P1AFS1500-2FGG256I

The P1AFS1500-2FGG256I is a Fusion® Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial-grade programmable logic applications. It delivers 38,400 logic elements, approximately 0.276 Mbits of embedded memory, and 1,500,000 gates to implement custom digital functions, glue logic, and I/O handling within electronic systems.

With 119 user I/O pins, a 256‑LBGA/256‑FPBGA (17×17) package, and a vendor-specified supply range of 1.425 V to 1.575 V, this surface-mount FPGA is targeted at applications that require reliable programmable logic across an extended temperature range.

Key Features

• Core Logic  38,400 logic elements (LEs) and 1,500,000 gates provide a programmable fabric for implementing custom digital functions and combinational/sequential logic.
• Embedded Memory  Approximately 0.276 Mbits of on-chip RAM to support small buffers, state machines, and fast local data storage.
• I/O  119 user I/O pins to interface with external peripherals, sensors, and system buses for flexible connectivity.
• Power  Single supply voltage range of 1.425 V to 1.575 V to meet the device’s core power requirements.
• Package & Mounting  256‑LBGA (supplier device package: 256‑FPBGA, 17×17) in a surface-mount form factor for compact board-level integration.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C to suit temperature-demanding environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control  Implement custom control logic, sequencing, and interface glue for motor drives, PLCs, and factory automation systems operating across −40 °C to 100 °C.
• Communications Interfaces  Bridge and adapt signals between sensors, peripherals, and host processors using the FPGA’s programmable I/O and logic resources.
• Prototyping & Development  Validate hardware algorithms and timing-critical logic in development platforms where quick design iteration and reprogrammability are required.
• Custom Embedded Logic  Integrate application-specific accelerators, state machines, or protocol handling to reduce external component count and simplify PCB design.

Unique Advantages

• High logic capacity: 38,400 logic elements enable substantial on-chip implementation of digital designs without immediate reliance on external logic ICs.
• On-chip RAM for local buffering: Approximately 0.276 Mbits of embedded memory supports small FIFO/buffer requirements and state storage close to logic, improving latency.
• Flexible I/O footprint: 119 user I/O pins offer broad interfacing options to accommodate diverse peripheral connections and board-level routing choices.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C supports deployment in temperature-challenging environments typical of industrial applications.
• Compact package: 256‑LBGA/256‑FPBGA (17×17) surface-mount package helps minimize board area while providing a robust leadless package for production assembly.
• RoHS compliant: Meets environmental regulation requirements for lead-free manufacturing and assembly processes.

Why Choose P1AFS1500-2FGG256I?

The P1AFS1500-2FGG256I combines a substantial logic element count, embedded RAM, and a sizeable I/O complement in a compact 256‑LBGA package to address designs that need on-board programmability and reliable operation across industrial temperatures. Its defined supply range and surface-mount package make it suitable for tightly integrated embedded systems where programmable logic reduces BOM and simplifies design iterations.

Backed by Microchip Technology, this FPGA is well suited to engineers building industrial control, communications, and custom embedded logic solutions that benefit from field-updatable logic, deterministic local memory, and a robust operating temperature window.

Request a quote or submit a purchase inquiry to learn about availability, pricing, and lead times for the P1AFS1500-2FGG256I. Our team can provide ordering information and support for your design evaluation and production needs.