RT4G150-CGG1657B
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA |
|---|---|
| Quantity | 262 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 38 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1657-CCGA (42.5x42.5) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1657-BFCCGA | Number of I/O | 720 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150-CGG1657B – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA
The RT4G150-CGG1657B is a flash-based RTG4 FPGA from Microchip Technology designed for demanding, radiation-prone environments. It integrates a high-density FPGA fabric with hardened registers, embedded DSP resources and high-performance serial and memory interfaces for applications that require reliability and deterministic performance.
Typical use cases include spaceflight and high-altitude avionics, medical electronics, and nuclear power plant control where resistance to radiation-induced configuration upsets and long-term functional stability are critical.
Key Features
- FPGA Core — Flash-based RTG4 fabric with 4-input LUTs (LUT4) and fast carry chains; fabric performance characterized up to 300 MHz.
- Logic Capacity — 151,824 logic elements providing high on-chip logic density suitable for complex control, signal processing and interface tasks.
- Embedded Memory & DSP — Total embedded RAM: 5,325 bits, plus embedded multiply-accumulate blocks for DSP workloads up to 300 MHz.
- High-Speed Serial & Memory Interfaces — Native SerDes capability at 3.125 Gbps and integrated DDR2/DDR3/LPDDR memory controller support for high-bandwidth I/O and external memory interfacing.
- I/O and Packaging — Up to 720 user I/Os in a 1657-BFCCGA package; supplier device package 1657-CCGA with 42.5 × 42.5 mm footprint; surface-mount mounting type.
- Power & Operating Conditions — Recommended supply voltage range 1.14 V to 1.26 V; operating temperature range −55 °C to 125 °C.
- Reliability & Radiation Resilience — Registers hardened against radiation-induced single-event upsets (SEUs) and designed to maintain resistance to radiation-induced configuration upsets in harsh environments.
- Standards & Compliance — Device is RoHS compliant; RTG4 family documentation and technical briefs are available for detailed design guidance.
- Production Status — RT4G150 devices in CGG/LGG/CBG1657 packages are listed as Production in Microchip documentation.
Typical Applications
- Spaceflight Systems — Radiation-hardened FPGA fabric and SEU-hardened registers make the device suitable for LEO, MEO, GEO, HEO and deep-space payload and avionics processing.
- High-Altitude Aviation — High logic density and hardened configuration provide reliable on-board processing for flight-critical avionics at altitude.
- Medical Electronics — Deterministic DSP capability and high I/O counts support imaging, signal acquisition and control electronics requiring robust operation.
- Nuclear Power Plant Control — Radiation resilience and wide operating temperature range support control and monitoring systems in nuclear environments.
Unique Advantages
- Radiation-Resistant Architecture: Registers hardened against SEUs and flash-based configuration reduce susceptibility to radiation-induced configuration upsets.
- High Logic Density: 151,824 logic elements enable large, complex designs to be implemented on a single device, reducing system-level complexity.
- Integrated High-Speed Interfaces: Native 3.125 Gbps SerDes and DDR2/DDR3/LPDDR controller support lower external interface engineering effort and enable high-bandwidth system designs.
- Deterministic DSP Performance: Embedded multiply-accumulate blocks and fabric timing characterized to 300 MHz support real-time signal processing tasks.
- Wide Environmental Range: Military-grade device rating with −55 °C to 125 °C operation and RoHS compliance for deployment in harsh conditions.
- Production Availability: RT4G150 in the 1657 package family is listed as Production in Microchip documentation, supporting longer-term program planning.
Why Choose RT4G150-CGG1657B?
The RT4G150-CGG1657B combines flash-based FPGA flexibility with architecture-level radiation resilience and substantial logic capacity, making it a strong choice for mission-critical systems in space, aviation, medical, and nuclear applications. Its mix of high-speed SerDes, DDR memory controller support, embedded DSP resources and a large I/O complement lets designers consolidate functions and simplify board-level design.
Backed by Microchip’s RTG4 family documentation, technical briefs and datasheet detail, the RT4G150-CGG1657B is positioned for projects that require predictable performance, robustness to radiation effects, and a clear technical reference set for system integration.
Request a quote or submit an inquiry today to obtain pricing, availability, and additional technical information for RT4G150-CGG1657B.

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