RT4G150-1CQG352E
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar |
|---|---|
| Quantity | 603 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 44 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 352-QFP (48x48) | Grade | Extended | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 352-BFCQFP Exposed Pad and Tie Bar | Number of I/O | 166 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150-1CQG352E – RTG4 Field Programmable Gate Array (FPGA) IC, 352-BFCQFP
The RT4G150-1CQG352E is a flash-based RTG4 FPGA offered in a 352-BFCQFP exposed pad package with tie bar. It combines radiation-hardened FPGA fabric and high-performance interfaces for designs that require robust single-event upset (SEU) resistance and deterministic logic resources. Typical use cases include space, high-altitude avionics, medical electronics, and other applications where radiation tolerance, integration and predictable timing are important.
This device provides a large FPGA fabric with 151,824 logic elements, embedded memory, on-chip DSP blocks, and high-speed serial and memory interface capabilities, while supporting extended temperature operation and surface-mount deployment.
Key Features
- FPGA Fabric — 151,824 logic elements (registers/logic resources) with 4-input LUTs and fast carry chains for synchronous logic implementation and predictable timing.
- Embedded Memory — Approximately 5,325 total RAM bits of on-chip memory for configuration and small data buffering needs.
- DSP and Performance — Embedded multiply-accumulate (DSP) blocks supporting signal processing operations up to 300 MHz as documented for the RTG4 family.
- High-speed Serial Interfaces — Native SerDes capability at 3.125 Gbps for high-speed serial links.
- Memory Controller Support — Integrated DDR2/DDR3/LPDDR memory controller support as part of the RTG4 family feature set for high-throughput external memory interfaces.
- Radiation Hardened by Design — Logic registers hardened against radiation-induced single-event upsets (SEUs), suitable for radiation-prone environments.
- I/O and Packaging — 166 user I/Os in a 352-BFCQFP exposed pad package (supplier device package: 352-QFP, 48×48 footprint) optimized for surface-mount assembly.
- Power and Temperature — Recommended VCC range from 1.14 V to 1.26 V and extended operating temperature range of −55 °C to 125 °C.
- Regulatory — RoHS compliant.
Typical Applications
- Space and High-Altitude Electronics — Radiation-hardened registers and SEU resistance make this FPGA suitable for spacecraft payloads, satellites and high-altitude avionics processing tasks.
- Medical and Nuclear Instrumentation — Deterministic logic and extended temperature range support control, data acquisition, and signal processing in demanding environments.
- High-Speed Serial Communications — Built-in SerDes at 3.125 Gbps enables link-layer interfaces and high-throughput telemetry or data relay designs.
- DSP-Intensive Systems — On-chip multiply-accumulate blocks and fabric timing to ~300 MHz support digital filtering, signal conditioning and similar DSP workloads.
Unique Advantages
- Radiation-Hardened Architecture: Logic registers hardened by design against SEUs provide improved configuration stability in radiation environments.
- High Logic Density: 151,824 logic elements enable complex, integrated system designs with fewer external components.
- Integrated High-Speed Interfaces: Native SerDes and supported memory controllers reduce design complexity for high-bandwidth applications.
- Extended Environmental Range: −55 °C to 125 °C operating temperature rating and surface-mount 352-QFP package with exposed pad support rugged deployment scenarios.
- Low-Voltage Operation: Narrow supply voltage window (1.14 V–1.26 V) allows focused power delivery design and predictable device behavior.
- Compliance: RoHS compliance simplifies environmental regulation management.
Why Choose RT4G150-1CQG352E?
The RT4G150-1CQG352E positions itself for applications that demand a combination of high logic capacity, radiation tolerance and integrated high-speed interfaces. Its RTG4 family heritage provides hardened registers, DSP resources, and SerDes capability alongside a compact 352-BFCQFP surface-mount package for board-level integration.
This FPGA is well suited for engineers and programs requiring long-term robustness and predictable performance in challenging environments, where on-chip integration reduces system complexity and supports deterministic signal processing and communication tasks.
Request a quote or submit a sales inquiry to receive pricing and availability for the RT4G150-1CQG352E and to discuss how it can fit into your next rugged, high-reliability design.

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