P1AFS1500-2FGG256

The P1AFS1500-2FGG256 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology, offering a balance of logic capacity, embedded memory and I/O in a compact surface-mount package. This device targets commercial applications that require configurable logic and moderate on-chip memory with a defined operating voltage and temperature range.

Key Features

• Logic Capacity — 38,400 logic elements (cells) and approximately 1,500,000 equivalent gates provide the programmable resources for implementing custom logic functions.
• Embedded Memory — Approximately 0.276 Mbits of on-chip RAM (276,480 total bits) for buffering, small data stores and state machines.
• I/O Count — 119 general-purpose I/O pins to support multiple peripheral connections and external interfaces.
• Power — Core supply range of 1.425 V to 1.575 V, enabling precise core-voltage design and power planning.
• Package & Mounting — 256-LBGA package; supplier device package listed as 256-FPBGA (17×17). Surface-mount mounting type suitable for compact PCBs.
• Operating Range — Commercial grade operation from 0 °C to 85 °C for typical commercial environments.
• Environmental Compliance — RoHS compliant, aligning with common environmental and manufacturing requirements.

Typical Applications

• Commercial Embedded Systems — Implement application-specific logic and control functions within commercial devices that operate within a 0 °C to 85 °C range.
• Board-Level Glue Logic — Use the FPGA to consolidate multiple discrete logic functions and interface signals into a single programmable device with 119 I/Os.
• Prototyping and Development — Validate and iterate mid-sized logic designs using 38,400 logic elements and on-chip RAM.

Unique Advantages

• Balanced Logic and Memory: 38,400 logic elements combined with approximately 0.276 Mbits of embedded RAM support a wide range of mid-sized designs without external memory for small buffering needs.
• Generous I/O Count: 119 I/O pins allow flexible interfacing to multiple peripherals, sensors and buses on a single device.
• Compact, Surface-Mount Package: 256-LBGA (supplier package 256-FPBGA, 17×17) enables space-efficient board layouts for commercial products.
• Defined Power Envelope: Narrow core voltage range (1.425 V–1.575 V) simplifies power supply specification and stability considerations.
• Commercial Temperature Grade: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
• RoHS Compliant: Meets common environmental compliance requirements for modern electronics manufacturing.

Why Choose P1AFS1500-2FGG256?

The P1AFS1500-2FGG256 provides a practical combination of logic density, on-chip memory and I/O in a compact 256-LBGA surface-mount package, making it well suited for commercial designs that need configurable logic without excessive board area or external memory. Its defined supply range and commercial temperature rating make it straightforward to integrate into established power and thermal plans.

Selected where mid-sized programmable logic, moderate embedded RAM and a high I/O count are required, this Fusion® FPGA option supports development and production use with clear, verifiable specifications from Microchip Technology.

Request a quote or contact sales to discuss pricing, availability and how the P1AFS1500-2FGG256 can fit into your next commercial design.