P1AFS600-2FG256I

The P1AFS600-2FG256I is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology, offering a balanced combination of logic capacity, embedded memory, and I/O in a compact 256-LBGA package. It provides 600,000 gates across 13,824 logic elements and 110,592 bits of on-chip RAM (approximately 0.11 Mbits) for custom digital logic implementation.

Designed for industrial applications, the device features 119 I/O, a surface-mount 256-FPBGA (17×17) package, a low-voltage supply range of 1.425 V to 1.575 V, and an operating temperature range of −40 °C to 100 °C, making it suitable for designs that require moderate logic density and reliable operation across extended temperatures.

Key Features

• Logic Capacity 600,000 gates implemented as 13,824 logic elements, providing programmable resources for custom digital functions and control logic.
• Embedded Memory 110,592 bits of on-chip RAM (approximately 0.11 Mbits) to support buffering, state storage, and small data tables without external memory.
• I/O Count 119 user I/O pins to interface with peripherals, sensors, and external devices.
• Package & Mounting 256-LBGA (256-FPBGA, 17×17) surface-mount package for a compact PCB footprint and reliable soldered connections.
• Power Core supply range of 1.425 V to 1.575 V for the device core voltage domain.
• Thermal & Grade Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for harsher environments.
• Manufacturer Supplied by Microchip Technology as part of the Fusion FPGA family.

Typical Applications

• Industrial Control — Use the FPGA’s logic elements and 119 I/O for custom motor control, sensor interfacing, and machine automation where extended temperature range is required.
• Communications & Networking — Implement protocol bridging, packet handling, or custom data processing functions using the available logic capacity and on-chip RAM.
• Test & Measurement — Deploy custom timing, data capture, and preprocessing logic in a compact 256-LBGA package for lab or field instruments.
• Embedded System Prototyping — Rapidly prototype digital subsystems and I/O-rich designs that benefit from programmable logic and embedded memory.

Unique Advantages

• Highly integrated FPGA resources: 600,000 gates and 13,824 logic elements deliver programmable capacity for a wide range of custom digital functions.
• On-chip RAM for local storage: 110,592 bits of embedded memory reduce dependence on external memory for small buffers and state machines.
• Generous I/O availability: 119 I/O pins enable direct interfacing to multiple peripherals and sensors without extensive I/O expansion.
• Industrial temperature range: Rated from −40 °C to 100 °C to support deployment in demanding environments.
• Compact surface-mount package: 256-LBGA (17×17) package balances PCB area and thermal performance for space-constrained designs.
• Low-voltage core operation: Core supply range of 1.425 V to 1.575 V aligns with modern power-optimized system designs.

Why Choose P1AFS600-2FG256I?

The P1AFS600-2FG256I is positioned for designers who need a mid-density, industrial-grade FPGA with a solid mix of logic, embedded memory, and I/O in a compact package. Its combination of 600k gates, 13,824 logic elements, and 119 I/O pins makes it suitable for control, data-processing, and interfacing tasks while the −40 °C to 100 °C rating and surface-mount 256-LBGA package support deployment in tougher environments.

As part of Microchip Technology’s Fusion FPGA family, this device provides a predictable platform for applications that require on-chip resources and industrial temperature capability, helping teams streamline BOM and conserve PCB space while delivering the programmability needed for custom digital designs.

Request a quote or submit an inquiry for P1AFS600-2FG256I to discuss pricing, lead times, and availability for your next design.