RT4G150-1CGG1657B
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA |
|---|---|
| Quantity | 975 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 38 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1657-CCGA (42.5x42.5) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1657-BFCCGA | Number of I/O | 720 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150-1CGG1657B – RTG4 Field Programmable Gate Array (FPGA)
The RT4G150-1CGG1657B is a flash-based RTG4 FPGA integrating hardened logic fabric and high-performance interfaces for use in radiation-prone and high-reliability systems. The device combines a dense logic fabric, embedded memory and DSP resources, and native high-speed serial interfaces to support signal processing, control and communication tasks in demanding environments.
This FPGA family is described in its datasheet as resistant to radiation-induced configuration upsets and includes design features hardened against single-event upsets (SEUs). Typical target markets include spaceflight, high-altitude aviation, medical electronics and nuclear power plant control where robustness and long-term reliability are required.
Key Features
- Logic Fabric — Provides 151,824 logic elements for complex logic, control and signal-processing implementations.
- Radiation-hardened Design — Logic and configuration resources are hardened by design to mitigate radiation-induced single-event upsets (SEUs), supporting operation in harsh radiation environments.
- On-chip Memory and DSP — Multiple embedded memory options and embedded multiply-accumulate blocks enable DSP functions; device includes approximately 5,325 bits of on-chip RAM.
- High-speed Serial Interfaces — Native SerDes capability at 3.125 Gbps for high-speed serial links and interfacing with serial peripherals.
- Memory Controller Support — Built-in DDR2/DDR3/LPDDR controller capabilities for high-bandwidth external memory interfacing as described in the RTG4 family documentation.
- I/O Density — Up to 720 user I/O pins to support wide peripheral and bus connectivity.
- Performance Characteristics — Fabric and DSP resources support operation up to 300 MHz as noted in the RTG4 family specifications.
- Power and Packaging — Supported core supply voltage range: 1.14 V to 1.26 V; supplied in a 1657-BFCCGA package (supplier package: 1657-CCGA, 42.5 × 42.5 mm) with surface-mount mounting.
- Operating Range & Compliance — Military-grade temperature range of −55 °C to 125 °C and RoHS compliant.
Typical Applications
- Space Systems — Satellite payload processing, telemetry and command, and on-board data handling where radiation tolerance and long-term reliability are required.
- High-Altitude & Aviation Electronics — Avionics and flight systems that demand resistance to radiation-induced configuration upsets and high I/O connectivity.
- Medical Electronics — Critical medical instrumentation and imaging subsystems that benefit from hardened logic and deterministic DSP performance.
- Nuclear & Industrial Control — Control and monitoring systems in nuclear power or other high-radiation industrial environments requiring robust, long-life programmable logic.
Unique Advantages
- Radiation-tolerant architecture: Hardening against SEUs reduces configuration vulnerability in space, aviation and other radiation-exposed deployments.
- High logic capacity: 151,824 logic elements enable large-scale designs without external programmable logic, reducing system complexity.
- Integrated high-speed interfaces: Native 3.125 Gbps SerDes and memory controller capabilities simplify board-level high-bandwidth data paths.
- Military-grade thermal range: Qualified for −55 °C to 125 °C operation to support extreme-environment applications.
- Compact, surface-mount package: 1657-BFCCGA (1657-CCGA, 42.5 × 42.5 mm) provides high I/O density in a standardized SMD form factor.
- Standards-conscious supply: Narrow core voltage window (1.14 V to 1.26 V) supports controlled-power designs and predictable power budgeting.
Why Choose RT4G150-1CGG1657B?
The RT4G150-1CGG1657B positions itself as a high-capacity, radiation-hardened FPGA for design teams tackling signal processing, control and communication roles in radiation-prone or mission-critical systems. With 151,824 logic elements, embedded DSP and memory resources, native SerDes and broad I/O, the device integrates multiple system functions into a single programmable component, helping to reduce BOM complexity and streamline validation in harsh environments.
Designed for engineers and program managers requiring proven radiation tolerance and wide operating temperature, this RTG4 device is appropriate for long-life, reliability-focused programs where deterministic performance and interface density matter. Refer to the RTG4 FPGA documentation for full technical details and implementation guidance.
Request a quote or submit a purchase inquiry to obtain pricing and availability for the RT4G150-1CGG1657B.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D