P1AFS1500-2FG256
| Part Description |
Fusion® Field Programmable Gate Array (FPGA) IC 119 276480 256-LBGA |
|---|---|
| Quantity | 1,709 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 119 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 38400 | Number of Logic Elements/Cells | 38400 | ||
| Number of Gates | 1500000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 276480 |
Overview of P1AFS1500-2FG256 – Fusion® FPGA, 119 I/Os, 256-LBGA
The P1AFS1500-2FG256 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial embedded applications. It delivers a balance of programmable logic capacity, on-chip memory, and a moderate I/O count in a compact surface-mount 256-LBGA package.
Key device attributes include approximately 38,400 logic elements, roughly 0.276 Mbits of embedded RAM, 119 I/O pins, a supply range of 1.425 V to 1.575 V, and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.
Key Features
- Core Density Approximately 38,400 logic elements (equivalent to 1,500,000 gates) for programmable logic implementations.
- Embedded Memory Approximately 0.276 Mbits of on-chip RAM (276,480 bits) for buffering and state storage.
- I/O Count 119 user I/Os to interface with peripherals, sensors, and external logic.
- Package and Mounting 256-LBGA package (supplier device package: 256-FPBGA 17×17) with surface mount mounting type for compact PCB integration.
- Power Supply Operates from a supply voltage range of 1.425 V to 1.575 V for the core domain.
- Operating Conditions Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High logic capacity: Approximately 38,400 logic elements and 1,500,000 gates enable complex logic and control functions on-chip.
- On-chip memory reduces external BOM: Approximately 0.276 Mbits of embedded RAM minimizes or delays the need for external memory components.
- Generous I/O availability: 119 I/O pins give flexibility for multiple interfaces and peripheral connections without immediate external multiplexing.
- Compact surface-mount package: 256-LBGA (256-FPBGA 17×17) supports dense board layouts and streamlined assembly processes.
- Predictable power specification: Narrow core supply window (1.425 V–1.575 V) simplifies power supply design and margining.
- Commercial-ready compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product deployments.
Why Choose P1AFS1500-2FG256?
P1AFS1500-2FG256 positions itself as a commercially graded FPGA option when you need significant on-chip logic and memory resources combined with a moderate I/O count in a compact surface-mount package. Its specification set—approximately 38,400 logic elements, ~0.276 Mbits embedded RAM, 119 I/Os, and a 256-LBGA footprint—suits embedded designs that require on-board programmability and integration without exceeding commercial temperature requirements.
Manufactured by Microchip Technology and delivered in a RoHS-compliant package, this FPGA is appropriate for designers and procurement teams targeting reliable, scalable logic solutions within standard commercial operating parameters.
Request a quote or submit an inquiry for P1AFS1500-2FG256 by specifying the part number and your required quantity to receive pricing and lead-time information.

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