RT4G150-CQG352E

RT4G150-CQG352E
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar

Quantity 498 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time44 Weeks
Datasheet

Specifications & Environmental

Device Package352-QFP (48x48)GradeExtendedOperating Temperature-55°C – 125°C
Package / Case352-BFCQFP Exposed Pad and Tie BarNumber of I/O166Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-CQG352E – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar

The RT4G150-CQG352E is a flash-based RTG4™ FPGA from Microchip Technology designed for demanding, radiation-tolerant and extended-temperature applications. It integrates a hardened FPGA fabric with high-performance logic, embedded memory and high-speed serial interfaces to address space, aerospace, medical and nuclear-control use cases that require resilience and predictable performance.

Built on Microchip’s fourth-generation flash-based architecture, the device combines 151,824 logic elements with on-chip RAM and dedicated DSP resources, plus SerDes and memory-controller support, delivering a compact programmable platform for robust, high-reliability systems.

Key Features

  • Flash-based FPGA fabric — Fourth-generation flash configuration technology providing nonvolatile configuration and architecture hardened against radiation-induced single-event upsets (SEUs) as described for the RTG4 family.
  • Logic capacity — 151,824 logic elements (LUT4-based architecture) delivering substantial on-chip combinational and sequential resources for complex designs.
  • On-chip memory & DSP — Total RAM bits: 5,325, plus embedded multiply-accumulate blocks and memory options to support DSP functions up to 300 MHz as specified for the RTG4 family.
  • High-speed serial and memory interfaces — Native SerDes capability at 3.125 Gbps and support for double data rate memory controllers (DDR2/DDR3/LPDDR) per the RTG4 datasheet.
  • I/O and packaging — 166 user I/O pins in a 352-BFCQFP exposed pad package with tie bar (supplier package: 352-QFP, 48 × 48 mm) optimized for surface-mount assembly.
  • Power and operating range — Core voltage supply range 1.14 V to 1.26 V; operating temperature range –55 °C to 125 °C consistent with extended-grade deployment.
  • Environmental compliance — RoHS compliant.

Typical Applications

  • Space and satellite systems — Radiation-resistant design and hardened logic elements suitable for low-Earth to deep-space flight electronics where configuration integrity is critical.
  • High-altitude aviation and avionics — Extended temperature range and hardened fabric make the device appropriate for avionics subsystems requiring robust programmable logic.
  • Medical electronics — Programmable DSP blocks and reliable nonvolatile configuration support signal processing and control applications in medical systems operating in challenging environments.
  • Nuclear power plant control — Hardened-by-design configuration and extended operating temperature support safety- and reliability-focused control electronics.

Unique Advantages

  • Radiation-tolerant architecture: Hardened FPGA fabric and SEU-resistant registers provide configuration stability in high-radiation environments.
  • High integration: Large logic capacity (151,824 logic elements), embedded RAM, DSP blocks and high-speed SerDes reduce external component count and simplify system design.
  • Deterministic DSP performance: Embedded multiply-accumulate blocks and fabric timing specified up to 300 MHz support consistent signal-processing throughput.
  • Extended operating range: –55 °C to 125 °C grade enables deployment in temperature-extreme and industrial/mission-critical environments.
  • Compact, manufacturable package: 352-BFCQFP exposed pad with tie bar (352-QFP, 48 × 48 mm) supports surface-mount assembly and thermal management needs.

Why Choose RT4G150-CQG352E?

The RT4G150-CQG352E combines Microchip’s fourth‑generation flash-based FPGA fabric with hardened-by-design logic, embedded memory and high-speed interfaces to meet the reliability and performance demands of radiation-prone, temperature-extreme applications. Its substantial logic capacity and integrated DSP/SerDes features make it well suited to aerospace, avionics, medical and nuclear-control designs where long-term stability and predictable performance matter.

Designed for engineers who require a programmable, resilient platform, this RTG4 device delivers a balance of integration, fabric performance (up to 300 MHz in specified blocks) and environmental robustness, backed by Microchip’s documented RTG4 family specifications.

Request a quote or submit an availability inquiry to evaluate RT4G150-CQG352E for your next mission-critical or high-reliability design.

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