P1AFS600-2FGG484I

The P1AFS600-2FGG484I is a Fusion® field programmable gate array (FPGA) from Microchip Technology, provided in a 484-ball BGA package. It delivers a combination of on-chip logic, embedded memory and I/O capacity aimed at designs that require configurable digital logic in an industrial-grade package.

Key device characteristics include 13,824 logic elements, approximately 0.11 Mbits of embedded memory (110,592 total RAM bits), 172 I/Os and a specified supply range of 1.425 V to 1.575 V, all rated for operation from −40 °C to 100 °C.

Key Features

• Core Logic: 13,824 logic elements supporting up to 600,000 gates for implementing custom digital logic and finite-state machines.
• Embedded Memory: Approximately 0.11 Mbits of on-chip RAM (110,592 total RAM bits) for data buffering, state storage and small LUT-based memories.
• I/O Capacity: 172 general-purpose I/Os to interface with peripherals, sensors and external devices.
• Power Supply: Core supply specified from 1.425 V to 1.575 V to match system power rails and ensure stable device operation.
• Package & Mounting: 484-ball BGA (supplier package 484-FPBGA, 23×23) in a surface-mount form factor suitable for compact PCB designs.
• Industrial Temperature Range: Rated for −40 °C to 100 °C operation, supporting deployment in industrial environments.
• Compliance: RoHS compliant to support environmentally constrained designs.

Typical Applications

• Industrial Control & Automation: Implement custom control logic and I/O interfacing using the device's 13,824 logic elements and 172 I/Os while maintaining industrial temperature operation.
• Embedded System Glue Logic: Consolidate discrete logic, protocol bridging and peripheral interfaces into a single FPGA to reduce component count and PCB complexity.
• Prototyping & Custom Digital Designs: Use the programmable fabric and on-chip RAM for evaluation, algorithm development and small-scale production runs.

Unique Advantages

• High logic density: 13,824 logic elements and 600,000 gates provide substantial capacity for custom digital functions within a single device.
• Integrated on-chip memory: Approximately 0.11 Mbits of embedded RAM reduces the need for external memory for small data buffers and state storage.
• Generous I/O count: 172 I/Os enable flexible connectivity options to sensors, peripherals and external controllers.
• Compact BGA packaging: 484-BGA (484-FPBGA, 23×23) allows dense PCB placement while supporting surface-mount assembly processes.
• Industrial-rated operation: Specified for −40 °C to 100 °C, making the device suitable for many industrial applications.
• RoHS compliant: Designed to meet environmental compliance requirements for lead-free assembly.

Why Choose P1AFS600-2FGG484I?

The P1AFS600-2FGG484I positions itself as a flexible, industrial-grade FPGA option for designs that require a balance of logic capacity, embedded memory and a substantial I/O count in a compact BGA package. Its combination of 13,824 logic elements, 110,592 bits of RAM and 172 I/Os supports a wide range of custom digital functions while operating across a broad industrial temperature range.

This device is suitable for engineers and procurement teams looking for a programmable solution from Microchip Technology that integrates logic, memory and I/O in a single component, helping to simplify BOMs and PCB real estate while maintaining RoHS compliance.

Request a quote or submit an inquiry to start the procurement process for P1AFS600-2FGG484I and bring this Fusion® FPGA into your next design.