RT4G150-1CGG1657PROTO

RT4G150-1CGG1657PROTO
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA

Quantity 1,414 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Device Package1657-CCGA (42.5x42.5)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case1657-BFCCGANumber of I/O720Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-1CGG1657PROTO – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA

The RT4G150-1CGG1657PROTO is a flash-based RTG4 FPGA designed for high-reliability, radiation-tolerant applications. It integrates fourth-generation flash FPGA fabric with hardened logic, high-performance SerDes, and embedded DSP capabilities to address demanding environments such as space, high-altitude aviation, medical electronics, and nuclear power control.

Built for robust operation, the device delivers 151,824 logic elements, multiple embedded memory options, and on-chip multiply-accumulate blocks for DSP workloads, while supporting high-speed serial links and modern memory interfaces.

Key Features

  • Core FPGA Fabric — 151,824 logic elements (LUT-based logic) with 4-input LUTs and fast carry chains; fabric performance specified up to 300 MHz.
  • Embedded Memory — Total on-chip RAM of 5,325 bits and multiple embedded memory options for storage and buffering within the fabric.
  • DSP Capabilities — Embedded multiply-accumulate blocks enabling digital signal processing up to 300 MHz.
  • High-Speed Serial Interfaces — Native SerDes capable of 3.125 Gbps for serialized data links and high-throughput communications.
  • Memory Controllers — Built-in support for DDR2/DDR3/LPDDR memory controller interfaces for external high-speed memory connectivity.
  • I/O Capacity & Voltage — 720 user I/Os with recommended supply range of 1.14 V to 1.26 V to match system power domains.
  • Reliability & Radiation Hardening — Logic hardened against radiation-induced single-event upsets (SEUs) for use in radiation-prone environments (as described in RTG4 family documentation).
  • Package & Mounting — Supplied in 1657-BFCCGA package (supplier package 1657-CCGA, 42.5 × 42.5 mm) with surface-mount mounting type.
  • Temperature & Grade — Military grade with operating temperature range from −55°C to 125°C and RoHS compliant.

Typical Applications

  • Space Systems — Radiation-hardened FPGA fabric and SEU mitigation make this device suitable for spacecraft subsystems and on-board processing.
  • High-Altitude and Avionics — High-reliability logic and wide temperature range support avionics instrumentation and flight electronics.
  • Medical Electronics — Hardened logic and deterministic DSP performance for medical imaging and instrumentation in demanding environments.
  • Industrial & Nuclear Control — Robust operation under extreme conditions for control systems in nuclear power plants and other critical infrastructure.
  • High-Speed Data Links — 3.125 Gbps SerDes and DDR memory interfaces for communication subsystems and data acquisition systems.

Unique Advantages

  • Radiation-Tolerant Architecture: Fabric hardened against SEUs, enabling reliable operation in radiation-exposed deployments.
  • High Logic Capacity: 151,824 logic elements provide the density needed for complex control, processing, and protocol implementations.
  • Integrated DSP and Memory: On-chip multiply-accumulate blocks and embedded memory simplify signal-processing designs and reduce external BOM.
  • High-Speed Interfaces: Native SerDes and DDR memory controller support enable efficient high-throughput system designs.
  • Wide Temperature and Military Grade: −55°C to 125°C operating range and military grade classification support deployment in harsh environments.
  • Compact, Surface-Mount Package: 1657-BFCCGA / 1657-CCGA (42.5 × 42.5 mm) package delivers high pin count and dense integration for space-constrained boards.

Why Choose RT4G150-1CGG1657PROTO?

The RT4G150-1CGG1657PROTO combines a high-density, flash-based FPGA fabric with hardened logic, embedded DSP resources, and high-speed serial and memory interfaces to address demanding, reliability-focused applications. Its 151,824 logic elements, on-chip memory, and SerDes enable complex signal processing and data-handling tasks while maintaining operational integrity in radiation and temperature extremes.

This device is well suited for system designers and engineers developing aerospace, avionics, medical, and critical industrial systems who require a scalable, robust FPGA platform with long-term support and proven radiation tolerance as documented in the RTG4 family datasheet.

Request a quote or submit an inquiry to receive pricing, availability, and technical assistance for RT4G150-1CGG1657PROTO. Our team can provide procurement details and help evaluate the device for your design requirements.

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