RT4G150-1CBG1657PROTO

RT4G150-1CBG1657PROTO
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 720 5325 151824 1657-BCBGA

Quantity 28 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Device Package1657-CBGA (42.5x42.5)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case1657-BCBGANumber of I/O720Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-1CBG1657PROTO – RTG4™ Field Programmable Gate Array (FPGA) IC 720 5325 151824 1657-BCBGA

The RT4G150-1CBG1657PROTO is a member of Microchip Technology’s RTG4™ family of flash-based FPGAs. The RTG4 architecture combines hardened FPGA fabric with integrated high-performance interfaces and memory subsystems targeted at applications that require radiation-tolerant configuration and robust operation across extreme environments.

Built for systems that demand high logic density, deterministic DSP performance and high-speed serial links, this device addresses markets such as space flight, high-altitude aviation, medical electronics and nuclear power plant control where radiation resilience and extended temperature operation are required.

Key Features

  • Logic Density — Approximately 151,824 logic elements provide substantial on-chip logic and register resources for complex designs.
  • Embedded Memory — Approximately 5,325 bits of on-chip RAM for fabric storage and small data buffering needs.
  • High I/O Count — 720 user I/O pins to support dense external connectivity and multi-channel interfacing.
  • Radiation-Resilient Fabric — Registers and logic hardened by design against radiation-induced single-event upsets (SEUs), suitable for harsh radiation environments described in RTG4 documentation.
  • Logic Element Architecture — Each logic element includes a 4-input Look-Up Table (LUT4) with fast carry chains; fabric performance characterized to 300 MHz in RTG4 documentation.
  • High-Speed Serial and Memory Interfaces — Native SerDes at 3.125 Gbps and support for double data rate memory controllers (DDR2/DDR3/LPDDR) as outlined in the RTG4 family documentation.
  • DSP Capabilities — Embedded multiply-accumulate blocks and memory options for digital signal processing up to 300 MHz as specified for RTG4 devices.
  • Electrical and Mechanical — Nominal core supply range 1.14 V to 1.26 V; surface-mount package options including 1657-BCBGA / supplier package 1657-CBGA (42.5×42.5 mm).
  • Extended Operating Range — Qualified for operation from −55°C to 125°C and provided in Military grade.
  • Regulatory — RoHS compliant.

Typical Applications

  • Space Systems — Radiation-hardened RTG4 fabric and hardened registers support mission electronics for LEO, MEO, GEO and deep-space platforms.
  • High-Altitude and Avionics — Wide temperature range and radiation resilience make the device suitable for high-altitude flight electronics and avionics subsystems.
  • Medical Electronics — Use in medical systems where high reliability, deterministic DSP and robust interfaces are required.
  • Nuclear and Industrial Control — Designed for control systems operating in radiation-prone or harsh environmental conditions.
  • High-Speed DSP and Memory Interfaces — Applications that use embedded multiply-accumulate blocks, high-speed SerDes and DDR memory controllers for signal processing and buffering.

Unique Advantages

  • Radiation-Hardened Configuration: Fabric and registers are hardened against SEUs, reducing the need for external mitigation in radiation-prone deployments.
  • High Logic Capacity: ~151,824 logic elements provide headroom for large, integration-heavy designs without external logic expansion.
  • Integrated High-Speed I/O: 720 I/Os and native 3.125 Gbps SerDes enable multi-channel, high-throughput system architectures.
  • Deterministic DSP Performance: On-chip MAC blocks and memory options support DSP workloads up to 300 MHz, simplifying signal processing implementations.
  • Wide Temperature and Military Grade: Operation from −55°C to 125°C and military grade designation support demanding environmental requirements.
  • Compact High-Pin Package: 1657-CBGA (42.5×42.5 mm) package delivers high I/O and density in a surface-mount form factor.

Why Choose RT4G150-1CBG1657PROTO?

The RT4G150-1CBG1657PROTO brings together Microchip’s RTG4 flash-based FPGA architecture with radiation-tolerant design elements, high logic density and integrated high-speed interfaces. This combination makes the device well-suited for engineers designing systems that must operate reliably in radiation environments and across extended temperature ranges.

Backed by RTG4 family documentation (datasheet, technical briefs and pin descriptions), the device is positioned for projects that require on-chip DSP, high I/O counts and robust serial/memory interfaces while maintaining configuration resilience in demanding operational contexts.

Request a quote or submit a sales inquiry to evaluate RT4G150-1CBG1657PROTO for your next design and to receive pricing and availability information.

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