RT4G150-1CGG1657R

RT4G150-1CGG1657R
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA

Quantity 1,777 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Device Package1657-CCGA (42.5x42.5)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case1657-BFCCGANumber of I/O720Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-1CGG1657R – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA

The RT4G150-1CGG1657R is a fourth-generation, flash-based RTG4 FPGA from Microchip Technology designed for deployment in radiation-prone and military-grade environments. It combines hardened FPGA fabric with high-performance interfaces to address applications that require robust on-chip logic, deterministic DSP processing and high-speed serial and memory interfaces.

Key device characteristics include 151,824 logic elements, up to 720 user I/O pins, on-chip embedded memory, native SerDes and support for DDR2/DDR3/LPDDR memory controllers, all available in a 1657-BFCCGA surface-mount package rated for –55 °C to 125 °C and a 1.14 V to 1.26 V supply.

Key Features

  • Flash-based RTG4 FPGA fabric — Fourth-generation Microchip flash-based architecture with logic elements hardened by design against radiation-induced single-event upsets (SEUs).
  • High logic capacity — 151,824 logic elements (registers/logic cells) for complex, high-density designs.
  • On-chip memory and DSP — Multiple embedded memory options with a total of 5,325 RAM bits and embedded multiply-accumulate blocks to support DSP workloads up to 300 MHz.
  • High-speed serial and memory interfaces — Native SerDes supporting 3.125 Gbps serial links and built-in DDR2/DDR3/LPDDR memory controller capability.
  • Generous I/O — Up to 720 user I/O pins to connect dense peripheral, sensor, or data-path interfaces.
  • Robust electrical and thermal envelope — Supply voltage range of 1.14 V to 1.26 V and operating temperature range from –55 °C to 125 °C; surface-mount package.
  • Package — 1657-BFCCGA (supplier package 1657-CCGA, 42.5 × 42.5 mm) for high-pin-count, board-level integration.
  • Regulatory status — RoHS compliant and listed as a production device in the RTG4 device status.

Typical Applications

  • Spaceflight and satellite systems — Radiation-resistant FPGA fabric and hardened registers make the device suitable for on-board processing and control in LEO, MEO, GEO, HEO and deep-space missions.
  • High-altitude aviation — Military-grade temperature range and SEU-resistant configuration are suitable for avionics and high-altitude sensor processing.
  • Medical electronics — Deterministic DSP blocks and high I/O density support real-time signal processing in medical instrumentation.
  • Nuclear and industrial control — Radiation-tolerant architecture and robust thermal range address control systems operating in high-radiation or harsh environments.
  • High-speed communication endpoints — Built-in SerDes and memory controller support for high-speed serial links and external memory interfaces.

Unique Advantages

  • Radiation-hardened by design — Architecture and hardened registers reduce the risk of radiation-induced configuration upsets in hostile environments.
  • Large, deterministic logic fabric — 151,824 logic elements enable complex control, signal processing and protocol implementations on a single device.
  • Integrated high-speed interfaces — Native 3.125 Gbps SerDes plus DDR2/DDR3/LPDDR memory controller options minimize external component count and simplify board design.
  • Wide operating range — Military-grade temperature rating (–55 °C to 125 °C) and a narrow, defined supply range (1.14 V to 1.26 V) for predictable behavior in demanding deployments.
  • High I/O density — Up to 720 I/Os for flexible system partitioning and rich peripheral connectivity.
  • Production-ready device — RTG4 RT4G150 family devices are listed as production devices in the datasheet device status.

Why Choose RT4G150-1CGG1657R?

The RT4G150-1CGG1657R delivers a combination of radiation-resistant, flash-based FPGA fabric and high-performance interfaces tailored for military and other harsh-environment applications. Its large logic capacity, dedicated DSP resources and high-speed SerDes/memory interfaces let designers consolidate functions onto a single, rugged device—reducing system complexity and board-level component count.

Backed by the RTG4 family documentation from Microchip, this device is suited for engineers building mission-critical systems that require deterministic performance, robust thermal behavior and resistance to radiation-induced configuration upsets.

Request a quote or submit an inquiry to evaluate RT4G150-1CGG1657R for your next design or program.

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