RT4G150-CQG352M
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar |
|---|---|
| Quantity | 1,468 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 352-QFP (48x48) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 352-BFCQFP Exposed Pad and Tie Bar | Number of I/O | 166 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150-CQG352M – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar
The RT4G150-CQG352M is a Microchip RTG4™ flash-based FPGA optimized for high-reliability, radiation-tolerant applications. It integrates fourth‑generation flash FPGA fabric with hardened registers and high-performance interfaces on a single device, targeting designs that require robust operation in harsh radiation environments.
With 151,824 logic elements, embedded DSP resources and SerDes communications, this device addresses demanding aerospace, high‑altitude aviation, medical electronics and nuclear control system applications where radiation resilience and temperature range are critical.
Key Features
- Core FPGA Fabric — 151,824 logic elements providing a high-capacity, flash-based fabric; logic elements include 4-input LUTs and fast carry chains for high-performance implementation.
- Radiation Tolerance — Registers and fabric hardened by design against radiation-induced single-event upsets (SEUs), intended for operation in harsh radiation environments including space flight and high-altitude platforms.
- Embedded Memory & DSP — Approximately 5,325 total RAM bits and embedded multiply-accumulate blocks for DSP tasks; fabric and DSP operate up to 300 MHz per device specifications.
- High-speed Serial & Memory Interfaces — Native SerDes communication at 3.125 Gbps and support for DDR2/DDR3/LPDDR memory controllers for high-bandwidth external memory interfacing.
- I/O and Package — 166 user I/O pins in a 352‑BFCQFP exposed pad and tie bar package (supplier package: 352‑QFP, 48 × 48 mm) designed for surface-mount assembly.
- Operating Conditions — Low-voltage core supply range of 1.14 V to 1.26 V and extended operating temperature range from −55 °C to 125 °C, suitable for military-grade environments.
- Compliance — RoHS compliant.
Typical Applications
- Space and Satellite Systems — Radiation-hardened fabric and SEU‑hardened registers make the RT4G150-CQG352M suitable for LEO, MEO, GEO and deep-space electronics where configuration integrity is required.
- High‑Altitude and Aviation Electronics — High-performance logic and SerDes interfaces address avionics telemetry, data acquisition and communication modules operating in high-altitude environments.
- Medical and Nuclear Control — Hardened registers and broad temperature range support critical monitoring and control systems in medical and nuclear power plant applications.
- High‑Reliability Military Systems — Military-grade packaging and temperature rating support ruggedized electronics requiring long-term reliability in challenging conditions.
Unique Advantages
- Radiation‑Resilient Architecture: Hardened registers and flash-based configuration protect against SEUs, reducing mission risk in radiation-prone environments.
- High Logic Capacity: 151,824 logic elements enable large-scale integration of signal processing, control and interface functions on a single device.
- Integrated High‑Speed I/O: Native 3.125 Gbps SerDes and support for DDR2/DDR3/LPDDR controllers simplify high-bandwidth data movement between onboard systems and external memory.
- Rugged Operating Envelope: Wide core voltage range (1.14–1.26 V) and operating temperatures from −55 °C to 125 °C support deployment in extreme environments.
- Surface-Mount, Heat‑Managed Package: 352-BFCQFP with exposed pad and tie bar offers a package form factor suitable for high-reliability surface-mount PCB assemblies.
- RoHS Compliance: Meets RoHS requirements for environmentally compliant designs.
Why Choose RT4G150-CQG352M?
The RT4G150-CQG352M combines a large, flash-based FPGA fabric with radiation-hardened design elements and high-speed interfaces to serve applications that demand both performance and resilience. Its mix of abundant logic resources, embedded memory and DSP capability, and SerDes/memory interfaces make it suitable for complex signal processing, telemetry and control tasks in harsh environments.
This device is positioned for engineers developing aerospace, military and other mission-critical systems who require a robust FPGA solution with explicit radiation-tolerance features, a wide operating temperature range and a surface-mount, heat-manageable package.
Request a quote or submit a sales inquiry for RT4G150-CQG352M to obtain pricing, availability and ordering information.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D