42.5 × 42.5 mm), surface-mount mounting.
- Power — Core supply range of 1.14 V to 1.26 V for integration with modern low-voltage systems.
- Temperature and Grade — Military grade with an operating temperature range of −55 °C to 125 °C, suited for extreme environments.
- Radiation Hardening — Fabric and registers hardened by design against radiation-induced single-event upsets (SEUs), with resistance to configuration upsets in harsh radiation environments.
- Standards and Compliance — RoHS compliant for environmental regulatory requirements.
Typical Applications
- Space Flight Systems — Radiation-tolerant programmable logic for satellite payloads and spacecraft electronics where SEU resistance and high logic density matter.
- High-Altitude Aviation — Avionics and instrumentation that require wide temperature range operation and reliable serial communications.
- Medical Electronics — Critical-control and signal-processing functions in medical equipment that benefit from hardened logic and DSP resources.
- Nuclear Power Plant Control — Control and monitoring subsystems needing reliable operation in radiation-prone environments and extended temperature ranges.
Unique Advantages
- High Logic Density: 151,824 logic elements provide substantial on-chip resources for complex, integrated FPGA designs.
- Radiation-Resilient Architecture: Registers and configuration memory are hardened against SEUs, reducing susceptibility to radiation-induced upsets.
- Integrated High-Speed I/O: 720 user I/O and native 3.125 Gbps SerDes simplify high-throughput interface design without adding external serializers.
- Designed for Extreme Environments: Military-grade qualification and an operating range of −55 °C to 125 °C support deployment where temperature and reliability are critical.
- Compact, Surface-Mount Package: 1657-CBGA (42.5 × 42.5 mm) package delivers high I/O count in a board-friendly surface-mount form factor.
- Low-Voltage Core: Core supply between 1.14 V and 1.26 V enables compatibility with modern low-voltage power domains.
Why Choose RT4G150-CBG1657PROTO?
This RTG4™ FPGA variant combines a high logic element count with radiation-hardened design and integrated high-speed interfaces to meet the needs of safety- and reliability-focused systems. It is tailored for engineers designing for space, aviation, medical and nuclear environments who require a programmable, durable platform with embedded DSP and SerDes capability.
The combination of military-grade temperature range, RoHS compliance, and a dense 1657-CBGA footprint provides a balance of performance and practical integration for long-life, ruggedized applications where supply voltage, I/O capacity and radiation tolerance are defining requirements.
Request a quote or submit a pricing inquiry to receive product availability, lead-time and ordering information for RT4G150-CBG1657PROTO.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D