P1AFS1500-2FG484I

The P1AFS1500-2FG484I is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology, designed for industrial-grade applications. It provides a substantial programmable logic fabric with 38,400 logic elements, approximately 276,480 bits of on-chip RAM, and 223 I/O pins in a compact 484-BGA surface-mount package.

This device targets industrial and embedded systems that require reconfigurable logic capacity, integrated on-chip memory, and a high count of I/Os while operating across a wide temperature range and a narrow core supply window.

Key Features

• Core Logic 38,400 logic elements and 1,500,000 gates deliver significant programmable logic capacity for custom digital functions.
• Embedded Memory Approximately 0.276 Mbits of on-chip RAM (276,480 bits) for local buffering, lookup tables, and small data storage needs.
• IO and Integration 223 I/O pins support extensive peripheral connectivity and signal routing without excessive external interface components.
• Package and Mounting 484-BGA (supplier package: 484-FPBGA, 23×23) in a surface-mount form factor for high-density PCB integration.
• Power Core voltage supply range of 1.425 V to 1.575 V for defined power-domain integration.
• Temperature and Grade Industrial-grade operation from −40 °C to 100 °C and RoHS compliance for regulated production environments.

Typical Applications

• Industrial Control Leverage the industrial temperature rating and high I/O count for control, monitoring, and protocol bridging in automation systems.
• Embedded Processing Use integrated logic and on-chip RAM to implement custom processing blocks, glue logic, or protocol handlers within embedded platforms.
• High-Density Interface Aggregation Employ the 223 I/Os to consolidate multiple sensors, actuators, or peripheral buses into a single FPGA-based interface hub.

Unique Advantages

• High Logic Density: 38,400 logic elements and 1,500,000 gates provide the capacity to implement complex custom logic without external programmable devices.
• On-Chip Memory Reduces BOM: Approximately 0.276 Mbits of embedded RAM can reduce or eliminate the need for some external memory components.
• Extensive I/O Support: 223 I/Os enable flexible connectivity and minimize the need for external multiplexing or GPIO expanders.
• Industrial Reliability: Rated for −40 °C to 100 °C operation to meet the environmental needs of industrial deployments.
• Compact High-Pin-Count Package: 484-FPBGA (23×23) surface-mount package supports dense PCB layouts while delivering many signal pins.

Why Choose P1AFS1500-2FG484I?

The P1AFS1500-2FG484I balances substantial programmable logic resources, on-chip memory, and a high number of I/Os in an industrial-grade, surface-mount 484-BGA package. Its defined core voltage range and temperature rating make it suitable for designers seeking a reliable FPGA building block for industrial and embedded applications.

Manufactured by Microchip Technology and offered as part of the Fusion® FPGA family, this device is appropriate for development efforts that require scalable logic capacity, integrated memory, and robust I/O connectivity in a compact footprint.

Request a quote or submit a request for pricing to obtain lead-time and ordering information for the P1AFS1500-2FG484I.