RT4G150-1LGG1657B

RT4G150-1LGG1657B
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA

Quantity 593 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time38 Weeks
Datasheet

Specifications & Environmental

Device Package1657-CLGA (42.5x42.5)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case1657-BCLGANumber of I/O720Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-1LGG1657B – RTG4™ FPGA, 151,824 Logic Elements, Military Grade

The RT4G150-1LGG1657B is a Microchip Technology RTG4™ field programmable gate array (FPGA) designed for high-reliability, mission-critical systems. It integrates a flash-based FPGA fabric with hardened logic elements and high-performance interfaces for applications that require resistance to radiation-induced configuration upsets and extended temperature operation.

This device targets space, high-altitude aviation, medical electronics and nuclear control environments where reliability, deterministic logic performance and robust I/O are required. The architecture combines a large logic element count, embedded memory and DSP capabilities with high-speed serial interfaces and DDR memory controller support.

Key Features

  • Core Logic — 151,824 logic elements (registers/logic cells) with 4-input LUTs and fast carry chains for synchronous logic implementations and predictable timing.
  • Embedded Memory & DSP — Multiple embedded memory resources (total RAM: 5,325 bits reported) and embedded multiply-accumulate blocks for DSP workloads operating up to 300 MHz.
  • High‑Speed Serial Interfaces — Native SerDes communication at 3.125 Gbps and support for DDR2/DDR3/LPDDR memory controllers for high-bandwidth data transport.
  • Radiation‑Hardened by Design — Fabric and registers are hardened against radiation-induced single-event upsets (SEUs) and designed to resist configuration upsets in harsh radiation environments.
  • I/O Density — 720 user I/O pins to support complex system interfaces and wide peripheral connectivity.
  • Package & Mounting — 1657-BCLGA package (supplier device package 1657-CLGA, 42.5×42.5 mm) with surface-mount mounting for high-density board designs.
  • Power Supply — Core voltage supply range from 1.14 V to 1.26 V for core power planning and regulation.
  • Wide Operating Temperature — Rated for −55 °C to 125 °C and specified as Military grade for harsh-environment deployments.
  • Standards & Design Resources — Datasheet and technical briefs provide detailed specifications for I/O standards, SerDes, clock conditioning and system controller interfaces.
  • RoHS Compliant — Device meets RoHS compliance requirements for lead-free manufacturing and assembly.

Typical Applications

  • Space Systems — Radiation‑hardened architecture and extended temperature range make it suitable for LEO, MEO, GEO, HEO and deep-space missions where configuration integrity is critical.
  • High‑Altitude Aviation — Use in avionics and flight systems requiring SEU-hardened logic, high I/O count and reliable serial links.
  • Medical Electronics — Deterministic logic, on‑chip DSP resources and robust I/O for medical instrumentation and imaging applications.
  • Nuclear Power Plant Control — Hardened registers and wide operating temperature accommodate control and monitoring equipment in nuclear environments.

Unique Advantages

  • High Logic Capacity: 151,824 logic elements enable large-scale digital designs and complex control/state machines on a single device, reducing system BOM and board area.
  • Deterministic Performance: 4-input LUTs with fast carry chains and fabric timing characterized up to 300 MHz support predictable timing for synchronous designs.
  • Radiation‑Resistant Design: Hardened registers and configuration resistance to radiation-induced upsets improve mission reliability in harsh environments.
  • Integrated High‑Speed I/O: 720 I/O pins plus 3.125 Gbps SerDes and DDR memory controller support simplify high-bandwidth interface designs.
  • Military Temperature Qualification: −55 °C to 125 °C operating range and military grade listing support deployment in extreme-temperature and high-reliability applications.
  • Compact, High‑Density Package: 1657-BCLGA (42.5×42.5 mm) surface-mount package provides a high pin-count footprint suitable for dense, complex systems.

Why Choose RT4G150-1LGG1657B?

The RT4G150-1LGG1657B combines a large logic-element fabric, embedded DSP capabilities and high-speed serial interfaces with a radiation‑hardened design and military temperature qualification. It is positioned for engineers building systems that demand deterministic FPGA performance, high I/O density and robustness in harsh or radiation-prone environments.

Designed and documented by Microchip Technology, this RTG4™ device is suitable for teams developing space, avionics, medical and nuclear control applications that require a reliable, integrated FPGA solution with comprehensive technical documentation for system integration.

Request a quote or submit an inquiry to receive pricing and availability information for RT4G150-1LGG1657B and to discuss how this FPGA fits your high-reliability design requirements.

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