P1AFS600-2FG484

The P1AFS600-2FG484 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology featuring a mid-density logic fabric and 172 user I/Os in a compact 484-BGA package. With 13,824 logic elements, approximately 0.11 Mbits of embedded memory and a 600,000-gate equivalent, it targets designs that require flexible, reprogrammable logic and significant I/O in a surface-mount form factor.

Commercial-grade with RoHS compliance and a defined supply/temperature envelope, this device is suited to applications where predictable electrical and environmental specifications are required for system-level integration.

Key Features

• Logic Capacity — 13,824 logic elements and a 600,000-gate equivalent provide a mid-density programmable fabric for implementing custom logic functions and moderate system-level integration.
• Embedded Memory — Approximately 0.11 Mbits (110,592 bits) of on-chip RAM for data buffering, state machines, and small lookup tables.
• I/O Count — 172 user I/Os to support multiple interfaces, peripheral connections, and board-level signal routing.
• Power Supply — Specified supply voltage range of 1.425 V to 1.575 V to match system power domains and ensure stable operation within that envelope.
• Package & Mounting — 484-BGA package (supplier device package: 484-FPBGA, 23×23) in a surface-mount format for compact PCB layouts and high-density board designs.
• Operating Conditions & Grade — Commercial grade with an operating temperature range of 0°C to 85°C, enabling deployment in non-industrial, temperature-controlled environments.
• Regulatory Compliance — RoHS compliant, supporting environmentally conscious assembly and regulatory requirements.

Typical Applications

• Embedded Control Systems — Implement custom control logic and I/O aggregation using the device’s 13,824 logic elements and 172 I/Os for compact embedded platforms.
• Peripheral Bridging and Glue Logic — Use the FPGA to bridge multiple digital interfaces and perform protocol conversion or timing adaptation within the available logic and memory resources.
• Prototyping and Development — Employ the reprogrammable fabric for iterative hardware/software co-design and validation where moderate logic density and plentiful I/O are needed.

Unique Advantages

• Balanced Logic and I/O Density — 13,824 logic elements paired with 172 I/Os deliver a balance between programmable logic capacity and external connectivity for medium-complexity designs.
• Compact, High-Density Package — 484-BGA (23×23) enables space-efficient PCB integration while retaining a large I/O count for board-level routing flexibility.
• Defined Power Envelope — Narrow supply range (1.425 V to 1.575 V) simplifies power budgeting and voltage-domain planning in system designs.
• Commercial-Grade Assurance — Specified operating temperature of 0°C to 85°C and RoHS compliance support predictable behavior in commercial applications.
• On-Chip Memory for Local Data Handling — Approximately 0.11 Mbits of embedded RAM provides local storage for buffering, FIFOs, and small datasets without external memory.

Why Choose P1AFS600-2FG484?

The P1AFS600-2FG484 positions itself as a mid-density, commercially graded Fusion® FPGA that combines a substantial logic element count with a high I/O complement in a 484-BGA surface-mount package. Its specified supply voltage range, operating temperature window, and RoHS compliance make it appropriate for commercial electronics requiring reliable, reprogrammable logic and on-chip memory.

This device is suited to designers and teams building embedded control systems, interface bridging solutions, or prototype platforms that need reconfigurable hardware within a constrained board footprint and clearly defined electrical/environmental limits.

Request a quote or contact sales to discuss pricing, lead times, and availability for the P1AFS600-2FG484.