ORT8850L-2BM680C

The ORT8850L-2BM680C is a Field-Programmable System Chip (FPSC) from the ORCA® ORT8850 family, built on the Series 4 reconfigurable embedded System-on-a-Chip architecture. This device combines a programmable FPGA fabric with integrated high-speed backplane transceiver capability for system designs that require both configurable logic and multi-gigabit interconnect.

Targeted at commercial applications, the device provides 4,992 logic elements, approximately 0.076 Mbits of embedded RAM, a large 278-pin I/O count, and an eight-channel transceiver architecture offering up to 850 Mbits/s per channel (aggregate up to 6.8 Gbits/s).

Key Features

• FPGA Logic  4,992 logic elements (user LUTs) for implementing custom logic, protocol handling, and glue logic.
• Embedded Memory  Approximately 0.076 Mbits of on-chip RAM (75,776 bits) to support buffering, packet handling, and state storage.
• High-Speed Backplane Transceiver  Eight-channel transceiver architecture with individual channel rates up to 850 Mbits/s and aggregate bandwidth up to 6.8 Gbits/s; includes clock and data recovery functionality as described in the ORT8850 family datasheet.
• I/O Density  278 user I/O pins to support wide parallel interfaces and mixed serial/parallel system interconnects.
• Package  680-BBGA package; supplier device package listed as 680-FPBGA (35×35) for high-pin-count board integration.
• Power and Supply  Supports supply voltages from 1.425 V to 3.6 V for flexible integration with system power rails.
• Operating Conditions  Commercial grade device specified for 0 °C to 70 °C operation and designed for surface-mount PCB assembly.
• Compliance  RoHS-compliant to meet standard lead-free manufacturing requirements.

Typical Applications

• Backplane Interconnects  Use the integrated eight-channel transceiver for multi-board backplane communication and high-speed board-to-board links.
• Network Termination and Framing  Implement SONET/SDH or other protocol framing and transport-handling logic using the FPGA fabric combined with the device's transceiver and built-in clock recovery.
• Protocol Bridging  Bridge parallel and serial domains or implement protocol-dependent framers and packet processing inside the programmable logic.
• Embedded System Interfaces  Deploy the device where a combination of embedded logic, moderate on-chip RAM, and extensive I/O is required for system glue, control planes, or custom interface logic.

Unique Advantages

• Integrated Transceiver and FPGA Fabric:  Combines programmable logic with an eight-channel backplane transceiver, reducing component count and simplifying board-level design for high-speed interconnects.
• Configurable Logic Density:  4,992 logic elements provide a balance of capacity for protocol handling, custom logic, and peripheral interfacing in a single device.
• High I/O Count:  278 user I/Os enable broad connectivity options for parallel buses, control signals, and mixed-signal interface routing.
• Flexible Voltage Support:  Wide supply range from 1.425 V to 3.6 V allows integration with a range of system power architectures.
• Compact, High-Pin Package:  680-BBGA (680-FPBGA 35×35) offers high pin density for complex systems while remaining surface-mount friendly.
• Commercial-Grade, RoHS Compliant:  Designed for commercial-temperature applications with RoHS compliance for lead-free manufacturing environments.

Why Choose ORT8850L-2BM680C?

The ORT8850L-2BM680C is positioned for designers who need a consolidated solution that pairs programmable FPGA logic with high-speed serial backplane capabilities. Its combination of 4,992 logic elements, substantial I/O, and an eight-channel transceiver makes it suitable for applications that require protocol handling, framing, and board-to-board communications without adding discrete transceiver chips.

Supported by the ORT8850 family design resources referenced in the device datasheet, this part is suited to commercial embedded-system developers looking for a field-programmable platform that delivers configurable logic, multi-gigabit interconnect, and practical power and packaging options for system-level integration.

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