RT4G150-LGG1657M

RT4G150-LGG1657M
Part Description

RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA

Quantity 738 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time32 Weeks
Datasheet

Specifications & Environmental

Device Package1657-CLGA (42.5x42.5)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case1657-BCLGANumber of I/O720Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity LevelN/ANumber of LABs/CLBs151824Number of Logic Elements/Cells151824
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits5325

Overview of RT4G150-LGG1657M – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA

The RT4G150-LGG1657M is a member of Microchip's RTG4™ family — a flash-based FPGA architecture designed for high-performance, radiation-tolerant applications. It integrates a dense FPGA fabric with hardened logic, high-speed serial interfaces and memory/memory-controller options for demanding embedded designs.

This device is targeted at systems requiring radiation resistance and extended environmental range. Key on-chip resources include 151,824 logic elements, approximately 5,325 bits of embedded memory, up to 720 user I/O pins, and support for high-speed SerDes and memory interfaces. The device is qualified to military-grade temperature and mechanical requirements and is supplied in a 1657-BCLGA surface-mount package.

Key Features

  • Core FPGA Fabric: 151,824 logic elements with 4-input LUT-based logic and fast carry chains; fabric performance cited up to 300 MHz in RTG4 documentation.
  • Embedded Memory and DSP: Approximately 5,325 bits of on-chip RAM and embedded multiply-accumulate resources supporting DSP operation up to 300 MHz as described in the RTG4 datasheet.
  • High-Speed Interfaces: Native SerDes capability at 3.125 Gbps and on-chip DDR2/DDR3/LPDDR memory controller support for high-bandwidth system interfaces.
  • I/O Density: Up to 720 user I/O pins for complex system interconnect and high pin-count designs.
  • Radiation Tolerance and Reliability: Flash-based configuration with design-hardened registers to resist radiation-induced single-event upsets (SEUs), suitable for space, high-altitude aviation, medical and nuclear applications as described in the RTG4 family documentation.
  • Power and Supply: Core supply voltage range 1.14 V to 1.26 V to match RTG4 recommended operating conditions.
  • Package and Mounting: 1657-BCLGA package (supplier package 1657-CLGA, 42.5 × 42.5 mm) in a surface-mount form factor.
  • Extended Temperature Range: Military-grade operating range from −55 °C to 125 °C for harsh-environment deployments.

Typical Applications

  • Space Systems: FPGA fabric hardened by design and radiation-resistant configuration make the device suitable for Low-Earth Orbit, GEO/HEO and deep-space electronics as referenced in the RTG4 family materials.
  • Avionics & High-Altitude Platforms: Extended temperature and radiation tolerance support use in high-altitude aviation and related flight electronics.
  • Medical Electronics: Use in medical systems where radiation resilience and reliable, deterministic logic and DSP functions are required.
  • Nuclear & Power-Plant Control: Designed-in radiation robustness and military-grade temperature specification support control and monitoring systems in nuclear environments.
  • High-Speed Communication Systems: Native 3.125 Gbps SerDes and high I/O count enable high-throughput serial links and memory interface implementations.

Unique Advantages

  • Highly integrated FPGA fabric: Large logic element count and embedded DSP/memory resources reduce the need for separate processors or accelerators in complex signal-processing applications.
  • Radiation-hardened by design: Registers and configuration memory are designed to resist single-event upsets, reducing mitigation overhead in radiation-prone environments.
  • Robust environmental qualification: Military-grade operating temperature and surface-mount 1657-BCLGA packaging support deployment in harsh thermal and mechanical conditions.
  • Broad interface support: High I/O density and native high-speed SerDes plus DDR2/DDR3/LPDDR controller support simplify high-bandwidth system design.
  • Deterministic DSP capability: Embedded multiply-accumulate blocks and DSP-capable fabric operating to the frequency ranges specified in the RTG4 documentation enable real-time signal processing.

Why Choose RT4G150-LGG1657M?

The RT4G150-LGG1657M combines a high logic-element count, targeted DSP resources and extensive I/O with a flash-based, radiation-tolerant FPGA architecture. These combined attributes position the device for demanding embedded systems that require both processing capability and resilience in harsh environments.

Designers seeking a platform with documented radiation resistance, high-speed serial and memory interface options, and a comprehensive set of technical briefs and pin descriptions available in the RTG4 family documentation will find the RT4G150-LGG1657M suitable for long-term, mission-critical deployments.

Request a quote or submit an inquiry to begin procurement and evaluate RT4G150-LGG1657M for your next high-reliability FPGA design.

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