P1AFS600-2FGG484

The P1AFS600-2FGG484 is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology designed for commercial electronic applications. It provides a mid-range logic capacity with 13,824 logic elements, approximately 0.11 Mbits of embedded RAM, and up to 172 general-purpose I/O pins in a compact 484-FPBGA (23×23) package.

Targeted for commercial-grade designs, this surface-mount FPGA operates from a 1.425 V to 1.575 V supply and supports an ambient operating temperature range of 0 °C to 85 °C. The device is RoHS compliant for environmentally conscious designs.

Key Features

• Logic Capacity 13,824 logic elements (cells) providing a total gate equivalence of 600,000 gates for implementing medium-complexity custom logic.
• Embedded Memory Approximately 0.11 Mbits (110,592 total RAM bits) of on-chip RAM to support local buffering, FIFOs, and small data stores.
• I/O Density Up to 172 I/O pins to support multiple interfaces and peripheral connections on a single device.
• Package and Mounting 484-FPBGA (23×23) package case in a surface-mount form factor for high-density PCB layouts.
• Power Narrow core supply window of 1.425 V to 1.575 V to match system power-rail requirements and enable stable core operation.
• Operating Conditions Commercial-grade operating temperature range of 0 °C to 85 °C, suitable for consumer and many commercial embedded applications.
• Compliance RoHS compliant for adherence to common environmental standards.

Typical Applications

• Commercial Embedded Systems — Implements control logic, custom peripherals, and interface glue logic where a commercial temperature range and mid-range logic capacity are required.
• Consumer Electronics — Provides configurable I/O and on-chip RAM for feature-rich consumer devices that benefit from moderate logic and memory resources.
• Interface Bridging and Protocol Conversion — Uses the device's 172 I/O pins and logic elements to map between different buses and peripherals within a single FPGA.
• Prototyping and Low-Volume Production — Suitable for proof-of-concept and commercial product builds where a single-chip programmable solution reduces component count.

Unique Advantages

• Balanced Logic and Memory — 13,824 logic elements combined with 110,592 RAM bits provides a balanced resource mix for control, protocol, and data buffering tasks.
• High I/O Count — 172 I/O pins enable direct connections to multiple peripherals and interfaces without external multiplexing hardware.
• Compact, High-Density Package — 484-FPBGA (23×23) package allows for a compact PCB footprint while supporting substantial I/O and logic resources.
• Commercial-Grade Readiness — Rated for 0 °C to 85 °C operation and RoHS compliant to suit mainstream commercial product requirements.
• Tightly Specified Core Voltage — 1.425 V to 1.575 V supply range supports stable core operation within defined power rails.

Why Choose P1AFS600-2FGG484?

The P1AFS600-2FGG484 positions itself as a mid-range, commercially focused FPGA that balances logic density, embedded RAM, and a high I/O count in a compact 484-FPBGA package. Its specification set suits designers looking to consolidate control logic, interface functions, and small data buffers into a single programmable device.

Produced by Microchip Technology and provided with supporting documentation, this Fusion® FPGA is appropriate for commercial product designs and prototypes that require measurable logic capacity, predictable operating conditions, and RoHS compliance.

Request a quote or submit an inquiry to our sales team to discuss pricing, availability, and how P1AFS600-2FGG484 can fit your next commercial FPGA design.