RT4G150-1CQG352E

RT4G150-1CQG352E
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar

Quantity 603 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time44 Weeks
Datasheet

Specifications & Environmental

Device Package352-QFP (48x48)GradeExtendedOperating Temperature-55°C – 125°C
Package / Case352-BFCQFP Exposed Pad and Tie BarNumber of I/O166Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-1CQG352E – RTG4 Field Programmable Gate Array (FPGA) IC, 352-BFCQFP

The RT4G150-1CQG352E is a flash-based RTG4 FPGA offered in a 352-BFCQFP exposed pad package with tie bar. It combines radiation-hardened FPGA fabric and high-performance interfaces for designs that require robust single-event upset (SEU) resistance and deterministic logic resources. Typical use cases include space, high-altitude avionics, medical electronics, and other applications where radiation tolerance, integration and predictable timing are important.

This device provides a large FPGA fabric with 151,824 logic elements, embedded memory, on-chip DSP blocks, and high-speed serial and memory interface capabilities, while supporting extended temperature operation and surface-mount deployment.

Key Features

  • FPGA Fabric — 151,824 logic elements (registers/logic resources) with 4-input LUTs and fast carry chains for synchronous logic implementation and predictable timing.
  • Embedded Memory — Approximately 5,325 total RAM bits of on-chip memory for configuration and small data buffering needs.
  • DSP and Performance — Embedded multiply-accumulate (DSP) blocks supporting signal processing operations up to 300 MHz as documented for the RTG4 family.
  • High-speed Serial Interfaces — Native SerDes capability at 3.125 Gbps for high-speed serial links.
  • Memory Controller Support — Integrated DDR2/DDR3/LPDDR memory controller support as part of the RTG4 family feature set for high-throughput external memory interfaces.
  • Radiation Hardened by Design — Logic registers hardened against radiation-induced single-event upsets (SEUs), suitable for radiation-prone environments.
  • I/O and Packaging — 166 user I/Os in a 352-BFCQFP exposed pad package (supplier device package: 352-QFP, 48×48 footprint) optimized for surface-mount assembly.
  • Power and Temperature — Recommended VCC range from 1.14 V to 1.26 V and extended operating temperature range of −55 °C to 125 °C.
  • Regulatory — RoHS compliant.

Typical Applications

  • Space and High-Altitude Electronics — Radiation-hardened registers and SEU resistance make this FPGA suitable for spacecraft payloads, satellites and high-altitude avionics processing tasks.
  • Medical and Nuclear Instrumentation — Deterministic logic and extended temperature range support control, data acquisition, and signal processing in demanding environments.
  • High-Speed Serial Communications — Built-in SerDes at 3.125 Gbps enables link-layer interfaces and high-throughput telemetry or data relay designs.
  • DSP-Intensive Systems — On-chip multiply-accumulate blocks and fabric timing to ~300 MHz support digital filtering, signal conditioning and similar DSP workloads.

Unique Advantages

  • Radiation-Hardened Architecture: Logic registers hardened by design against SEUs provide improved configuration stability in radiation environments.
  • High Logic Density: 151,824 logic elements enable complex, integrated system designs with fewer external components.
  • Integrated High-Speed Interfaces: Native SerDes and supported memory controllers reduce design complexity for high-bandwidth applications.
  • Extended Environmental Range: −55 °C to 125 °C operating temperature rating and surface-mount 352-QFP package with exposed pad support rugged deployment scenarios.
  • Low-Voltage Operation: Narrow supply voltage window (1.14 V–1.26 V) allows focused power delivery design and predictable device behavior.
  • Compliance: RoHS compliance simplifies environmental regulation management.

Why Choose RT4G150-1CQG352E?

The RT4G150-1CQG352E positions itself for applications that demand a combination of high logic capacity, radiation tolerance and integrated high-speed interfaces. Its RTG4 family heritage provides hardened registers, DSP resources, and SerDes capability alongside a compact 352-BFCQFP surface-mount package for board-level integration.

This FPGA is well suited for engineers and programs requiring long-term robustness and predictable performance in challenging environments, where on-chip integration reduces system complexity and supports deterministic signal processing and communication tasks.

Request a quote or submit a sales inquiry to receive pricing and availability for the RT4G150-1CQG352E and to discuss how it can fit into your next rugged, high-reliability design.

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