RT4G150-1CQG352M

RT4G150-1CQG352M
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar

Quantity 22 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Device Package352-QFP (48x48)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case352-BFCQFP Exposed Pad and Tie BarNumber of I/O166Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-1CQG352M – RTG4™ Field Programmable Gate Array (FPGA), 151,824 logic elements, 352‑BFCQFP

The RT4G150-1CQG352M is a Microchip RTG4™ flash-based FPGA optimized for deployment in high‑reliability and radiation‑sensitive systems. It integrates fourth‑generation FPGA fabric with hardened design elements and high‑performance interfaces to address demanding applications in space, high‑altitude aviation, medical electronics and nuclear power plant control.

Built around 151,824 logic elements and on‑chip configurable memory, the device combines deterministic performance (fabric operation to 300 MHz) with native SerDes and memory controller support to simplify system integration for rugged environments.

Key Features

  • Flash‑based FPGA fabric with radiation hardening – Fabric and registers hardened by design against radiation‑induced single‑event upsets (SEUs), suitable for radiation‑sensitive deployments described in the RTG4 family documentation.
  • High logic capacity – 151,824 logic elements provide substantial on‑chip logic resources for complex digital designs.
  • Embedded memory – Approximately 5,325 bits of total on‑chip RAM for fabric storage and buffering.
  • DSP capability – Embedded multiply‑accumulate blocks for digital signal processing, with fabric and DSP timing characterized to 300 MHz in the RTG4 family documentation.
  • High‑speed serial interfaces – Native SerDes communication at 3.125 Gbps to support serial link integration without external PHYs.
  • Memory controller support – Built‑in double data rate memory controller support for DDR2/DDR3/LPDDR as documented for the RTG4 family.
  • I/O and package – 166 I/O pins in a surface‑mount 352‑BFCQFP exposed pad and tie bar package (supplier device package: 352‑QFP, 48×48 mm).
  • Power and temperature – Core supply range 1.14 V to 1.26 V; rated operating temperature −55 °C to 125 °C and specified as Military grade.
  • Compliance – RoHS compliant.

Typical Applications

  • Spaceflight systems – Radiation‑hardened FPGA fabric and hardened registers for use in LEO/MEO/GEO/HEO and deep‑space electronics as outlined in RTG4 documentation.
  • High‑altitude aviation – Deterministic logic and high‑speed SerDes for avionics and instrumentation requiring robust operation at altitude.
  • Medical electronics – Reliable FPGA compute and DSP resources for diagnostic, imaging, and control systems operating in demanding environments.
  • Nuclear power plant control – Hardened logic and wide temperature range suitable for safety‑critical control and monitoring functions.

Unique Advantages

  • Radiation‑resistant architecture: Hardened registers and flash‑based configuration reduce susceptibility to SEUs for long‑duration and high‑radiation missions.
  • High integration: On‑chip SerDes and memory controller capabilities reduce external component count and simplify high‑speed I/O design.
  • Large logic resource pool: 151,824 logic elements enable complex system implementations without partitioning across multiple FPGAs.
  • Predictable power envelope: Narrow core voltage window (1.14–1.26 V) aids in precise power budgeting and supply design.
  • Designed for harsh environments: Military grade classification and −55 °C to 125 °C operating range support robust deployment in extreme temperatures.

Why Choose RT4G150-1CQG352M?

The RT4G150-1CQG352M combines Microchip’s fourth‑generation flash FPGA fabric with radiation‑hardened design practices and integrated high‑speed interfaces to address the needs of aerospace, defense, medical, and nuclear control systems. With 151,824 logic elements, native SerDes at 3.125 Gbps, and built‑in memory controller support, it streamlines system architecture while meeting stringent environmental and reliability requirements.

Engineers selecting this RTG4 device benefit from family‑level documentation and design resources provided for RTG4 FPGAs, along with a package and thermal profile suited for surface‑mount assembly in demanding applications.

Request a quote or submit an inquiry to receive pricing, availability and ordering information for RT4G150-1CQG352M.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up