P1AFS1500-2FGG484

The P1AFS1500-2FGG484 is a Fusion® Field Programmable Gate Array (FPGA) in a 484‑ball BGA package. It provides a mid-range programmable logic resource set, including 38,400 logic elements, approximately 0.276 Mbits of embedded memory (276,480 bits) and 1,500,000 gates, combined with a high I/O count of 223 pins.

Designed for commercial-grade embedded systems, this surface-mount FPGA operates from a 1.425 V to 1.575 V supply and is specified for 0 °C to 85 °C operation. Its combination of logic density, on-chip memory and I/O makes it suitable for designs that require consolidated programmable logic and substantial interfacing capability in a compact package.

Key Features

• Core Capacity  1,500,000 gates and 38,400 logic elements provide substantial programmable logic resources for mid-range FPGA designs.
• Embedded Memory  Approximately 0.276 Mbits of on-chip RAM (276,480 bits) for local data buffering and state storage.
• I/O Density  223 I/O pins to support complex interfacing and multiple peripheral connections.
• Package and Mounting  484‑BGA (supplier package: 484‑FPBGA, 23×23) in a surface-mount form factor for compact PCB layouts.
• Power  Specified core supply range from 1.425 V to 1.575 V to match system power domains.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density I/O systems  Systems requiring up to 223 I/O connections can centralize control and interfacing using this FPGA.
• Mid-range programmable logic  Applications that need substantial logic capacity—38,400 logic elements and 1.5M gates—can implement custom processing and glue logic on-chip.
• Compact embedded boards  The 484‑BGA (23×23) surface-mount package supports space-constrained PCBs where board area and routing density are considerations.

Unique Advantages

• Substantial integrated logic: 38,400 logic elements and 1,500,000 gates deliver a sizable programmable fabric for consolidating functions.
• Sizable on-chip memory: Approximately 0.276 Mbits of embedded RAM supports buffering and temporary data storage without external memory.
• High I/O count: 223 I/O pins provide flexibility for multiple interfaces and peripheral connections.
• Compact BGA package: 484‑BGA (23×23) enables denser board designs while maintaining soldered surface-mount assembly.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C for standard commercial deployments.
• RoHS compliant: Meets common environmental compliance requirements for lead-free assembly.

Why Choose P1AFS1500-2FGG484?

The P1AFS1500-2FGG484 balances mid-range logic capacity, embedded memory and a high I/O count in a compact 484‑BGA package. Its supply voltage window and commercial temperature rating make it appropriate for a wide range of standard embedded applications that require consolidated programmable logic and significant interfacing capability.

This FPGA is suitable for designers seeking a reliable, RoHS‑compliant programmable device with clear on-chip resources—logic elements, gates, RAM and I/O—to support integration and reduce external component needs while maintaining a compact board footprint.

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