RT4G150-CQG352E
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar |
|---|---|
| Quantity | 498 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 44 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 352-QFP (48x48) | Grade | Extended | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 352-BFCQFP Exposed Pad and Tie Bar | Number of I/O | 166 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150-CQG352E – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar
The RT4G150-CQG352E is a flash-based RTG4™ FPGA from Microchip Technology designed for demanding, radiation-tolerant and extended-temperature applications. It integrates a hardened FPGA fabric with high-performance logic, embedded memory and high-speed serial interfaces to address space, aerospace, medical and nuclear-control use cases that require resilience and predictable performance.
Built on Microchip’s fourth-generation flash-based architecture, the device combines 151,824 logic elements with on-chip RAM and dedicated DSP resources, plus SerDes and memory-controller support, delivering a compact programmable platform for robust, high-reliability systems.
Key Features
- Flash-based FPGA fabric — Fourth-generation flash configuration technology providing nonvolatile configuration and architecture hardened against radiation-induced single-event upsets (SEUs) as described for the RTG4 family.
- Logic capacity — 151,824 logic elements (LUT4-based architecture) delivering substantial on-chip combinational and sequential resources for complex designs.
- On-chip memory & DSP — Total RAM bits: 5,325, plus embedded multiply-accumulate blocks and memory options to support DSP functions up to 300 MHz as specified for the RTG4 family.
- High-speed serial and memory interfaces — Native SerDes capability at 3.125 Gbps and support for double data rate memory controllers (DDR2/DDR3/LPDDR) per the RTG4 datasheet.
- I/O and packaging — 166 user I/O pins in a 352-BFCQFP exposed pad package with tie bar (supplier package: 352-QFP, 48 × 48 mm) optimized for surface-mount assembly.
- Power and operating range — Core voltage supply range 1.14 V to 1.26 V; operating temperature range –55 °C to 125 °C consistent with extended-grade deployment.
- Environmental compliance — RoHS compliant.
Typical Applications
- Space and satellite systems — Radiation-resistant design and hardened logic elements suitable for low-Earth to deep-space flight electronics where configuration integrity is critical.
- High-altitude aviation and avionics — Extended temperature range and hardened fabric make the device appropriate for avionics subsystems requiring robust programmable logic.
- Medical electronics — Programmable DSP blocks and reliable nonvolatile configuration support signal processing and control applications in medical systems operating in challenging environments.
- Nuclear power plant control — Hardened-by-design configuration and extended operating temperature support safety- and reliability-focused control electronics.
Unique Advantages
- Radiation-tolerant architecture: Hardened FPGA fabric and SEU-resistant registers provide configuration stability in high-radiation environments.
- High integration: Large logic capacity (151,824 logic elements), embedded RAM, DSP blocks and high-speed SerDes reduce external component count and simplify system design.
- Deterministic DSP performance: Embedded multiply-accumulate blocks and fabric timing specified up to 300 MHz support consistent signal-processing throughput.
- Extended operating range: –55 °C to 125 °C grade enables deployment in temperature-extreme and industrial/mission-critical environments.
- Compact, manufacturable package: 352-BFCQFP exposed pad with tie bar (352-QFP, 48 × 48 mm) supports surface-mount assembly and thermal management needs.
Why Choose RT4G150-CQG352E?
The RT4G150-CQG352E combines Microchip’s fourth‑generation flash-based FPGA fabric with hardened-by-design logic, embedded memory and high-speed interfaces to meet the reliability and performance demands of radiation-prone, temperature-extreme applications. Its substantial logic capacity and integrated DSP/SerDes features make it well suited to aerospace, avionics, medical and nuclear-control designs where long-term stability and predictable performance matter.
Designed for engineers who require a programmable, resilient platform, this RTG4 device delivers a balance of integration, fabric performance (up to 300 MHz in specified blocks) and environmental robustness, backed by Microchip’s documented RTG4 family specifications.
Request a quote or submit an availability inquiry to evaluate RT4G150-CQG352E for your next mission-critical or high-reliability design.

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