RT4G150-CQG352V
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar |
|---|---|
| Quantity | 661 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 352-QFP (48x48) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 352-BFCQFP Exposed Pad and Tie Bar | Number of I/O | 166 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150-CQG352V – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar
The RT4G150-CQG352V is a flash-based RTG4™ Field Programmable Gate Array (FPGA) optimized for demanding, radiation-prone environments. It combines a hardened FPGA fabric with high-performance interfaces and embedded DSP/memory resources to support applications that require resistance to radiation-induced configuration upsets.
Designed for use in markets such as space flight (LEO, MEO, GEO, HEO, deep space), high-altitude aviation, medical electronics and nuclear power plant control, the device delivers a balance of logic capacity, I/O density and interface performance for complex embedded designs.
Key Features
- High Logic Capacity — 151,824 logic elements to implement large-scale digital logic, state machines and control systems.
- Radiation-Hardened Architecture — Fabric hardened by design against single-event upsets (SEUs), suitable for radiation-prone environments described in the product documentation.
- LUT and Fast Carry Chains — Each logic element includes a 4-input LookUp Table (LUT4) with fast carry chains to support efficient arithmetic and combinational logic.
- Embedded Memory and DSP — Multiple embedded memory options and multiply-accumulate blocks for DSP workloads, with fabric and DSP timing targets up to 300 MHz.
- High-Speed Serial Interface — Native SerDes capability at 3.125 Gbps for high-speed serial communication.
- I/O and Package — 166 user I/Os delivered in a 352-BFCQFP exposed pad and tie bar package (352-QFP, 48 × 48 mm), surface-mount mounting.
- Operating Range and Power — Nominal voltage supply range of 1.14 V to 1.26 V and operating temperature from −55 °C to 125 °C to meet stringent thermal requirements.
- Grade — Military grade device classification as listed in the product data.
- RoHS Compliant — Device is RoHS compliant.
Typical Applications
- Space Systems — Flight electronics and payload processing where radiation resistance and on-chip DSP are required for satellite and deep-space instruments.
- High-Altitude Aviation — Avionics and airborne signal processing that benefit from hardened configuration memory and wide operating temperature range.
- Medical Electronics — Equipment requiring reliable digital processing and robust uptime in environments where radiation hardening is relevant.
- Nuclear Power Plant Control — Control logic and monitoring systems that demand tolerance to radiation-induced upsets and extended temperature range operation.
Unique Advantages
- Radiation-Resistant Design: Fabric hardened against single-event upsets to preserve configuration integrity in radiation-prone environments.
- Substantial Logic Resources: 151,824 logic elements provide room for complex control algorithms, large state machines and signal-processing pipelines.
- Balanced Performance: FPGA fabric and DSP blocks specified for operation up to 300 MHz, enabling deterministic logic and DSP timing.
- High-Speed Connectivity: Integrated 3.125 Gbps SerDes enables high-bandwidth serial links without external SerDes components.
- Robust Thermal and Voltage Range: Operates from −55 °C to 125 °C with a 1.14 V–1.26 V supply range, supporting harsh-environment deployments.
- Dense, SMT-Friendly Package: 352-BFCQFP exposed pad and tie bar (48 × 48 mm) provides high I/O count (166) in a surface-mount form factor.
Why Choose RT4G150-CQG352V?
The RT4G150-CQG352V positions itself as a solution for embedded designs that must combine large FPGA logic capacity with radiation tolerance and reliable high-speed interfaces. Its hardened fabric, substantial logic resources and integrated DSP/memory elements make it suitable for aerospace, avionics, medical and nuclear-control applications that need deterministic performance and robust operation across a wide temperature range.
Engineers designing systems for radiation-prone or temperature-extreme environments will find the RT4G150-CQG352V useful when they require high logic density, a native SerDes option and military-grade qualification stated in the product data.
Request a quote or submit a purchase inquiry to receive pricing and availability for the RT4G150-CQG352V.

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