RT4G150-1CQG352B

The RT4G150-1CQG352B is a Microchip RTG4™ field programmable gate array (FPGA) that integrates flash-based FPGA fabric with high-performance interfaces on a single chip. The device is designed for demanding, mission-critical environments and provides resistance to radiation-induced configuration upsets for use in harsh radiation conditions.

Key on-chip resources include 151,824 logic elements, 5,325 total RAM bits and 166 user I/Os. The device supports high-speed serial interfaces and memory controllers while operating from a 1.14 V to 1.26 V core supply and across a wide military temperature range of −55 °C to 125 °C.

Key Features

• Core Fabric: 151,824 logic elements with LUT4-based logic and fast carry chains for high-performance synchronous logic implementation.
• Embedded Memory and DSP: 5,325 total RAM bits and on-chip multiply-accumulate resources for DSP functions; supports external DDR2/DDR3/LPDDR memory controllers as part of the device architecture.
• High-Speed Serial Interfaces: Native SerDes support and high-speed serial communication capabilities described in the RTG4 family datasheet for interface-intensive applications.
• I/O and Packaging: 166 user I/Os in a 352‑BFCQFP exposed pad and tie bar package (352‑QFP, 48×48 footprint) optimized for surface-mount assembly.
• Power: Core voltage supply range of 1.14 V to 1.26 V to match system power domains and regulatory requirements.
• Reliability and Grade: Military-grade device with radiation-resistant configuration architecture and RoHS compliance.
• Operating Range: Qualified for −55 °C to 125 °C operating temperature for deployment in extreme environments.

Typical Applications

• Space and Satellite Systems: Radiation-resistant configuration and high-density logic make the device suitable for design elements in space flight and satellite subsystems.
• High-Altitude Aviation and Aerospace Electronics: Wide temperature range and military grade robustness support avionics, flight instrumentation and related high-altitude applications.
• Medical and Nuclear Control Electronics: Hardened configuration and reliable operation in harsh environments suit control and monitoring systems in medical and nuclear power plant applications.
• High-Speed Interface and DSP Systems: SerDes and embedded DSP resources enable use in systems requiring serial communication and real-time signal processing.

Unique Advantages

• Radiation-resistant architecture: Designed to resist radiation-induced configuration upsets, reducing the need for complex mitigation in radiation-prone deployments.
• High logic density: 151,824 logic elements provide substantial on-chip programmable resources for complex system integration.
• Integrated interface support: On-chip SerDes and DDR memory controller capabilities simplify system-level high-speed I/O and memory interfacing.
• Wide operating temperature: −55 °C to 125 °C rating supports reliable operation across extreme environmental conditions.
• Compact surface-mount package: 352‑BFCQFP exposed pad package (48×48) enables high-density board integration with thermal management via the exposed pad.
• Regulatory compliance: RoHS compliant, aligning with modern manufacturing and environmental requirements.

Why Choose RT4G150-1CQG352B?

The RT4G150-1CQG352B combines Microchip’s RTG4™ flash-based FPGA fabric with radiation-resistant configuration and high-speed interface capabilities, delivering a balanced solution for designs that require high logic density, reliable operation in harsh environments, and integrated I/O. Its military-grade qualification and broad operating temperature range make it suited to aerospace, defense, and other mission-critical systems.

Designers and system architects looking to consolidate functions, reduce component count and deploy robust FPGA-based subsystems will find the RT4G150-1CQG352B a compelling option that aligns performance, integration and environmental resilience with industry-grade manufacturing practices.

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