RT4G150-CGG1657V

The RT4G150-CGG1657V is a flash-based RTG4™ FPGA that pairs a hardened FPGA fabric with high-performance serial and memory interfaces. Built for demanding, reliability-focused applications, it provides a high logic capacity and integrated I/O in a compact 1657-BFCCGA surface-mount package.

Key architecture points include 151,824 logic elements, embedded DSP capabilities and multiple memory options. The device supports high-speed SerDes and DDR memory interfaces while operating over a wide supply and temperature range appropriate for military-grade environments.

Key Features

• Core Architecture  Flash-based RTG4 FPGA fabric with 151,824 logic elements for high-density programmable logic.
• Logic and Performance  Each logic element includes a 4-input LUT and fast carry chains; device-level timing and fabric support are provided in the RTG4 series documentation.
• Embedded Memory and DSP  Total on-chip RAM of 5,325 bits and integrated multiply-accumulate resources for signal processing tasks.
• High-speed Serial and Memory Interfaces  Native SerDes capability at 3.125 Gbps and support for DDR2/DDR3/LPDDR memory controllers for high-throughput I/O and memory subsystems.
• I/O Capacity & Package  720 user I/O pins in a 1657-BFCCGA package (supplier device package: 1657-CCGA, 42.5 × 42.5 mm) in a surface-mount form factor.
• Power  Recommended supply range from 1.14 V to 1.26 V for core operation.
• Temperature & Grade  Military-grade device with an operating temperature range of −55 °C to 125 °C.
• Reliability & Radiation Resistance  RTG4 family devices are described in the product documentation as hardened against radiation-induced configuration upsets and include hardened registers—details available in the RTG4 datasheet.
• RoHS Compliant  Device meets RoHS environmental requirements.

Typical Applications

• Space and Aerospace Systems  Radiation-hardened design characteristics and a wide operating temperature range suit on-board processing, telemetry, and control systems.
• High-altitude and Avionics Electronics  Military-grade operation and high I/O count enable sensor interfaces, data aggregation and processing in airborne platforms.
• Medical and Safety-Critical Control  Hardened registers and robust operating conditions support applications in medical electronics and critical facility control.
• High-Speed Data and Memory Interfaces  Integrated SerDes and DDR memory controller support make the device appropriate for high-throughput communication and buffering functions.

Unique Advantages

• High Logic Density: 151,824 logic elements provide substantial on-chip programmable resources for complex designs.
• Integrated High-speed I/O: Native 3.125 Gbps SerDes and 720 user I/Os reduce the need for external transceivers and simplify board design.
• Designed for Harsh Environments: Military-grade temperature range (−55 °C to 125 °C) and radiation-resistant features address reliability in extreme conditions.
• Compact High-pin Package: 1657-BFCCGA (42.5 × 42.5 mm) offers large I/O counts in a surface-mount footprint suitable for dense system designs.
• Controlled Power Envelope: Core supply operation between 1.14 V and 1.26 V supports predictable power budgeting in system designs.
• Regulatory Compliance: RoHS compliance supports environmental requirements for procurement and deployment.

Why Choose RT4G150-CGG1657V?

The RT4G150-CGG1657V positions itself as a high-density, reliability-focused FPGA choice for applications that require robust operation in challenging environments. Its combination of 151,824 logic elements, integrated high-speed SerDes, and broad temperature specification make it well suited to aerospace, defense, medical and other high-reliability systems.

For designers seeking a scalable, field-programmable platform with significant I/O, hardened registers and on-chip DSP/memory capabilities, the RT4G150-CGG1657V provides a solid foundation with the technical documentation and ecosystem support outlined in the RTG4 family datasheet.

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