RT4G150-1CGG1657M

RT4G150-1CGG1657M
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA

Quantity 1,692 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Device Package1657-CCGA (42.5x42.5)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case1657-BFCCGANumber of I/O720Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-1CGG1657M – RTG4™ Field Programmable Gate Array (FPGA) IC

The RT4G150-1CGG1657M is a flash-based RTG4 FPGA from Microchip Technology, built for high-reliability digital processing. The device integrates hardened FPGA fabric with high-performance interfaces and memory controllers, delivering a compact, surface-mount solution for applications that require robust operation in demanding environments.

Designed for mission-critical and radiation-prone environments, the RT4G150 family provides architectural features such as 4-input LUT logic elements, embedded DSP resources and high-speed serial links—enabling complex signal processing, interface bridging and control functions where reliability and deterministic performance matter.

Key Features

  • Core Logic — 151,824 logic elements (registers) with 4-input LUTs and fast carry chains; fabric performance up to 300 MHz as specified for the RTG4 family.
  • Embedded Memory & DSP — 5,325 bits of on-chip RAM and multiple embedded memory options plus multiply-accumulate blocks for DSP workloads up to 300 MHz (RTG4 family characteristics).
  • High‑Speed Serial Interfaces — Native SerDes capability specified at 3.125 Gbps and integrated DDR2/DDR3/LPDDR memory controller support (family-level features).
  • I/O and Package — 720 user I/O pins; supplied in a 1657-BFCCGA package (supplier package 1657-CCGA, 42.5 × 42.5 mm); surface-mount package for compact board integration.
  • Power — Core voltage supply range 1.14 V to 1.26 V to match system power rails and design constraints.
  • Temperature & Grade — Military grade device with operating temperature range from −55 °C to 125 °C for use in severe thermal environments.
  • Reliability — Flash-based configuration and architecture hardened by design against radiation-induced single-event upsets (SEUs) for use in radiation-prone applications (RTG4 family).
  • Compliance — RoHS compliant.

Typical Applications

  • Space and Aerospace Systems — Radiation-hardened FPGA fabric and SEU-resistant architecture make this device suitable for on-board data processing, telemetry handling and control electronics in spaceflight and high-altitude platforms.
  • Medical and Nuclear Instrumentation — Military-grade temperature range and hardened configuration support reliable real-time processing and safety-related control logic in medical imaging and nuclear plant monitoring equipment.
  • High‑Speed Data Interfaces — Built-in SerDes (3.125 Gbps) and DDR memory controller support enable protocol bridging, high-speed telemetry and interface aggregation for communication systems.
  • Ruggedized Embedded Control — Surface-mount 1657-BFCCGA packaging, extensive I/O (720 pins), and broad operating temperature range suit rugged embedded control, signal conditioning and sensor interface designs.

Unique Advantages

  • Radiation‑Hardened Architecture: Hardened-by-design configuration and flash-based fabric reduce vulnerability to SEUs, improving reliability in radiation-prone environments.
  • High Logic Density: 151,824 logic elements provide substantial on-chip logic resources for complex, high-throughput designs without extensive external glue logic.
  • Integrated High‑Speed Interfaces: Native SerDes and memory controller support simplify board-level design for high-bandwidth data paths.
  • Wide Temperature & Military Grade: −55 °C to 125 °C operating range and military grade classification address demanding thermal and reliability requirements.
  • Compact, High‑Pin Package: 1657-BFCCGA (42.5 × 42.5 mm supplier package) with 720 I/Os enables dense system integration while maintaining abundant external connectivity.

Why Choose RT4G150-1CGG1657M?

The RT4G150-1CGG1657M positions itself as a high-density, radiation-tolerant FPGA for designs that require robust, deterministic processing in harsh environments. With 151,824 logic elements, embedded memory and DSP resources, and native high-speed serial and memory interfaces, this device is suited for satellite subsystems, avionics, critical medical electronics and industrial control systems where uptime and resilience are essential.

Backed by Microchip's RTG4 family documentation and production status, the RT4G150-1CGG1657M offers a scalable platform for long-term programs that demand reliability, integration and predictable performance across a wide operating range.

Request a quote or submit a product inquiry to evaluate RT4G150-1CGG1657M for your next high-reliability FPGA design.

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