RT4G150-1CGG1657V

The RT4G150-1CGG1657V is a flash-based RTG4 FPGA integrating Microchip’s fourth-generation FPGA fabric with high-performance interfaces and hardened configuration for radiation-prone environments. The device offers a large programmable fabric with 151,824 logic elements (registers), on-chip embedded memory, DSP resources and native SerDes, making it suitable for designs requiring a combination of logic density, signal-processing capability and interface performance.

Designed for demanding markets such as space flight, high-altitude aviation, medical electronics and nuclear power control, the RT4G150-1CGG1657V emphasizes radiation resistance, deterministic performance up to 300 MHz for logic and DSP functions, and reliable operation across a wide military temperature range.

Key Features

• FPGA Fabric — Up to 151,824 logic elements (registers) with 4-input LUTs and fast carry chains supporting fabric operation up to 300 MHz as documented in the RTG4 family datasheet.
• Embedded Memory & DSP — Approximately 5,325 bits of embedded RAM and embedded multiply-accumulate blocks for DSP workloads; math and DSP timing characterized for up to 300 MHz operation.
• High-speed Serial Interfaces — Integrated SerDes with native 3.125 Gbps serial capability for high-speed link implementations and deterministic serial communication.
• Memory Controllers — On-chip support for double data rate memory controllers (DDR2/DDR3/LPDDR) as part of the RTG4 device capabilities.
• Radiation Hardening — Registers and configuration hardened by design against radiation-induced single-event upsets (SEUs), targeting use in harsh radiation environments such as space and high-altitude platforms.
• Robust Operating Range — Military-grade device grade with operating temperature from −55 °C to 125 °C and power-supply range 1.14 V to 1.26 V.
• Package & I/O — Surface-mount 1657-BFCCGA package (supplier package 1657-CCGA, 42.5 × 42.5 mm) with up to 720 user I/O pins for dense system integration.
• Compliance — RoHS compliant to meet environmental requirements.

Typical Applications

• Space Systems — Radiation-hardened registers and configuration make this FPGA suitable for low-Earth to deep-space flight electronics requiring robust on-orbit operation.
• High-Altitude Aviation — Deterministic logic and hardened configuration help maintain functionality in high-altitude avionics and airborne instrumentation.
• Medical Electronics — High-performance DSP and reliable operation across extended temperatures support critical medical processing and control applications.
• Nuclear Power Plant Control — Radiation-tolerant architecture and military-grade temperature range support control and monitoring systems in radiation-exposed facilities.

Unique Advantages

• High Logic Density: 151,824 logic elements provide substantial on-chip programmable resources for complex, compute-intensive designs.
• Radiation-Resistant Configuration: Fabric registers hardened against SEUs increase reliability in radiation environments, reducing mitigation overhead.
• Integrated High-Speed I/O: Native 3.125 Gbps SerDes and up to 720 I/O pins enable high-bandwidth interfaces and flexible system connectivity.
• Designed for Harsh Environments: Military-grade temperature range (−55 °C to 125 °C) and RoHS compliance ensure long-term deployment in demanding conditions.
• Compact, High-Pin Package: 1657-CCGA package (42.5 × 42.5 mm) delivers high I/O count in a surface-mount form factor for dense board layouts.

Why Choose RT4G150-1CGG1657V?

The RT4G150-1CGG1657V positions itself as a high-density, radiation-hardened FPGA tailored for mission-critical applications that demand both logic capacity and reliable operation in harsh environments. Its combination of a large register count, embedded memory and DSP blocks, native SerDes, and military-grade temperature range makes it well suited for aerospace, defense and other applications where radiation tolerance and deterministic performance are required.

For design teams focused on long-term robustness and integration, this RTG4 device delivers a scalable programmable platform with a documented datasheet detailing fabric, I/O, SerDes and power characteristics to support system-level qualification and deployment.

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