ORT8850L-1BMN680C

IC FPGA 278 I/O 680FBGA
Part Description

ORCA® 4 Field Programmable Gate Array (FPGA) IC 278 75776 4992 680-BBGA

Quantity 370 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package680-FPBGA (35x35)GradeCommercialOperating Temperature0°C – 70°C
Package / Case680-BBGANumber of I/O278Voltage1.425 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs624Number of Logic Elements/Cells4992
Number of Gates397000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of ORT8850L-1BMN680C – ORCA® 4 Field Programmable Gate Array (FPGA) IC, 680‑BBGA

The ORT8850L-1BMN680C is an ORCA® Field-Programmable System Chip (FPSC) from Lattice Semiconductor, combining FPGA logic with integrated high-speed backplane transceivers. Built around the ORT8850 family architecture, the device integrates an eight-channel SERDES backplane transceiver with on-chip Clock and Data Recovery (CDR) and programmable FPGA logic to deliver a compact, reconfigurable interface solution for backplane and high-speed board-level designs.

With 4,992 logic elements, 278 user I/Os, and approximately 75.8 Kbits of embedded memory, this commercially graded, surface-mount 680‑FBPGA (35×35) device targets systems that require dense logic, multi-gigabit backplane lanes, and flexible protocol implementation within a single package.

Key Features

  • FPSC architecture with integrated SERDES – Eight-channel backplane transceiver supporting up to 850 Mbits/s per channel (aggregate up to 6.8 Gbits/s), with built-in Clock and Data Recovery (CDR) for clockless high-speed links.
  • Logic capacity – Approximately 4,992 logic elements and a system gate budget of about 397,000 gates to implement custom logic, framers, and protocol handlers.
  • Embedded memory – Approximately 75.8 Kbits of on-chip RAM across 8 EBR blocks to support packet buffering, FIFOs, and protocol state storage.
  • I/O density – 278 user I/Os to support broad interfacing needs across system buses, control signals, and protocol ports.
  • Package and mounting – 680‑FBPGA (35×35) package in a surface-mount form factor for high-density board integration.
  • Power and operating range – Flexible supply support from 1.425 V to 3.6 V; commercially graded operation from 0 °C to 70 °C.
  • Regulatory and manufacturing – RoHS-compliant construction for modern manufacturing and environmental requirements.

Typical Applications

  • Backplane transceivers and network termination – Integrates SONET/SDH framing and scrambler/descrambler logic with high-speed SERDES for backplane network termination and transport overhead handling.
  • High-speed board-to-board communication – Clockless high-speed interface using built-in CDR and eight SERDES channels to simplify multiboard clock domains and reduce backplane signal count.
  • Protocol and framers – Implement protocol-independent framers, ATM or PoS framers, and HDLC/IP processing within the programmable FPGA logic and embedded memory.
  • Custom embedded SoC integration – Combine FPGA logic and transceiver cores to build configurable interfaces or application-specific bridges (for example, high-bandwidth PCI bridging) on a single FPSC.

Unique Advantages

  • Integrated transceiver + FPGA: Reduces external component count by combining eight SERDES channels and programmable logic in one device, simplifying board design and BOM.
  • Built-in CDR: On-chip Clock and Data Recovery eases clock domain design across boards and improves signal integrity for high-speed links.
  • High I/O and flexible voltage: 278 user I/Os and a wide supply range (1.425 V–3.6 V) allow flexible interfacing and integration into diverse system power architectures.
  • On-chip memory for protocol logic: Approximately 75.8 Kbits of embedded RAM and multiple EBR blocks provide local buffering and state storage for framers and protocol engines.
  • Compact, high-density package: 680‑FBPGA (35×35) surface-mount package supports dense board layouts and modern manufacturing processes.
  • RoHS compliant and commercially graded: Meets environmental requirements for mainstream embedded applications with a commercial temperature rating of 0 °C to 70 °C.

Why Choose ORT8850L-1BMN680C?

The ORT8850L-1BMN680C positions itself as a compact, reconfigurable FPSC that brings high-speed serial connectivity and FPGA programmability together in a single package. Its blend of roughly 4,992 logic elements, integrated eight-channel SERDES with CDR, and embedded memory makes it suited for designers building configurable backplane interfaces, protocol terminators, or high-throughput board-level links where integration and reduced signal count are priorities.

Designed for commercial embedded systems, this ORCA® device offers a balance of I/O capacity, logic resources, and on-chip RAM that supports protocol offload, framing, and custom logic implementations while keeping board-level complexity and part counts lower. It is a practical choice for teams that need a validated FPGA + transceiver building block with RoHS compliance and industry-standard surface-mount packaging.

Request a quote or submit a quote to specify ORT8850L-1BMN680C for your next design project and evaluate its integration benefits for your backplane or high-speed interface application.

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