RT4G150-1CGG1657R
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA |
|---|---|
| Quantity | 1,777 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1657-CCGA (42.5x42.5) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1657-BFCCGA | Number of I/O | 720 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150-1CGG1657R – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA
The RT4G150-1CGG1657R is a fourth-generation, flash-based RTG4 FPGA from Microchip Technology designed for deployment in radiation-prone and military-grade environments. It combines hardened FPGA fabric with high-performance interfaces to address applications that require robust on-chip logic, deterministic DSP processing and high-speed serial and memory interfaces.
Key device characteristics include 151,824 logic elements, up to 720 user I/O pins, on-chip embedded memory, native SerDes and support for DDR2/DDR3/LPDDR memory controllers, all available in a 1657-BFCCGA surface-mount package rated for –55 °C to 125 °C and a 1.14 V to 1.26 V supply.
Key Features
- Flash-based RTG4 FPGA fabric — Fourth-generation Microchip flash-based architecture with logic elements hardened by design against radiation-induced single-event upsets (SEUs).
- High logic capacity — 151,824 logic elements (registers/logic cells) for complex, high-density designs.
- On-chip memory and DSP — Multiple embedded memory options with a total of 5,325 RAM bits and embedded multiply-accumulate blocks to support DSP workloads up to 300 MHz.
- High-speed serial and memory interfaces — Native SerDes supporting 3.125 Gbps serial links and built-in DDR2/DDR3/LPDDR memory controller capability.
- Generous I/O — Up to 720 user I/O pins to connect dense peripheral, sensor, or data-path interfaces.
- Robust electrical and thermal envelope — Supply voltage range of 1.14 V to 1.26 V and operating temperature range from –55 °C to 125 °C; surface-mount package.
- Package — 1657-BFCCGA (supplier package 1657-CCGA, 42.5 × 42.5 mm) for high-pin-count, board-level integration.
- Regulatory status — RoHS compliant and listed as a production device in the RTG4 device status.
Typical Applications
- Spaceflight and satellite systems — Radiation-resistant FPGA fabric and hardened registers make the device suitable for on-board processing and control in LEO, MEO, GEO, HEO and deep-space missions.
- High-altitude aviation — Military-grade temperature range and SEU-resistant configuration are suitable for avionics and high-altitude sensor processing.
- Medical electronics — Deterministic DSP blocks and high I/O density support real-time signal processing in medical instrumentation.
- Nuclear and industrial control — Radiation-tolerant architecture and robust thermal range address control systems operating in high-radiation or harsh environments.
- High-speed communication endpoints — Built-in SerDes and memory controller support for high-speed serial links and external memory interfaces.
Unique Advantages
- Radiation-hardened by design — Architecture and hardened registers reduce the risk of radiation-induced configuration upsets in hostile environments.
- Large, deterministic logic fabric — 151,824 logic elements enable complex control, signal processing and protocol implementations on a single device.
- Integrated high-speed interfaces — Native 3.125 Gbps SerDes plus DDR2/DDR3/LPDDR memory controller options minimize external component count and simplify board design.
- Wide operating range — Military-grade temperature rating (–55 °C to 125 °C) and a narrow, defined supply range (1.14 V to 1.26 V) for predictable behavior in demanding deployments.
- High I/O density — Up to 720 I/Os for flexible system partitioning and rich peripheral connectivity.
- Production-ready device — RTG4 RT4G150 family devices are listed as production devices in the datasheet device status.
Why Choose RT4G150-1CGG1657R?
The RT4G150-1CGG1657R delivers a combination of radiation-resistant, flash-based FPGA fabric and high-performance interfaces tailored for military and other harsh-environment applications. Its large logic capacity, dedicated DSP resources and high-speed SerDes/memory interfaces let designers consolidate functions onto a single, rugged device—reducing system complexity and board-level component count.
Backed by the RTG4 family documentation from Microchip, this device is suited for engineers building mission-critical systems that require deterministic performance, robust thermal behavior and resistance to radiation-induced configuration upsets.
Request a quote or submit an inquiry to evaluate RT4G150-1CGG1657R for your next design or program.

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