RT4G150-1CQG352V
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar |
|---|---|
| Quantity | 257 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 352-QFP (48x48) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 352-BFCQFP Exposed Pad and Tie Bar | Number of I/O | 166 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150-1CQG352V – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar
The RT4G150-1CQG352V is a flash-based RTG4™ FPGA that combines hardened FPGA fabric and high-performance interfaces for use in radiation-prone and other harsh environments. This device delivers a dense logic fabric with 151,824 logic elements, integrated SERDES and memory controllers, and features designed for systems requiring robust configuration stability.
Targeted at space, avionics, medical, and nuclear control applications, the device offers a mix of logic, I/O, and embedded resources along with a military-grade temperature range and a compact surface-mount 352-BFCQFP package.
Key Features
- Flash-based FPGA fabric Flash configuration technology with architecture hardened by design to resist radiation-induced configuration upsets and single-event upsets (SEUs).
- High logic capacity 151,824 logic elements to implement complex control, signal-processing, and interface logic.
- Embedded memory 5,325 total RAM bits of on-chip memory for small buffers, state storage, and control structures.
- High-speed serial I/O Native SERDES support (3.125 Gbps specified in the datasheet) for high-speed serial interfaces and communication links.
- DSP and timing performance Embedded multiply-accumulate blocks and a fabric capable of operation up to 300 MHz for DSP and timing-critical functions (per datasheet).
- I/O and connectivity 166 user I/Os for broad peripheral and system connectivity in a single device.
- Package and mounting 352-BFCQFP exposed pad and tie bar, supplier package listed as 352-QFP (48×48), surface-mount for compact PCB designs.
- Power and thermal Recommended supply range 1.14 V to 1.26 V and operating temperature range −55 °C to 125 °C (military grade), enabling use in wide-temperature installations.
- RoHS compliant Conforms to RoHS requirements.
Typical Applications
- Space systems — Radiation-hardened configuration and SEU resistance make this FPGA suitable for satellite payloads and other spaceflight electronics.
- Avionics and high-altitude platforms — Use in navigation, telemetry, and communications systems where environmental resilience is required.
- Medical electronics — Control and signal-processing functions in medical devices that require robust, stable operation in demanding conditions.
- Nuclear power and industrial control — Systems that demand resilient configuration and wide temperature operation for long-term reliability.
Unique Advantages
- Radiation-hardened architecture: Hardened-by-design fabric and SEU resistance reduce the need for external mitigation in radiation-prone environments.
- High integration density: 151,824 logic elements consolidate complex functions into a single FPGA, reducing system BOM and board space.
- Integrated high-speed interfaces: Native SERDES and on-chip controllers support high-throughput communication without external interface chips.
- Wide operational range: Military-grade temperature range (−55 °C to 125 °C) and controlled supply voltage (1.14–1.26 V) support demanding deployment environments.
- Compact surface-mount package: 352-BFCQFP exposed pad and tie bar in a 48×48 supplier package enables dense PCB layouts while providing thermal conduction through the exposed pad.
Why Choose RT4G150-1CQG352V?
The RT4G150-1CQG352V delivers a combination of radiation-tolerant configuration, large logic capacity, and on-chip high-speed interfaces tailored for systems operating in harsh environments. Its military-grade temperature range, compact 352-QFP package, and RoHS compliance make it a practical choice for long-life, high-reliability applications where configuration stability and integration density matter.
This device is well suited to engineers designing spaceflight electronics, avionics, medical systems, and industrial control platforms that require a hardened, high-capacity FPGA with integrated serial and memory interface capabilities and proven vendor documentation and datasheet support.
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