P1AFS1500-2FG256

IC FPGA 119 I/O 256FBGA
Part Description

Fusion® Field Programmable Gate Array (FPGA) IC 119 276480 256-LBGA

Quantity 1,709 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O119Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs38400Number of Logic Elements/Cells38400
Number of Gates1500000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits276480

Overview of P1AFS1500-2FG256 – Fusion® FPGA, 119 I/Os, 256-LBGA

The P1AFS1500-2FG256 is a Fusion® Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial embedded applications. It delivers a balance of programmable logic capacity, on-chip memory, and a moderate I/O count in a compact surface-mount 256-LBGA package.

Key device attributes include approximately 38,400 logic elements, roughly 0.276 Mbits of embedded RAM, 119 I/O pins, a supply range of 1.425 V to 1.575 V, and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

  • Core Density Approximately 38,400 logic elements (equivalent to 1,500,000 gates) for programmable logic implementations.
  • Embedded Memory Approximately 0.276 Mbits of on-chip RAM (276,480 bits) for buffering and state storage.
  • I/O Count 119 user I/Os to interface with peripherals, sensors, and external logic.
  • Package and Mounting 256-LBGA package (supplier device package: 256-FPBGA 17×17) with surface mount mounting type for compact PCB integration.
  • Power Supply Operates from a supply voltage range of 1.425 V to 1.575 V for the core domain.
  • Operating Conditions Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • High logic capacity: Approximately 38,400 logic elements and 1,500,000 gates enable complex logic and control functions on-chip.
  • On-chip memory reduces external BOM: Approximately 0.276 Mbits of embedded RAM minimizes or delays the need for external memory components.
  • Generous I/O availability: 119 I/O pins give flexibility for multiple interfaces and peripheral connections without immediate external multiplexing.
  • Compact surface-mount package: 256-LBGA (256-FPBGA 17×17) supports dense board layouts and streamlined assembly processes.
  • Predictable power specification: Narrow core supply window (1.425 V–1.575 V) simplifies power supply design and margining.
  • Commercial-ready compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product deployments.

Why Choose P1AFS1500-2FG256?

P1AFS1500-2FG256 positions itself as a commercially graded FPGA option when you need significant on-chip logic and memory resources combined with a moderate I/O count in a compact surface-mount package. Its specification set—approximately 38,400 logic elements, ~0.276 Mbits embedded RAM, 119 I/Os, and a 256-LBGA footprint—suits embedded designs that require on-board programmability and integration without exceeding commercial temperature requirements.

Manufactured by Microchip Technology and delivered in a RoHS-compliant package, this FPGA is appropriate for designers and procurement teams targeting reliable, scalable logic solutions within standard commercial operating parameters.

Request a quote or submit an inquiry for P1AFS1500-2FG256 by specifying the part number and your required quantity to receive pricing and lead-time information.

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