P1AFS600-2FGG256

The P1AFS600-2FGG256 is a Fusion® Field Programmable Gate Array (FPGA) IC by Microchip Technology that combines mid-range logic density with on-chip memory and a broad I/O count in a compact ball-grid array package. It is specified for commercial-grade applications and is designed for surface-mount assembly in a 256-LBGA (supplier package: 256-FPBGA, 17×17) footprint.

Key on-chip resources include 13,824 logic elements, approximately 0.11 Mbits of embedded memory, and 119 general-purpose I/Os, delivering a balanced platform for configurable digital functions within a 1.425–1.575 V core supply and a 0 °C to 85 °C operating range.

Key Features

• Logic Resources  Provides 13,824 logic elements (CLBs) and a gate-equivalent count of 600,000 for implementing mid-range programmable logic functions.
• Embedded Memory  Approximately 0.11 Mbits of on-chip RAM (110,592 bits) for storing state, buffers, and small lookup tables directly on the FPGA fabric.
• I/O Capability  119 available I/Os to support a variety of external interfaces and peripherals in compact designs.
• Power  Core voltage supply range of 1.425 V to 1.575 V to match system power design requirements.
• Package and Mounting  256-LBGA package (supplier device package: 256-FPBGA, 17×17) optimized for surface-mount PCB assembly and space-constrained boards.
• Operating Conditions  Commercial-grade operation from 0 °C to 85 °C, suitable for temperature-controlled commercial products.
• Compliance  RoHS-compliant design to meet modern environmental and manufacturing requirements.

Typical Applications

• Commercial Embedded Systems  Use the device's 13,824 logic elements and 119 I/Os to implement custom control, glue logic, and peripheral aggregation in commercial electronics.
• Protocol Bridging and I/O Expansion  Leverage the ample I/O count and on-chip memory for protocol conversion, bus interfacing, and I/O buffering tasks.
• Custom Logic Acceleration  Employ the FPGA fabric to offload deterministic logic functions or small datapath acceleration within a compact 256-LBGA footprint.

Unique Advantages

• Balanced Logic and Memory:  13,824 logic elements paired with approximately 0.11 Mbits of embedded RAM provide room for both combinational and stateful designs without external memory.
• High I/O Count in a Compact Package:  119 I/Os in a 256-LBGA (17×17 FPBGA) enable dense connectivity while preserving board area.
• Commercial-Grade Reliability:  Specified for 0 °C to 85 °C operation to match the requirements of mainstream commercial products.
• Controlled Core Voltage Range:  A defined supply window (1.425–1.575 V) simplifies power-supply planning and system integration.
• RoHS Compliant:  Supports environmental and manufacturing compliance for global commercial production.

Why Choose P1AFS600-2FGG256?

The P1AFS600-2FGG256 delivers a practical combination of logic density, embedded memory, and I/O count in a compact 256-LBGA package, tailored for commercial-grade programmable logic needs. It is well suited for designers who require mid-range FPGA resources for control, interfacing, and custom logic within a defined power and temperature envelope.

Choosing this FPGA provides a straightforward building block for commercial embedded designs that need on-chip RAM, significant I/O capability, and RoHS-compliant manufacturing, all in a surface-mount friendly form factor.

Request a quote or submit a sales inquiry to receive pricing and availability for the P1AFS600-2FGG256.