P1AFS600-2FGG256I

The P1AFS600-2FGG256I is a Fusion® Field Programmable Gate Array (FPGA) offering a balance of programmable logic capacity, embedded memory, and I/O density in a compact 256-LBGA package. Designed for industrial applications, this surface-mount FPGA provides a fixed core of logic elements and on-chip RAM for implementing custom digital functions, interfaces and control logic.

Key attributes include 13,824 logic elements, approximately 0.11 Mbits of embedded memory, 119 I/O pins and an operating range suited to industrial environments. The device operates from a 1.425 V to 1.575 V supply and is rated for −40 °C to 100 °C ambient temperature.

Key Features

• Core Logic 13,824 logic elements (cells) providing programmable logic resources for custom digital designs and control functions.
• Embedded Memory Approximately 0.11 Mbits of on-chip RAM for data buffering, state storage and small lookup tables.
• I/O Density 119 I/O pins to support multiple peripheral interfaces, signal routing and external device connections.
• Logic Capacity Approximately 600,000 gates of logic capacity for implementing medium-complexity designs.
• Power Supply Single-core supply range of 1.425 V to 1.575 V for the FPGA core.
• Package & Mounting 256-LBGA package (supplier device package: 256-FPBGA, 17 × 17 mm) intended for surface-mount assembly.
• Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C.
• Compliance RoHS compliant.

Typical Applications

• Industrial Control — Implement control logic, protocol bridging and I/O aggregation in automation systems using the device's logic elements and 119 I/Os within an industrial temperature range.
• Embedded Data Processing — Use on-chip RAM and programmable logic to perform custom data buffering, preprocessing or signal conditioning tasks in embedded systems.
• Interface Conversion — Leverage the I/O count and programmable gates to create protocol adapters or custom peripheral interfaces in constrained PCB footprints.

Unique Advantages

• Compact, high-density packaging: 256-LBGA (17 × 17 mm) package enables integration into space-constrained boards while providing substantial I/O and logic resources.
• Industrial temperature rating: −40 °C to 100 °C specification supports deployments in demanding environmental conditions.
• Balanced logic and memory: 13,824 logic elements coupled with approximately 0.11 Mbits of embedded RAM support a wide range of medium-complexity designs without external memory.
• Ample I/O for integration: 119 I/O pins allow flexible interfacing to sensors, actuators and external peripherals.
• RoHS compliant: Meets environmental compliance requirements for modern manufacturing processes.

Why Choose P1AFS600-2FGG256I?

The P1AFS600-2FGG256I positions itself as a practical FPGA solution for industrial and embedded designs that require a moderate amount of programmable logic, embedded memory and generous I/O in a compact, surface-mount package. Its specified core voltage range and industrial temperature qualification make it suitable for applications where environmental resilience and predictable electrical characteristics are important.

Engineers and procurement teams looking for a reliably specified FPGA with clear logic, memory and I/O counts will find the P1AFS600-2FGG256I provides predictable resources for scaling designs and integrating custom digital functions while maintaining compliance with RoHS requirements.

Request a quote or submit a sales inquiry to evaluate the P1AFS600-2FGG256I for your next design.