P1AFS1500-2FG256I

The P1AFS1500-2FG256I is a Fusion® Field Programmable Gate Array (FPGA) IC providing reconfigurable logic resources in a 256-LBGA package. It delivers 38,400 logic elements, approximately 0.276 Mbits of embedded memory, 119 user I/O pins and 1,500,000 gates for dense, application-specific logic implementation.

Specified for industrial use, the device supports surface-mount assembly and operates over a supply range of 1.425 V to 1.575 V and a temperature range of −40 °C to 100 °C, making it suitable for designs requiring programmable logic within those electrical and environmental limits.

Key Features

• Logic Capacity  38,400 logic elements provide substantial resources for implementing custom digital logic, state machines and datapath functions.
• Embedded Memory  Approximately 0.276 Mbits of on-chip RAM to store buffers, lookup tables and small data structures without external memory.
• I/O Density  119 user I/O pins support a variety of peripheral and signal interfacing needs within a single device.
• Gate Count  1,500,000 gates for complex logic integration and medium-complexity SoC-style functions.
• Package and Mounting  256-LBGA package (supplier package: 256-FPBGA, 17×17) in a surface-mount form factor for compact board designs.
• Power  Core supply range of 1.425 V to 1.575 V for controlled power design and integration with platform power rails.
• Operating Range  Industrial-grade temperature support from −40 °C to 100 °C for deployments in demanding environments.
• Compliance  RoHS compliant to meet environmental and materials requirements.

Typical Applications

• Industrial Control  Implement custom control logic, I/O aggregation and protocol bridging using the available logic elements and I/O count within the industrial temperature range.
• Communications Interfaces  Build medium-complexity interface logic and peripheral timing with on-chip memory to buffer data streams and manage signal timing.
• Embedded System Glue Logic  Consolidate discrete logic, bus arbitration and custom timing functions into a single FPGA to reduce BOM and board area.

Unique Advantages

• Substantial Logic Resources:  38,400 logic elements and 1,500,000 gates enable integration of sizable custom digital functions in one device.
• On-Chip Memory:  Approximately 0.276 Mbits of embedded RAM reduces dependence on external memory for small buffers and LUT storage.
• Industrial Temperature Range:  Specified support from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact Surface-Mount Package:  256-LBGA (256-FPBGA, 17×17) balances I/O density and PCB footprint for space-constrained designs.
• Controlled Core Voltage:  Narrow supply range (1.425 V–1.575 V) simplifies power-rail design for the FPGA core.
• Regulatory Compliance:  RoHS compliant to support environmental and manufacturing requirements.

Why Choose P1AFS1500-2FG256I?

The P1AFS1500-2FG256I positions itself as a robust, industrial-grade FPGA option delivering a blend of logic capacity, embedded memory and I/O density in a compact 256-LBGA package. Its specified supply and temperature ranges make it appropriate for engineering teams that need predictable electrical and environmental behavior.

This device is well suited for designers consolidating glue logic, implementing custom interfaces or integrating medium-complexity digital functions on industrial platforms. The combination of on-chip resources and a standardized surface-mount package supports scalable designs and streamlined board integration.

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