P1AFS1500-2FG484

The P1AFS1500-2FG484 is a Fusion® Field Programmable Gate Array from Microchip Technology provided in a 484-FPBGA (23×23) package. It delivers a high-density, reconfigurable logic resource set suitable for designs that require significant on-chip logic, I/O capacity and embedded memory in a compact surface-mount BGA footprint.

Key on-chip resources include 1,500,000 gates, 38,400 logic elements and approximately 0.276 Mbits of embedded RAM, along with 223 general-purpose I/O. The device is specified for commercial-grade operation and RoHS compliance.

Key Features

• Core Logic  1,500,000 gates and 38,400 logic elements provide substantial programmable logic capacity for complex custom functions.
• Embedded Memory  Approximately 0.276 Mbits of on-chip RAM to support buffering, state storage and intermediate data processing.
• I/O Count  223 available I/O pins to interface with peripherals, sensors and external devices.
• Package & Mounting  484-FPBGA (23×23) / 484-BGA package in a surface-mount form factor for compact board integration.
• Power  Single supply voltage range of 1.425 V to 1.575 V for core operation.
• Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• Environmental Compliance  RoHS compliant for reduced environmental impact in manufacturing and deployment.

Typical Applications

• Embedded Systems  Implement custom logic and protocol bridging where on-chip logic density and multiple I/O are required.
• Prototyping and Development  Use the programmable fabric and abundant logic elements for hardware validation and iterative design.
• Control and Interface Tasks  Leverage the device's I/O count and logic resources for sensor aggregation, motor control interfaces and peripheral management.

Unique Advantages

• High Logic Density: 1,500,000 gates and 38,400 logic elements enable implementation of complex, multi-function designs on a single device.
• On-Chip Memory: Approximately 0.276 Mbits of embedded RAM reduces the need for external memory in many buffering and state-storage tasks.
• Generous I/O Count: 223 I/O pins allow extensive external connectivity without additional multiplexing hardware.
• Compact BGA Package: 484-FPBGA (23×23) package provides a small board footprint while supporting high I/O and signal density.
• Commercial-Grade Specification: Rated for 0 °C to 85 °C operation and RoHS compliant to align with standard commercial product requirements.
• Controlled Core Voltage: Narrow supply window (1.425 V–1.575 V) supports predictable power planning and system integration.

Why Choose P1AFS1500-2FG484?

The P1AFS1500-2FG484 positions itself as a high-density Fusion FPGA option for designers needing substantial programmable logic, a large number of I/Os and on-chip RAM in a compact surface-mount BGA package. Its combination of 1,500,000 gates, 38,400 logic elements and 223 I/O makes it well suited to embedded designs that consolidate functions and reduce component count.

As a Microchip Technology Fusion FPGA offered in a commercial-grade, RoHS-compliant package, it is a practical choice for OEMs and engineering teams targeting scalable, reconfigurable hardware implementations where on-board integration and board-space efficiency are priorities.

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