RT4G150-1CGG1657E

RT4G150-1CGG1657E
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BFCCGA

Quantity 651 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time44 Weeks
Datasheet

Specifications & Environmental

Device Package1657-CCGA (42.5x42.5)GradeExtendedOperating Temperature-55°C – 125°C
Package / Case1657-BFCCGANumber of I/O720Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-1CGG1657E – RTG4 Field Programmable Gate Array (FPGA) IC

The RT4G150-1CGG1657E is a flash-based RTG4 FPGA from Microchip Technology, offering a hardened FPGA fabric with high-performance serial and memory interfaces on a single chip. It targets applications that require radiation-tolerant configuration and robust operation across extreme environments such as space flight (LEO, MEO, GEO, HEO, deep space), high-altitude aviation, medical electronics, and nuclear power plant control.

Built with 151,824 logic elements and embedded DSP and memory resources, this device delivers up to 300 MHz fabric and DSP performance and includes native SerDes and DDR memory controller support for high-throughput system designs.

Key Features

  • Logic Fabric — 151,824 logic elements with 4-input LUTs and fast carry chains; architecture supports fabric performance up to 300 MHz as documented for the RTG4 family.
  • Embedded Memory — Approximately 5,325 bits of on-chip RAM across multiple embedded memory options for configuration and data buffering.
  • DSP Capability — Embedded multiply-accumulate blocks supporting digital signal processing up to 300 MHz.
  • High-Speed Serial Interfaces — Native SerDes capability supporting 3.125 Gbps serial links for high-throughput communication.
  • Memory Interfaces — Support for double data rate memory controllers including DDR2/DDR3/LPDDR as described for RTG4 devices.
  • Package and I/O — 1657-BFCCGA package (supplier device package: 1657-CCGA, 42.5×42.5 mm) with 720 I/O pins, surface-mount mounting.
  • Power and Temperature — Nominal core supply range 1.14 V to 1.26 V; operating temperature range −55°C to 125°C (extended grade).
  • Reliability and Radiation Hardening — Flash-based configuration and register hardening designed to resist radiation-induced configuration upsets for use in harsh radiation environments.
  • Compliance — RoHS compliant.

Typical Applications

  • Space Systems — Radiation-hardened configuration and SerDes interfaces make it suitable for satellite payload electronics and deep-space instruments requiring long-term reliability.
  • High-Altitude Avionics — Extended temperature range and radiation-resistant design support avionics systems operating at high altitude.
  • Medical Electronics — Use in medical instrumentation where robust operation in demanding environments and precise DSP capabilities are needed.
  • Nuclear Power Control — Designed for control and monitoring applications in nuclear environments where resistance to configuration upsets is required.

Unique Advantages

  • Radiation-Resistant Configuration: Flash-based FPGA fabric and hardened registers reduce susceptibility to radiation-induced configuration upsets, supporting mission-critical deployments in harsh environments.
  • High Logic Density: 151,824 logic elements enable complex algorithms, large state machines, and high-channel-count processing on a single device.
  • Integrated High-Speed I/O: 720 I/O pins and native SerDes (3.125 Gbps) simplify system-level high-bandwidth interconnect without external SerDes components.
  • DSP-Ready Architecture: Embedded multiply-accumulate blocks and memory resources support DSP workloads up to 300 MHz, reducing the need for external processors for certain signal-processing tasks.
  • Rugged Operating Range: Extended grade operation from −55°C to 125°C and a defined core voltage range (1.14 V–1.26 V) support demanding thermal and power environments.
  • Compact, High-Count Package: 1657-BFCCGA / 1657-CCGA 42.5×42.5 mm package delivers high I/O and logic capacity in a surface-mount form factor.

Why Choose RT4G150-1CGG1657E?

This RTG4 FPGA variant is positioned for designs that require a combination of high logic density, DSP capability, and resistance to radiation-induced configuration upsets. With extensive I/O, high-speed serial links, and support for DDR memory interfaces, it is suitable for complex, bandwidth-intensive systems deployed in extreme and radiation-prone environments.

Engineers designing mission-critical avionics, spaceborne instruments, medical equipment, or nuclear control systems can rely on the RT4G150-1CGG1657E for deterministic performance, rugged operating range, and a compact package that consolidates functions to reduce system complexity.

Request a quote or submit an inquiry to receive pricing and availability details for RT4G150-1CGG1657E and to discuss how this FPGA can fit your next design.

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