P1AFS600-2FG484I

The P1AFS600-2FG484I is a Fusion® Field Programmable Gate Array (FPGA) offered in a 484-BGA surface-mount package. It integrates a high-density programmable fabric with on-chip memory and a large number of user I/O, making it suitable for industrial-grade embedded systems.

Key hardware attributes include 13,824 logic elements (approximately 600,000 gates), 110,592 bits of embedded RAM, 172 I/O, a 484-FPBGA (23×23) package, a nominal supply window of 1.425 V to 1.575 V, and an industrial operating range of −40 °C to 100 °C.

Key Features

• Core Logic  Contains 13,824 logic elements implemented across approximately 600,000 gates to support complex programmable logic designs.
• Embedded Memory  Approximately 0.11 Mbits (110,592 bits) of on-chip RAM for buffering and state storage within the FPGA fabric.
• I/O Capacity  172 user I/O pins to accommodate multiple parallel interfaces and external peripherals.
• Package & Mounting  484-FPBGA (23×23) 484-BGA, surface-mount package for compact, high-density board integration.
• Power  Specified supply voltage range of 1.425 V to 1.575 V.
• Operating Range & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C.

Unique Advantages

• High logic density: 13,824 logic elements and ~600,000 gates let you consolidate multiple functions into a single FPGA footprint.
• On-chip memory: Approximately 0.11 Mbits of embedded RAM reduces the need for external memory in many control and buffering tasks.
• Generous I/O: 172 I/O simplifies interfacing to sensors, actuators, and external logic without extensive external glue logic.
• Industrial-ready thermal range: Rated from −40 °C to 100 °C to meet the demands of robust industrial deployments.
• Compact, high-pin-count package: 484-FPBGA (23×23) surface-mount package balances pin count and board area for dense designs.

Why Choose P1AFS600-2FG484I?

The P1AFS600-2FG484I positions itself as a balanced, industrial-grade FPGA option where a combination of logic capacity, embedded memory, and substantial I/O count is required in a compact BGA package. Its specified supply and temperature ranges make it suitable for designs that must operate reliably across a wide set of environmental conditions.

This device is well suited for engineers and procurement teams seeking a programmable logic solution that offers on-chip resources to reduce external components while maintaining high I/O density and industrial temperature capability.

Request a quote or submit a pricing inquiry to begin specifying the P1AFS600-2FG484I for your next design.