RT4G150-1CQG352PROTO

RT4G150-1CQG352PROTO
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 166 5325 151824 352-BFCQFP Exposed Pad and Tie Bar

Quantity 1,715 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time36 Weeks
Datasheet

Specifications & Environmental

Device Package352-QFP (48x48)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case352-BFCQFP Exposed Pad and Tie BarNumber of I/O166Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-1CQG352PROTO – RTG4™ Field Programmable Gate Array (FPGA) IC 166 5325 151824 352-BFCQFP Exposed Pad and Tie Bar

The RT4G150-1CQG352PROTO is a flash-based RTG4 FPGA from Microchip Technology designed for deployment in radiation-prone and mission-critical systems. It combines a hardened FPGA fabric with high-performance interfaces to support applications that require resilient logic, embedded memory, and fast serial connectivity.

Key architecture highlights include 151,824 logic elements, approximately 5,325 bits of embedded RAM, up to 166 user I/Os, and fabrication hardened against radiation-induced single-event upsets (SEUs). The device is supplied in a 352-BFCQFP exposed pad and tie bar package and is rated for military temperature ranges.

Key Features

  • Core Logic — 151,824 logic elements providing dense programmable resources for control, processing and glue-logic functions.
  • Hardened Fabric — FPGA fabric and registers hardened by design against radiation-induced single-event upsets (SEUs), suitable for harsh radiation environments cited in the RTG4 documentation.
  • Logic Architecture — Each logic element includes a 4-input LookUp Table (LUT4) with fast carry chains; fabric and DSP blocks operate up to 300 MHz per datasheet timing guidance.
  • Embedded Memory & DSP — Approximately 5,325 bits of embedded RAM and embedded multiply-accumulate blocks for DSP workloads up to 300 MHz.
  • High-Speed Interfaces — Native SerDes support at 3.125 Gbps and integrated DDR2/DDR3/LPDDR memory controller capability as described in the RTG4 family documentation.
  • I/O and Packaging — 166 user I/Os in a surface-mount 352-BFCQFP (supplier package 352-QFP, 48 × 48 mm) with exposed pad and tie bar for thermal and mechanical performance.
  • Power & Voltage — Operates from a core supply range of 1.14 V to 1.26 V.
  • Environmental & Reliability — Military grade device with operating temperature range −55 °C to 125 °C and RoHS compliance.

Typical Applications

  • Space Systems — Radiation-hardened FPGA fabric and SEU-resistant registers make this device appropriate for LEO, MEO, GEO, HEO and deep-space payload and subsystem designs described in the RTG4 family documentation.
  • High-Altitude Avionics — Suitable for flight electronics operating in radiation-prone, high-altitude environments where resilient logic and deterministic performance are required.
  • Medical Electronics — Use in medical instruments and control systems that demand radiation-tolerant programmable logic and reliable high-speed interfaces.
  • Nuclear and Industrial Control — FPGA-based control, monitoring and signal processing in nuclear power plant control and other environments cited for RTG4 radiation resistance.

Unique Advantages

  • Radiation-Resilient Architecture: Hardened registers and fabric reduce susceptibility to radiation-induced configuration upsets, supporting deployment in harsh radiation environments.
  • High Logic Density: 151,824 logic elements provide substantial programmable resources for complex control, processing and DSP tasks.
  • Deterministic Performance: LUT4-based logic and fast carry chains with fabric and DSP operation guidance up to 300 MHz deliver predictable timing for system designers.
  • Integrated High-Speed I/O: Native 3.125 Gbps SerDes and supported DDR memory controllers enable high-throughput communications and external memory interfacing.
  • Rugged Temperature Range: −55 °C to 125 °C operating range and military grade classification address demanding environmental requirements.
  • Compact, Thermally-Considered Package: 352-BFCQFP exposed pad and tie bar (352-QFP, 48 × 48 mm) surface-mount package for thermal and assembly considerations.

Why Choose RT4G150-1CQG352PROTO?

The RT4G150-1CQG352PROTO occupies a position for designs that require a combination of high logic density, radiation tolerance, and high-speed serial and memory interfaces. Backed by Microchip Technology's RTG4 family documentation, the device is aimed at engineers building resilient systems for space, avionics, medical, and nuclear applications where SEU-resistant operation and deterministic performance matter.

With a broad set of on-chip resources, a defined core voltage range, and military temperature qualification, this RTG4 device delivers a scalable platform for mission-critical projects that demand long-term robustness and clear technical guidance from the vendor’s datasheet.

Request a quote or submit a procurement inquiry to receive pricing, availability and additional technical details for RT4G150-1CQG352PROTO.

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