RT4G150-1LGG1657E

The RT4G150-1LGG1657E is a flash-based RTG4™ FPGA from Microchip Technology, combining hardened FPGA fabric with high-performance serial interfaces and embedded DSP/memory resources. Built for demanding and radiation-prone environments, this device targets applications that require dense logic, broad I/O, and resilient configuration retention.

Key architectural strengths include 151,824 logic elements, approximately 5,325 bits of embedded RAM, native SerDes connectivity, and design features intended to reduce the impact of radiation-induced configuration upsets.

Key Features

• Core Logic — 151,824 logic elements providing substantial programmable fabric for complex logic, control, and signal-processing tasks.
• Embedded Memory & DSP — Approximately 5,325 bits of on-chip RAM and embedded multiply-accumulate resources for signal-processing functions and buffering.
• High-speed Serial Interfaces — Native SerDes support with documented 3.125 Gbps capability for high-throughput serial links.
• I/O Density — 720 user I/Os to support large peripheral sets, multi-channel data paths, or broad sensor and actuator connectivity.
• Non-volatile, Radiation-Tolerant Fabric — Flash-based FPGA fabric with design features that provide resistance to radiation-induced configuration upsets suitable for harsh environments.
• Power and Package — Low-voltage core supply range of 1.14 V to 1.26 V and surface-mount 1657-BCLGA package (supplier package: 1657-CLGA, 42.5 × 42.5 mm).
• Extended Temperature Grade — Rated for operation from −55 °C to 125 °C to meet requirements of thermally challenging deployments.
• Regulatory — RoHS compliant.

Typical Applications

• Space Systems — FPGA fabric and radiation-resistant configuration make the device suitable for LEO, MEO, GEO, HEO and deep-space electronics where SEU mitigation is required.
• High‑Altitude Aviation — Use in avionics and high-altitude platforms that need robust logic, extensive I/O and wide temperature operation.
• Medical Electronics — High-logic density and DSP capabilities for imaging, instrumentation, and control systems that operate in regulated environments.
• Nuclear and Power-Plant Control — Hardened configuration behavior and extended temperature rating for control and monitoring systems in radiation-exposed facilities.

Unique Advantages

• Radiation‑resilient Architecture: Flash-based fabric and hardened registers reduce susceptibility to radiation-induced configuration upsets, lowering mitigation overhead in hostile environments.
• High Logic Capacity: 151,824 logic elements enable complex algorithms, state machines, and large custom IP implementations on a single device.
• Broad I/O and High-Speed Links: 720 I/Os combined with native 3.125 Gbps SerDes support simplify system integration for multi-channel and high-bandwidth interfaces.
• Operational Range: Core voltage 1.14–1.26 V and −55 °C to 125 °C operating range support designs that must operate reliably across wide environmental conditions.
• Package and Mounting: Available in a surface-mount 1657-BCLGA package (1657-CLGA, 42.5×42.5 mm) to fit high-pin-count board implementations.
• Proven Product Status: RTG4 devices in the 1657 LGG package are listed in production, backed by Microchip documentation and device datasheet resources.

Why Choose RT4G150-1LGG1657E?

The RT4G150-1LGG1657E combines high logic density, robust on-chip resources, and purpose-built resistance to radiation effects, making it a solid choice for systems operating in space, high-altitude aviation, medical, and nuclear environments. Its large I/O count and native high-speed serial capability reduce external bridging components and simplify board-level design.

Designed for applications that require a balance of performance, integration, and environmental resilience, this RTG4 device is suited to engineering teams who need documented technical specifications, extended temperature operation, and a production-grade FPGA package for mission-critical deployments.

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