RT4G150-1CQG352R

The RT4G150-1CQG352R is a Microchip RTG4™ FPGA featuring fourth‑generation flash‑based FPGA fabric with integrated high‑performance interfaces. The device combines a large logic array with embedded memory and DSP resources, and is designed for use in radiation‑challenging environments where configuration robustness is required.

With 151,824 logic elements, 5,325 total RAM bits and 166 user I/O, this surface‑mount, military‑grade FPGA in a 352‑BFCQFP exposed‑pad package targets aerospace, avionics, medical electronics and other applications that require high integration, deterministic performance (fabric and DSP operation up to 300 MHz) and resistance to radiation‑induced upsets.

Key Features

• Core Fabric: Fourth‑generation flash‑based FPGA fabric; each logic element includes a 4‑input LUT4 with fast carry chains enabling fabric operation up to 300 MHz.
• Logic Capacity: 151,824 logic elements for large, complex designs and high register density.
• Embedded Memory & DSP: 5,325 total RAM bits and embedded multiply‑accumulate blocks for DSP workloads with timing reported up to 300 MHz.
• High‑Speed Serial & Memory Interfaces: Native SerDes supporting 3.125 Gbps and support for DDR2/DDR3/LPDDR memory controllers for high‑bandwidth external memory interfacing.
• Radiation Resistance: Fabric and registers hardened by design against radiation‑induced single‑event upsets (SEUs), suitable for harsh radiation environments cited in the device specification.
• I/O and Package: 166 user I/O; supplier device package 352‑QFP (48×48) / package case 352‑BFCQFP with exposed pad and tie bar; surface‑mount mounting.
• Power and Temperature: Recommended supply voltage range 1.14 V to 1.26 V; operating temperature −55 °C to 125 °C; Grade: Military.
• Compliance: RoHS compliant.

Typical Applications

• Space flight systems: Onboard processing and interface bridging in LEO, MEO, GEO, HEO and deep‑space platforms where radiation‑resistant configuration is required.
• High‑altitude aviation: Flight electronics and data handling in environments with elevated radiation exposure and wide temperature ranges.
• Medical electronics: Processing and control tasks in medical systems that require robust operation and design longevity.
• Nuclear power plant control: Control, monitoring and signal processing applications where radiation tolerance and reliable operation are important.

Unique Advantages

• Radiation‑hardened architecture: Registers and configuration storage hardened against SEUs, reducing the need for external mitigation in radiation‑exposed deployments.
• High logic density: 151,824 logic elements provide headroom for complex control, signal processing and interface functions within a single device.
• Integrated high‑speed interfaces: Native 3.125 Gbps SerDes and DDR2/DDR3/LPDDR memory controller support simplify board‑level design for high‑bandwidth applications.
• Wide operating range: Military grade operation from −55 °C to 125 °C and a tightly specified core voltage range (1.14 V–1.26 V) for designs targeting harsh environments.
• Packaged for system integration: 352‑BFCQFP exposed pad with tie bar and surface‑mount form factor suitable for space and defense assembly processes.
• Standards compliance: RoHS compliant to support environmental and supply‑chain requirements.

Why Choose RT4G150-1CQG352R?

The RT4G150-1CQG352R positions itself as a highly integrated, radiation‑resistant FPGA option for aerospace, avionics, defense and other mission‑critical systems. It combines a large logic fabric, embedded memory and DSP resources, and high‑speed serial and memory interfaces in a military‑grade package engineered for −55 °C to 125 °C operation.

Design teams seeking deterministic performance, reduced system complexity and enhanced resilience to radiation effects will find this RTG4 device suited to demanding applications where long‑term robustness and integration density are priorities.

Request a quote or contact sales to discuss pricing, availability and integration support for the RT4G150-1CQG352R.