P1AFS1500-2FGG484I

The P1AFS1500-2FGG484I is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology configured in a 484-ball BGA package. It integrates 38,400 logic elements and approximately 0.276 Mbits of embedded memory, delivering programmable logic and on-chip RAM in a compact surface-mount footprint.

Designed for industrial-grade use, the device supports up to 223 I/Os, operates from a single 1.425 V to 1.575 V supply, and is specified for operation from −40 °C to 100 °C—making it suitable for designs that require significant I/O density and embedded memory within constrained board space.

Key Features

• Logic Capacity  38,400 logic elements (CLBs) and approximately 1,500,000 equivalent gates provide substantial programmable logic resources for custom digital functions.
• Embedded Memory  Approximately 276,480 bits (≈0.276 Mbits) of on-chip RAM for buffering, state storage, and small data structures.
• I/O  Up to 223 user I/Os to support broad connectivity and peripheral interfacing requirements.
• Package & Mounting  484-FPBGA (23×23) package in a 484-ball BGA case, surface-mount mounting for compact PCB integration.
• Power  Single-core supply range: 1.425 V to 1.575 V to match system power rails and simplify supply design.
• Industrial Temperature Range  Specified operating range from −40 °C to 100 °C for deployment in industrial environments.
• Compliance  RoHS-compliant material and construction.

Typical Applications

• Industrial Control  Use the FPGA’s logic density and 223 I/Os for PLC modules, motor control interfaces, and industrial automation logic.
• Communications and Networking  Implement custom protocol processing, packet buffering and I/O aggregation leveraging the device’s on-chip memory and logic resources.
• Instrumentation and Test Equipment  Deploy the FPGA for signal handling, data capture and custom processing functions within temperature-stressed environments.

Unique Advantages

• High Logic Density: 38,400 logic elements enable complex custom logic implementations without external gate arrays.
• Significant I/O Count: 223 I/Os simplify system integration and reduce the need for external multiplexers or expanders.
• Embedded Memory: Approximately 0.276 Mbits of on-chip RAM supports buffering and state storage close to the logic for lower latency designs.
• Industrial Temperature Capability: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
• Compact BGA Package: 484-FPBGA (23×23) provides a space-efficient solution for high-density board designs.
• RoHS Compliance: Manufactured with RoHS-compliant materials for regulatory and environmental alignment.

Why Choose P1AFS1500-2FGG484I?

The P1AFS1500-2FGG484I balances substantial programmable logic, embedded memory and a high I/O count in a compact industrial-grade BGA package. Its defined supply range and broad operating temperature make it a practical choice for engineers developing rugged, space-constrained systems that require on-board logic flexibility and local memory.

This FPGA is well suited for design teams needing a reliable, integrated programmable fabric with ample I/O and embedded RAM for industrial controls, communications modules, and instrumentation. The combination of logic elements, memory, package density and RoHS compliance provides a scalable option for medium-to-high complexity designs.

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