RT4G150-1CQG352B

RT4G150-1CQG352B
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar

Quantity 727 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time38 Weeks
Datasheet

Specifications & Environmental

Device Package352-QFP (48x48)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case352-BFCQFP Exposed Pad and Tie BarNumber of I/O166Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-1CQG352B – RTG4™ FPGA, 151,824 logic elements, 352‑BFCQFP

The RT4G150-1CQG352B is a Microchip RTG4™ field programmable gate array (FPGA) that integrates flash-based FPGA fabric with high-performance interfaces on a single chip. The device is designed for demanding, mission-critical environments and provides resistance to radiation-induced configuration upsets for use in harsh radiation conditions.

Key on-chip resources include 151,824 logic elements, 5,325 total RAM bits and 166 user I/Os. The device supports high-speed serial interfaces and memory controllers while operating from a 1.14 V to 1.26 V core supply and across a wide military temperature range of −55 °C to 125 °C.

Key Features

  • Core Fabric: 151,824 logic elements with LUT4-based logic and fast carry chains for high-performance synchronous logic implementation.
  • Embedded Memory and DSP: 5,325 total RAM bits and on-chip multiply-accumulate resources for DSP functions; supports external DDR2/DDR3/LPDDR memory controllers as part of the device architecture.
  • High-Speed Serial Interfaces: Native SerDes support and high-speed serial communication capabilities described in the RTG4 family datasheet for interface-intensive applications.
  • I/O and Packaging: 166 user I/Os in a 352‑BFCQFP exposed pad and tie bar package (352‑QFP, 48×48 footprint) optimized for surface-mount assembly.
  • Power: Core voltage supply range of 1.14 V to 1.26 V to match system power domains and regulatory requirements.
  • Reliability and Grade: Military-grade device with radiation-resistant configuration architecture and RoHS compliance.
  • Operating Range: Qualified for −55 °C to 125 °C operating temperature for deployment in extreme environments.

Typical Applications

  • Space and Satellite Systems: Radiation-resistant configuration and high-density logic make the device suitable for design elements in space flight and satellite subsystems.
  • High-Altitude Aviation and Aerospace Electronics: Wide temperature range and military grade robustness support avionics, flight instrumentation and related high-altitude applications.
  • Medical and Nuclear Control Electronics: Hardened configuration and reliable operation in harsh environments suit control and monitoring systems in medical and nuclear power plant applications.
  • High-Speed Interface and DSP Systems: SerDes and embedded DSP resources enable use in systems requiring serial communication and real-time signal processing.

Unique Advantages

  • Radiation-resistant architecture: Designed to resist radiation-induced configuration upsets, reducing the need for complex mitigation in radiation-prone deployments.
  • High logic density: 151,824 logic elements provide substantial on-chip programmable resources for complex system integration.
  • Integrated interface support: On-chip SerDes and DDR memory controller capabilities simplify system-level high-speed I/O and memory interfacing.
  • Wide operating temperature: −55 °C to 125 °C rating supports reliable operation across extreme environmental conditions.
  • Compact surface-mount package: 352‑BFCQFP exposed pad package (48×48) enables high-density board integration with thermal management via the exposed pad.
  • Regulatory compliance: RoHS compliant, aligning with modern manufacturing and environmental requirements.

Why Choose RT4G150-1CQG352B?

The RT4G150-1CQG352B combines Microchip’s RTG4™ flash-based FPGA fabric with radiation-resistant configuration and high-speed interface capabilities, delivering a balanced solution for designs that require high logic density, reliable operation in harsh environments, and integrated I/O. Its military-grade qualification and broad operating temperature range make it suited to aerospace, defense, and other mission-critical systems.

Designers and system architects looking to consolidate functions, reduce component count and deploy robust FPGA-based subsystems will find the RT4G150-1CQG352B a compelling option that aligns performance, integration and environmental resilience with industry-grade manufacturing practices.

Request a quote or submit an inquiry to receive pricing, availability and lead-time information for the RT4G150-1CQG352B.

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