RT4G150-LGG1657M
| Part Description |
RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA |
|---|---|
| Quantity | 738 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 32 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1657-CLGA (42.5x42.5) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1657-BCLGA | Number of I/O | 720 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 151824 | Number of Logic Elements/Cells | 151824 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 5325 |
Overview of RT4G150-LGG1657M – RTG4™ Field Programmable Gate Array (FPGA) IC 5325 151824 1657-BCLGA
The RT4G150-LGG1657M is a member of Microchip's RTG4™ family — a flash-based FPGA architecture designed for high-performance, radiation-tolerant applications. It integrates a dense FPGA fabric with hardened logic, high-speed serial interfaces and memory/memory-controller options for demanding embedded designs.
This device is targeted at systems requiring radiation resistance and extended environmental range. Key on-chip resources include 151,824 logic elements, approximately 5,325 bits of embedded memory, up to 720 user I/O pins, and support for high-speed SerDes and memory interfaces. The device is qualified to military-grade temperature and mechanical requirements and is supplied in a 1657-BCLGA surface-mount package.
Key Features
- Core FPGA Fabric: 151,824 logic elements with 4-input LUT-based logic and fast carry chains; fabric performance cited up to 300 MHz in RTG4 documentation.
- Embedded Memory and DSP: Approximately 5,325 bits of on-chip RAM and embedded multiply-accumulate resources supporting DSP operation up to 300 MHz as described in the RTG4 datasheet.
- High-Speed Interfaces: Native SerDes capability at 3.125 Gbps and on-chip DDR2/DDR3/LPDDR memory controller support for high-bandwidth system interfaces.
- I/O Density: Up to 720 user I/O pins for complex system interconnect and high pin-count designs.
- Radiation Tolerance and Reliability: Flash-based configuration with design-hardened registers to resist radiation-induced single-event upsets (SEUs), suitable for space, high-altitude aviation, medical and nuclear applications as described in the RTG4 family documentation.
- Power and Supply: Core supply voltage range 1.14 V to 1.26 V to match RTG4 recommended operating conditions.
- Package and Mounting: 1657-BCLGA package (supplier package 1657-CLGA, 42.5 × 42.5 mm) in a surface-mount form factor.
- Extended Temperature Range: Military-grade operating range from −55 °C to 125 °C for harsh-environment deployments.
Typical Applications
- Space Systems: FPGA fabric hardened by design and radiation-resistant configuration make the device suitable for Low-Earth Orbit, GEO/HEO and deep-space electronics as referenced in the RTG4 family materials.
- Avionics & High-Altitude Platforms: Extended temperature and radiation tolerance support use in high-altitude aviation and related flight electronics.
- Medical Electronics: Use in medical systems where radiation resilience and reliable, deterministic logic and DSP functions are required.
- Nuclear & Power-Plant Control: Designed-in radiation robustness and military-grade temperature specification support control and monitoring systems in nuclear environments.
- High-Speed Communication Systems: Native 3.125 Gbps SerDes and high I/O count enable high-throughput serial links and memory interface implementations.
Unique Advantages
- Highly integrated FPGA fabric: Large logic element count and embedded DSP/memory resources reduce the need for separate processors or accelerators in complex signal-processing applications.
- Radiation-hardened by design: Registers and configuration memory are designed to resist single-event upsets, reducing mitigation overhead in radiation-prone environments.
- Robust environmental qualification: Military-grade operating temperature and surface-mount 1657-BCLGA packaging support deployment in harsh thermal and mechanical conditions.
- Broad interface support: High I/O density and native high-speed SerDes plus DDR2/DDR3/LPDDR controller support simplify high-bandwidth system design.
- Deterministic DSP capability: Embedded multiply-accumulate blocks and DSP-capable fabric operating to the frequency ranges specified in the RTG4 documentation enable real-time signal processing.
Why Choose RT4G150-LGG1657M?
The RT4G150-LGG1657M combines a high logic-element count, targeted DSP resources and extensive I/O with a flash-based, radiation-tolerant FPGA architecture. These combined attributes position the device for demanding embedded systems that require both processing capability and resilience in harsh environments.
Designers seeking a platform with documented radiation resistance, high-speed serial and memory interface options, and a comprehensive set of technical briefs and pin descriptions available in the RTG4 family documentation will find the RT4G150-LGG1657M suitable for long-term, mission-critical deployments.
Request a quote or submit an inquiry to begin procurement and evaluate RT4G150-LGG1657M for your next high-reliability FPGA design.

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