RT4G150-1LGG1657V

RT4G150-1LGG1657V
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA

Quantity 824 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package1657-CLGA (42.5x42.5)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case1657-BCLGANumber of I/O720Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-1LGG1657V – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA

The RT4G150-1LGG1657V is a flash-based RTG4™ FPGA integrating high-performance FPGA fabric and on-chip high-speed interfaces designed for demanding, radiation-prone environments. The device combines a large logic fabric, embedded memory and DSP resources with hardened design techniques to address applications where configuration stability and system reliability are critical.

Targeted use cases include space flight, high-altitude aviation, medical electronics and nuclear power plant control, where resistance to radiation-induced configuration upsets and robust operation across extreme temperatures are required.

Key Features

  • Core Logic — 151,824 logic elements (registers/LEs) providing extensive programmable fabric for complex digital designs.
  • Hardened Reliability — Logic and registers hardened by design against radiation-induced single-event upsets (SEUs), maintaining resistance to radiation-induced configuration upsets in harsh radiation environments (space flight, high-altitude aviation, medical electronics, nuclear power control).
  • LUT Architecture & Performance — Each logic element includes a 4-input LookUp Table (LUT4) with fast carry chains; fabric performance characterized to operate up to 300 MHz in applicable paths.
  • Embedded Memory & DSP — Multiple embedded memory options and embedded multiply-accumulate blocks for DSP workloads; total on-chip RAM reported as 5,325 bits.
  • High-Speed Serial Interfaces — Native SerDes support with 3.125 Gbps capability and integrated DDR2/DDR3/LPDDR memory controller support for high-bandwidth external memory interfaces.
  • I/O Density — 720 user I/O pins to support dense external connectivity and complex system interfaces.
  • Power and Operating Range — Core supply range of 1.14 V to 1.26 V to match system power designs; qualified operating temperature from −55 °C to 125 °C.
  • Package & Mounting — 1657‑BCLGA package; supplier device package specified as 1657‑CLGA (42.5 × 42.5 mm) with surface-mount mounting.
  • Grade & Compliance — Military grade device; RoHS compliant.

Typical Applications

  • Space Flight Systems — Radiation-resistant configuration and hardened registers make this FPGA suitable for payload processing, telemetry, and control electronics in LEO, MEO, GEO and deep-space missions.
  • High-Altitude Aviation — Robust operation and SEU-hardened logic support avionics and airborne systems exposed to elevated radiation levels and wide temperature swings.
  • Medical Electronics — Reliable digital processing and hardened configuration provide stable operation in medical diagnostic and monitoring equipment where uptime and data integrity are critical.
  • Nuclear Plant Control — Hardened design and industrial temperature range enable use in control and monitoring systems within nuclear power facility environments.

Unique Advantages

  • Radiation-Resistant Architecture: Hardened registers and configuration resistance reduce vulnerability to SEUs and configuration upsets in radiation environments.
  • High Logic Density: 151,824 logic elements enable large, complex designs to be implemented in a single device, reducing board-level complexity.
  • Integrated High-Speed Interfaces: On-chip SerDes at 3.125 Gbps and DDR2/DDR3/LPDDR controller support simplify high-bandwidth I/O and external memory integration.
  • Wide Operating Range: Military grade device with −55 °C to 125 °C operating temperature and RoHS compliance for demanding environmental and regulatory requirements.
  • Flexible Packaging: 1657-BCLGA (supplier package 1657‑CLGA, 42.5 × 42.5 mm) surface-mount package supports dense system integration.

Why Choose RT4G150-1LGG1657V?

The RT4G150-1LGG1657V positions itself where high logic capacity, hardened reliability and integrated high-speed interfaces are required. Its RTG4 architecture combines a large, radiation-hardened FPGA fabric with DSP blocks, embedded memory resources and SerDes/memory-controller integration to address complex processing tasks in radiation-prone and temperature-extreme environments.

This device is ideal for engineering teams developing mission-critical systems in aerospace, aviation, medical and nuclear applications who require a single-chip programmable solution that emphasizes operational stability, high I/O density and proven mitigation against radiation-induced configuration upsets.

If you would like pricing, availability or a quotation for RT4G150-1LGG1657V, request a quote or submit an inquiry to initiate next steps.

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