P1AFS600-2FG256

The P1AFS600-2FG256 is a Fusion® Field Programmable Gate Array (FPGA) IC designed for commercial-grade programmable logic applications. It integrates 13,824 logic elements, approximately 0.11 Mbits of on-chip RAM, and 119 user I/O in a compact 256-LBGA package to deliver moderate-density programmable logic and I/O capability.

With a defined supply voltage range and commercial operating temperature rating, this device is suited to embedded systems and other commercial applications that require configurable logic, on-chip memory, and a high I/O count in a surface-mount BGA footprint.

Key Features

• Core Logic 13,824 logic elements (cells) and approximately 600,000 gates provide a moderate-density programmable fabric for custom logic and control functions.
• On-Chip Memory Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) to support data buffering, state machines, and small embedded memory structures.
• I/O Capability 119 dedicated user I/O pins to support multiple peripheral interfaces, sensor connections, and board-level signal routing requirements.
• Power Defined core voltage supply range of 1.425 V to 1.575 V for the device core.
• Package and Mounting 256-LBGA package; supplier device package listed as 256-FPBGA (17x17). Surface-mount mounting type simplifies PCB assembly in compact designs.
• Operating Range and Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Commercial Embedded Systems – Provides configurable logic and on-chip RAM for control, data handling, and custom hardware acceleration in commercial products.
• I/O Expansion and Interface Bridging – 119 user I/O pins enable broad signal connectivity for sensors, peripherals, and protocol bridging on compact PCBs.
• Custom Control and State Machines – Logic density and on-chip memory support implementation of finite state machines, protocol handlers, and real-time control tasks.

Unique Advantages

• Balanced Logic and Memory: Combination of 13,824 logic elements and 110,592 bits of RAM supports moderately complex logic designs with embedded memory needs.
• High I/O Count in a Compact Package: 119 user I/O delivered in a 256-LBGA footprint enables dense board layouts without sacrificing connectivity.
• Defined Power Envelope: Narrow core supply range (1.425 V–1.575 V) simplifies power rail planning and design control.
• Commercial Temperature Rating: Rated 0 °C to 85 °C and marked as commercial grade for mainstream embedded product deployments.
• RoHS Compliant: Meets common environmental requirements for lead-free assembly and regulatory conformity.

Why Choose P1AFS600-2FG256?

The P1AFS600-2FG256 positions itself as a compact, commercial-grade FPGA solution that balances logic density, on-chip memory, and a substantial I/O complement within a 256-LBGA package. It is appropriate for designers who need moderate programmable logic resources and flexible I/O in space-constrained embedded designs.

With a clear supply voltage range, commercial operating temperature, and RoHS compliance, this device offers a verifiable specification set for procurement and design planning. Detailed series-level documentation is available from the manufacturer for designers seeking further technical guidance.

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