RT4G150-1LGG1657M
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA |
|---|---|
| Quantity | 685 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1657-CLGA (42.5x42.5) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1657-BCLGA | Number of I/O | 720 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150-1LGG1657M – RTG4™ Flash-based FPGA, 151,824 logic elements, 1657‑BCLGA
The RT4G150-1LGG1657M is a flash‑based RTG4™ field programmable gate array from Microchip Technology designed for deployment in radiation‑challenging and mission‑critical systems. It integrates a hardened FPGA fabric with high‑performance interfaces and on‑chip DSP and memory resources to support control, processing and high‑speed serial communication functions.
Typical use cases include space flight, high‑altitude aviation, medical electronics and nuclear power plant control where radiation‑resistant configuration and extended temperature operation are required. The device combines a large logic capacity, multi‑Gbps SerDes and memory controller support with a military grade package and operating range.
Key Features
- Logic Capacity — 151,824 logic elements / cells providing substantial on‑chip programmable resources for complex FPGA designs.
- Radiation‑Hardened Fabric — Registers and fabric hardened by design against single‑event upsets (SEUs), suitable for radiation‑challenging environments referenced in the RTG4 datasheet.
- 4‑input LUTs and Fast Carry Chains — Each logic element includes a 4‑input LookUp Table (LUT4) and fast carry chains to support high‑performance logic up to 300 MHz as documented.
- Embedded DSP and Memory — Integrated multiply‑accumulate (math) blocks and multiple embedded memory options; approximately 5,325 bits of on‑chip RAM are available per the part specification.
- High‑Speed Serial Interfaces — Native SerDes capable of 3.125 Gbps for high‑speed serial links; on‑chip DDR2/DDR3/LPDDR memory controller support for external memory interfaces.
- I/O and Package — 720 user I/Os in a 1657‑BCLGA (1657‑CLGA, 42.5 × 42.5 mm) surface‑mount package for dense I/O connectivity in board designs.
- Power and Temperature — Core supply range 1.14 V to 1.26 V; military grade with an operating temperature range from −55 °C to 125 °C.
- Compliance — RoHS‑compliant manufacturing status.
Typical Applications
- Spacecraft and Satellite Systems — Radiation‑hardened FPGA fabric and SEU‑hardened registers make this device suitable for payload processing, telemetry and bus control in space flight environments.
- High‑Altitude and Aviation Electronics — High‑reliability logic, extended temperature range and robust I/O support flight‑critical processing and communication subsystems.
- Medical Electronics — Deterministic logic and embedded DSP enable signal processing and control functions in medical instruments that require resilience to environmental disturbances.
- Nuclear and Industrial Control — Hardened configuration plus high logic capacity and deterministic performance support control and monitoring systems in nuclear and other harsh industrial environments.
Unique Advantages
- Radiation‑Resilient Architecture: Fabric and registers hardened against SEUs to maintain configuration integrity in radiation‑exposed deployments.
- High Logic Density: 151,824 logic elements enable integration of complex control, processing and protocol functions on a single device, reducing system BOM and board area.
- Integrated High‑Speed Interfaces: Native 3.125 Gbps SerDes and DDR memory controller support simplify system integration for high‑bandwidth data paths.
- Deterministic Performance: LUT4 logic and fast carry chains targeted to operate up to 300 MHz for predictable timing in real‑time applications.
- Military‑Grade Robustness: Surface‑mount 1657‑BCLGA package, wide core voltage range and −55 °C to 125 °C operating temperature accommodate demanding environmental requirements.
- Regulatory and Sourcing Confidence: RoHS compliance and Microchip’s RTG4 family documentation and device status information support long‑term procurement and qualification.
Why Choose RT4G150-1LGG1657M?
The RT4G150-1LGG1657M positions itself as a high‑capacity, radiation‑resilient FPGA for systems that require reliable operation in hostile environments. With 151,824 logic elements, hardened registers, embedded DSP and memory resources, and high‑speed SerDes and memory controller support, the device enables consolidation of complex processing, control and high‑bandwidth I/O on a single chip.
This combination of integration, documented SEU mitigation and a military operating temperature range makes the RT4G150‑1LGG1657M a compelling choice for engineers designing avionics, space, medical and nuclear control systems that demand deterministic performance and environmental robustness.
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