RT4G150-CQG352V

RT4G150-CQG352V
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar

Quantity 661 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package352-QFP (48x48)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case352-BFCQFP Exposed Pad and Tie BarNumber of I/O166Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-CQG352V – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 352-BFCQFP Exposed Pad and Tie Bar

The RT4G150-CQG352V is a flash-based RTG4™ Field Programmable Gate Array (FPGA) optimized for demanding, radiation-prone environments. It combines a hardened FPGA fabric with high-performance interfaces and embedded DSP/memory resources to support applications that require resistance to radiation-induced configuration upsets.

Designed for use in markets such as space flight (LEO, MEO, GEO, HEO, deep space), high-altitude aviation, medical electronics and nuclear power plant control, the device delivers a balance of logic capacity, I/O density and interface performance for complex embedded designs.

Key Features

  • High Logic Capacity — 151,824 logic elements to implement large-scale digital logic, state machines and control systems.
  • Radiation-Hardened Architecture — Fabric hardened by design against single-event upsets (SEUs), suitable for radiation-prone environments described in the product documentation.
  • LUT and Fast Carry Chains — Each logic element includes a 4-input LookUp Table (LUT4) with fast carry chains to support efficient arithmetic and combinational logic.
  • Embedded Memory and DSP — Multiple embedded memory options and multiply-accumulate blocks for DSP workloads, with fabric and DSP timing targets up to 300 MHz.
  • High-Speed Serial Interface — Native SerDes capability at 3.125 Gbps for high-speed serial communication.
  • I/O and Package — 166 user I/Os delivered in a 352-BFCQFP exposed pad and tie bar package (352-QFP, 48 × 48 mm), surface-mount mounting.
  • Operating Range and Power — Nominal voltage supply range of 1.14 V to 1.26 V and operating temperature from −55 °C to 125 °C to meet stringent thermal requirements.
  • Grade — Military grade device classification as listed in the product data.
  • RoHS Compliant — Device is RoHS compliant.

Typical Applications

  • Space Systems — Flight electronics and payload processing where radiation resistance and on-chip DSP are required for satellite and deep-space instruments.
  • High-Altitude Aviation — Avionics and airborne signal processing that benefit from hardened configuration memory and wide operating temperature range.
  • Medical Electronics — Equipment requiring reliable digital processing and robust uptime in environments where radiation hardening is relevant.
  • Nuclear Power Plant Control — Control logic and monitoring systems that demand tolerance to radiation-induced upsets and extended temperature range operation.

Unique Advantages

  • Radiation-Resistant Design: Fabric hardened against single-event upsets to preserve configuration integrity in radiation-prone environments.
  • Substantial Logic Resources: 151,824 logic elements provide room for complex control algorithms, large state machines and signal-processing pipelines.
  • Balanced Performance: FPGA fabric and DSP blocks specified for operation up to 300 MHz, enabling deterministic logic and DSP timing.
  • High-Speed Connectivity: Integrated 3.125 Gbps SerDes enables high-bandwidth serial links without external SerDes components.
  • Robust Thermal and Voltage Range: Operates from −55 °C to 125 °C with a 1.14 V–1.26 V supply range, supporting harsh-environment deployments.
  • Dense, SMT-Friendly Package: 352-BFCQFP exposed pad and tie bar (48 × 48 mm) provides high I/O count (166) in a surface-mount form factor.

Why Choose RT4G150-CQG352V?

The RT4G150-CQG352V positions itself as a solution for embedded designs that must combine large FPGA logic capacity with radiation tolerance and reliable high-speed interfaces. Its hardened fabric, substantial logic resources and integrated DSP/memory elements make it suitable for aerospace, avionics, medical and nuclear-control applications that need deterministic performance and robust operation across a wide temperature range.

Engineers designing systems for radiation-prone or temperature-extreme environments will find the RT4G150-CQG352V useful when they require high logic density, a native SerDes option and military-grade qualification stated in the product data.

Request a quote or submit a purchase inquiry to receive pricing and availability for the RT4G150-CQG352V.

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