RT4G150-LGG1657PROTO
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA |
|---|---|
| Quantity | 680 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 36 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1657-CLGA (42.5x42.5) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1657-BCLGA | Number of I/O | 720 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150-LGG1657PROTO – RTG4™ Field Programmable Gate Array (FPGA) 151,824 logic elements
The RT4G150-LGG1657PROTO is a high-reliability RTG4™ flash-based FPGA designed for applications that demand radiation tolerance and deterministic FPGA fabric. This device integrates Microchip’s fourth-generation FPGA architecture with hardened logic and high-performance interfaces to support mission-critical systems in harsh environments.
Key attributes include 151,824 logic elements, a 720-pin I/O capacity, a low-voltage supply range (1.14 V to 1.26 V), and military-grade operating temperature specifications (−55 °C to 125 °C), all delivered in a 1657-BCLGA surface-mount package (1657-CLGA, 42.5×42.5 mm).
Key Features
- Hardened FPGA Fabric — Registers and logic are hardened by design against radiation-induced single-event upsets (SEUs) to support operation in high-radiation environments.
- Large Logic Capacity — 151,824 logic elements provide substantial on-chip programmable resources for complex system logic and control.
- On-Chip Memory — Total on-chip RAM of 5,325 bits to support embedded buffering and state storage.
- I/O Density — 720 I/O pins to accommodate rich external interfacing and multi-channel system I/O requirements.
- High-Performance Interfaces — Built-in high-speed serial and memory interface support as described in the RTG4 family datasheet, including SerDes and DDR memory controller capabilities.
- Power and Temperature — Operates from 1.14 V to 1.26 V and across a military temperature range of −55 °C to 125 °C for robust field use.
- Package and Mounting — 1657-BCLGA package (1657-CLGA, 42.5×42.5 mm) in a surface-mount form factor for board-level integration.
- RoHS Compliant — Meets RoHS environmental requirements for restricted substances.
Typical Applications
- Space and Aerospace Systems — Radiation-hardened logic and hardened registers make the device suitable for flight electronics and payload processing in high-radiation environments.
- High-Altitude and Avionics Electronics — Military-grade temperature range and SEU-hardened fabric support avionics control, sensor processing, and telemetry functions.
- Medical and Nuclear Control Systems — Deterministic logic and robust operating conditions enable reliable control and monitoring in safety-critical installations.
Unique Advantages
- Radiation Tolerance: Hardened-by-design registers and configuration memory reduce susceptibility to SEUs, increasing system reliability in radiation-prone environments.
- High Logic Density: 151,824 logic elements allow consolidation of complex functions into a single FPGA, reducing system BOM and interconnect complexity.
- Extensive I/O Support: 720 I/O pins provide flexibility for multi-channel interfaces and dense peripheral connectivity.
- Wide Operating Range: Low-voltage operation (1.14–1.26 V) combined with −55 °C to 125 °C qualification enables deployment across a wide range of thermal and power-constrained applications.
- Surface-Mount, High-Performance Package: 1657-BCLGA (42.5×42.5 mm) package supports compact board layouts while providing high pin-count accessibility.
- Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.
Why Choose RT4G150-LGG1657PROTO?
The RT4G150-LGG1657PROTO positions itself as a robust, highly integrated FPGA solution where radiation tolerance, logic capacity, and thermal resilience are required. With 151,824 logic elements, hardened registers, extensive I/O, and on-chip memory, this device is suited for engineers designing mission-critical systems in aerospace, avionics, medical, and nuclear environments.
Designed for long-term deployment, the RT4G150-LGG1657PROTO combines Microchip’s RTG4 architecture with military-grade operating specifications and RoHS compliance to deliver a dependable, scalable platform backed by comprehensive technical documentation.
Request a quote or submit an inquiry today to check pricing and availability for RT4G150-LGG1657PROTO and to discuss how it fits your design requirements.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D