RT4G150-CGG1657B

RT4G150-CGG1657B
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA

Quantity 262 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time38 Weeks
Datasheet

Specifications & Environmental

Device Package1657-CCGA (42.5x42.5)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case1657-BFCCGANumber of I/O720Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-CGG1657B – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA

The RT4G150-CGG1657B is a flash-based RTG4 FPGA from Microchip Technology designed for demanding, radiation-prone environments. It integrates a high-density FPGA fabric with hardened registers, embedded DSP resources and high-performance serial and memory interfaces for applications that require reliability and deterministic performance.

Typical use cases include spaceflight and high-altitude avionics, medical electronics, and nuclear power plant control where resistance to radiation-induced configuration upsets and long-term functional stability are critical.

Key Features

  • FPGA Core — Flash-based RTG4 fabric with 4-input LUTs (LUT4) and fast carry chains; fabric performance characterized up to 300 MHz.
  • Logic Capacity — 151,824 logic elements providing high on-chip logic density suitable for complex control, signal processing and interface tasks.
  • Embedded Memory & DSP — Total embedded RAM: 5,325 bits, plus embedded multiply-accumulate blocks for DSP workloads up to 300 MHz.
  • High-Speed Serial & Memory Interfaces — Native SerDes capability at 3.125 Gbps and integrated DDR2/DDR3/LPDDR memory controller support for high-bandwidth I/O and external memory interfacing.
  • I/O and Packaging — Up to 720 user I/Os in a 1657-BFCCGA package; supplier device package 1657-CCGA with 42.5 × 42.5 mm footprint; surface-mount mounting type.
  • Power & Operating Conditions — Recommended supply voltage range 1.14 V to 1.26 V; operating temperature range −55 °C to 125 °C.
  • Reliability & Radiation Resilience — Registers hardened against radiation-induced single-event upsets (SEUs) and designed to maintain resistance to radiation-induced configuration upsets in harsh environments.
  • Standards & Compliance — Device is RoHS compliant; RTG4 family documentation and technical briefs are available for detailed design guidance.
  • Production Status — RT4G150 devices in CGG/LGG/CBG1657 packages are listed as Production in Microchip documentation.

Typical Applications

  • Spaceflight Systems — Radiation-hardened FPGA fabric and SEU-hardened registers make the device suitable for LEO, MEO, GEO, HEO and deep-space payload and avionics processing.
  • High-Altitude Aviation — High logic density and hardened configuration provide reliable on-board processing for flight-critical avionics at altitude.
  • Medical Electronics — Deterministic DSP capability and high I/O counts support imaging, signal acquisition and control electronics requiring robust operation.
  • Nuclear Power Plant Control — Radiation resilience and wide operating temperature range support control and monitoring systems in nuclear environments.

Unique Advantages

  • Radiation-Resistant Architecture: Registers hardened against SEUs and flash-based configuration reduce susceptibility to radiation-induced configuration upsets.
  • High Logic Density: 151,824 logic elements enable large, complex designs to be implemented on a single device, reducing system-level complexity.
  • Integrated High-Speed Interfaces: Native 3.125 Gbps SerDes and DDR2/DDR3/LPDDR controller support lower external interface engineering effort and enable high-bandwidth system designs.
  • Deterministic DSP Performance: Embedded multiply-accumulate blocks and fabric timing characterized to 300 MHz support real-time signal processing tasks.
  • Wide Environmental Range: Military-grade device rating with −55 °C to 125 °C operation and RoHS compliance for deployment in harsh conditions.
  • Production Availability: RT4G150 in the 1657 package family is listed as Production in Microchip documentation, supporting longer-term program planning.

Why Choose RT4G150-CGG1657B?

The RT4G150-CGG1657B combines flash-based FPGA flexibility with architecture-level radiation resilience and substantial logic capacity, making it a strong choice for mission-critical systems in space, aviation, medical, and nuclear applications. Its mix of high-speed SerDes, DDR memory controller support, embedded DSP resources and a large I/O complement lets designers consolidate functions and simplify board-level design.

Backed by Microchip’s RTG4 family documentation, technical briefs and datasheet detail, the RT4G150-CGG1657B is positioned for projects that require predictable performance, robustness to radiation effects, and a clear technical reference set for system integration.

Request a quote or submit an inquiry today to obtain pricing, availability, and additional technical information for RT4G150-CGG1657B.

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